看到了一个Zynq基本系统

从网站公布信息来看，Linux等OS需要在Q3，保守点应该在Q4会比较完备。

Xilinx Zynq-7000 Embedded Processing Module	IN BETA PHASE

Apply for the Mars ZX3 Beta Program! By applying for the Mars ZX3 Beta Program, you may get the chance to be among the very first customers to receive Mars ZX3 EP module hardware. A limited number of Mars ZX3 Beta modules (MA-ZX3-20-1CES) are expected to be available for Beta Program members in September 2012. Fill in and submit the Mars ZX3 Beta Program Application Form today!
Overview The Mars ZX3 embedded processing module combines Xilinx’ Zynq-7000 EPP device with fast DDR3 SDRAM, NAND flash, quad SPI flash, a Gigabit Ethernet PHY and an RTC and thus forms a complete and powerful embedded processing system. The SO-DIMM form factor allows space-saving hardware designs as well as quick and simple integration of the module into the target application. The Mars ZX3 Embedded Processing module reduces development effort, redesign risk and improves time-to-market for your embedded system.		Highlights Built around Xilinx’ Zynq-7000 Extensible Processing Platform Combines the flexibility of a CPU system with the parallel processing power and real-time capabilities of an FPGA system Supports analog differential inputs Available in the industrial temperature range Supports USB 2.0 OTG, CAN and Gigabit Ethernet Linux BSP and tool chain available
Benefits A complete and powerful embedded processing system in the industry-standard SO-DIMM form factor Simple, low cost and yet rugged assembly Simple and low-cost integration thanks to the on-board standard interfaces (USB, Ethernet, CAN) Fast boot times and plenty of non-volatile memory space thanks to the NAND flash High-bandwidth program and data memory thanks to the high-performance hard-macro memory controller Lowest power consumption thanks to the high-efficiency DC/DC converters		Features Xilinx Zynq-7000 EPP in the CLG484 package (XC7Z020) ARM dual-core Cortex-A9 Artix-7 28nm FPGA fabric SO-DIMM form factor (68 x 30 mm, 200 pins) 108 user I/Os ARM peripherals (SPI, SDIO, CAN, I2C, UART) FPGA I/Os (single-ended, differential or analog) Gigabit Ethernet and USB 2.0 OTG PHYs Up to 1 GB DDR3 SDRAM Up to 64 GB NAND flash Single 3.3V supply voltage
Module Architecture Click image to enlarge
Product Selection Matrix Click image to enlarge
Minimum order quantities do apply for custom module configurations. Please contactus.
Pricing Click image to enlarge
Preliminary pricing for 1.7.2013.
Operating System Support OS Description Partner   Available in Q3 2012 Linux 3.3 BSP support for DDR3 SDRAM, NAND Flash, Quad SPI Flash, USB Host and Gigabit Ethernet U-boot bootloader Software design services byNoser Engineering   Available in Q4 2012 Android 4.04 BSP support for DDR3 SDRAM, NAND Flash, Quad SPI Flash, USB Host and Gigabit Ethernet U-boot bootloader Support for capacitive touch embedded displays Software design services byNoser Engineering   Available in Q3 2012 VxWorks 6.9 BSP support for DDR3 SDRAM, Quad SPI Flash, UART and Gigabit Ethernet Software design services byNetModule   Available in Q4 2012 eCos 3.0 BSP support for DDR3 SDRAM, Quad SPI Flash, UART and Gigabit Ethernet Software design services byAntMicro
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