计算机术语大全

原创 2005年05月29日 23:37:00
1、CPU
3DNow!(3D no waiting,无须等待的3D处理)
AAM(AMD Analyst Meeting,AMD分析家会议)
ABP(Advanced Branch Prediction,高级分支预测)
ACG(Aggressive Clock Gating,主动时钟选择)
AIS(Alternate Instruction Set,交替指令集)
ALAT(advanced load table,高级载入表)
ALU(Arithmetic Logic Unit,算术逻辑单元)
Aluminum(铝)
AGU(Address Generation Units,地址产成单元)
APC(Advanced Power Control,高级能源控制)
APIC(Advanced rogrammable Interrupt Controller,高级可编程中断控制器)
APS(Alternate Phase Shifting,交替相位跳转)
ASB(Advanced System Buffering,高级系统缓冲)
ATC(Advanced Transfer Cache,高级转移缓存)
ATD(Assembly Technology Development,装配技术发展)
BBUL(Bumpless Build-Up Layer,内建非凹凸层)
BGA(Ball Grid Array,球状网阵排列)
BHT(branch prediction table,分支预测表)
Bops(Billion Operations Per Second,10亿操作/秒)
BPU(Branch Processing Unit,分支处理单元)
BP(Brach Pediction,分支预测)
BSP(Boot Strap Processor,启动捆绑处理器)
BTAC(Branch Target Address Calculator,分支目标寻址计算器)
CBGA (Ceramic Ball Grid Array,陶瓷球状网阵排列)
CDIP (Ceramic Dual-In-Line,陶瓷双重直线)
Center Processing Unit Utilization,中央处理器占用率
CFM(cubic feet per minute,立方英尺/秒)
CMT(course-grained multithreading,过程消除多线程)
CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)
CMOV(conditional move instruction,条件移动指令)
CISC(Complex Instruction Set Computing,复杂指令集计算机)
CLK(Clock Cycle,时钟周期)
CMP(on-chip multiprocessor,片内多重处理)
CMS(Code Morphing Software,代码变形软件)
co-CPU(cooperative CPU,协处理器)
COB(Cache on board,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度))
COD(Cache on Die,芯片内核集成缓存)
Copper(铜)
CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
CPI(cycles per instruction,周期/指令)
CPLD(Complex Programmable Logic Device,複雜可程式化邏輯元件)
CPU(Center Processing Unit,中央处理器)
CRT(Cooperative Redundant Threads,协同多余线程)
CSP(Chip Scale Package,芯片比例封装)
CXT(Chooper eXTend,增强形K6-2内核,即K6-3)
Data Forwarding(数据前送)
dB(decibel,分贝)
DCLK(Dot Clock,点时钟)
DCT(DRAM Controller,DRAM控制器)
DDT(Dynamic Deferred Transaction,动态延期处理)
Decode(指令解码)
DIB(Dual Independent Bus,双重独立总线)
DMT(Dynamic Multithreading Architecture,动态多线程结构)
DP(Dual Processor,双处理器)
DSM(Dedicated Stack Manager,专门堆栈管理)
DSMT(Dynamic Simultaneous Multithreading,动态同步多线程)
DST(Depleted Substrate Transistor,衰竭型底层晶体管)
DTV(Dual Threshold Voltage,双重极限电压)
DUV(Deep Ultra-Violet,纵深紫外光)
EBGA(Enhanced Ball Grid Array,增强形球状网阵排列)
EBL(electron beam lithography,电子束平版印刷)
EC(Embedded Controller,嵌入式控制器)
EDEC(Early Decode,早期解码)
Embedded Chips(嵌入式)
EPA(edge pin array,边缘针脚阵列)
EPF(Embedded Processor Forum,嵌入式处理器论坛)
EPL(electron projection lithography,电子发射平版印刷)
EPM(Enhanced Power Management,增强形能源管理)
EPIC(explicitly parallel instruction code,并行指令代码)
EUV(Extreme Ultra Violet,紫外光)
EUV(extreme ultraviolet lithography,极端紫外平版印刷)
FADD(Floationg Point Addition,浮点加)
FBGA(Fine-Pitch Ball Grid Array,精细倾斜球状网阵排列)
FBGA(flipchip BGA,轻型芯片BGA)
FC-BGA(Flip-Chip Ball Grid Array,反转芯片球形栅格阵列)
FC-PGA(Flip-Chip Pin Grid Array,反转芯片针脚栅格阵列)
FDIV(Floationg Point Divide,浮点除)
FEMMS:Fast Entry/Exit Multimedia State,快速进入/退出多媒体状态
FFT(fast Fourier transform,快速热欧姆转换)
FGM(Fine-Grained Multithreading,高级多线程)
FID(FID:Frequency identify,频率鉴别号码)
FIFO(First Input First Output,先入先出队列)
FISC(Fast Instruction Set Computer,快速指令集计算机)
flip-chip(芯片反转)
FLOPs(Floating Point Operations Per Second,浮点操作/秒)
FMT(fine-grained multithreading,纯消除多线程)
FMUL(Floationg Point Multiplication,浮点乘)
FPRs(floating-point registers,浮点寄存器)
FPU(Float Point Unit,浮点运算单元)
FSUB(Floationg Point Subtraction,浮点减)
GFD(Gold finger Device,金手指超频设备)
GHC(Global History Counter,通用历史计数器)
GTL(Gunning Transceiver Logic,射电收发逻辑电路)
GVPP(Generic Visual Perception Processor,常规视觉处理器)
HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状网阵封装
HTT(Hyper-Threading Technology,超级线程技术)
Hz(hertz,赫兹,频率单位)
IA(Intel Architecture,英特尔架构)
IAA(Intel Application Accelerator,英特尔应用程序加速器)
ICU(Instruction Control Unit,指令控制单元)
ID(identify,鉴别号码)
IDF(Intel Developer Forum,英特尔开发者论坛)
IEU(Integer Execution Units,整数执行单元)
IHS(Integrated Heat Spreader,完整热量扩展)
ILP(Instruction Level Parallelism,指令级平行运算)
IMM: Intel Mobile Module, 英特尔移动模块
Instructions Cache,指令缓存
Instruction Coloring(指令分类)
IOPs(Integer Operations Per Second,整数操作/秒)
IPC(Instructions Per Clock Cycle,指令/时钟周期)
ISA(instruction set architecture,指令集架构)
ISD(inbuilt speed-throttling device,内藏速度控制设备)
ITC(Instruction Trace Cache,指令追踪缓存)
ITRS(International Technology Roadmap for Semiconductors,国际半导体技术发展蓝图)
KNI(Katmai New Instructions,Katmai新指令集,即SSE)
Latency(潜伏期)
LDT(Lightning Data Transport,闪电数据传输总线)
LFU(Legacy Function Unit,传统功能单元)
LGA(land grid array,接点栅格阵列)
LN2(Liquid Nitrogen,液氮)
Local Interconnect(局域互连)
MAC(multiply-accumulate,累积乘法)
mBGA (Micro Ball Grid Array,微型球状网阵排列)
nm(namometer,十亿分之一米/毫微米)
MCA(machine check architecture,机器检查体系)
MCU(Micro-Controller Unit,微控制器单元)
MCT(Memory Controller,内存控制器)
MESI(Modified, Exclusive, Shared, Invalid:修改、排除、共享、废弃)
MF(MicroOps Fusion,微指令合并)
mm(micron metric,微米)
MMX(MultiMedia Extensions,多媒体扩展指令集)
MMU(Multimedia Unit,多媒体单元)
MMU(Memory Management Unit,内存管理单元)
MN(model numbers,型号数字)
MFLOPS(Million Floationg Point/Second,每秒百万个浮点操作)
MHz(megahertz,兆赫)
mil(PCB 或晶片佈局的長度單位,1 mil = 千分之一英寸)
MIPS(Million Instruction Per Second,百万条指令/秒)
MOESI(Modified, Owned, Exclusive, Shared or Invalid,修改、自有、排除、共享或无效)
MOF(Micro Ops Fusion,微操作熔合)
Mops(Million Operations Per Second,百万次操作/秒)
MP(Multi-Processing,多重处理器架构)
MPF(Micro processor Forum,微处理器论坛)
MPU(Microprocessor Unit,微处理器)
MPS(MultiProcessor Specification,多重处理器规范)
MSRs(Model-Specific Registers,特别模块寄存器)
MSV(Multiprocessor Specification Version,多处理器规范版本)
NAOC(no-account OverClock,无效超频)
NI(Non-Intel,非英特尔)
NOP(no operation,非操作指令)
NRE(Non-Recurring Engineering charge,非重複性工程費用)
OBGA(Organic Ball Grid Arral,有机球状网阵排列)
OCPL(Off Center Parting Line,远离中心部分线队列)
OLGA(Organic Land Grid Array,有机平面网阵包装)
OoO(Out of Order,乱序执行)
OPC(Optical Proximity Correction,光学临近修正)
OPGA(Organic Pin Grid Array,有机塑料针型栅格阵列)
OPN(Ordering Part Number,分类零件号码)
PAT(Performance Acceleration Technology,性能加速技术)
PBGA(Plastic Pin Ball Grid Array,塑胶球状网阵排列)
PDIP (Plastic Dual-In-Line,塑料双重直线)
PDP(Parallel Data Processing,并行数据处理)
PGA(Pin-Grid Array,引脚网格阵列),耗电大
PLCC (Plastic Leaded Chip Carriers,塑料行间芯片运载)
Post-RISC(加速RISC,或后RISC)
PR(Performance Rate,性能比率)
PIB(Processor In a Box,盒装处理器)
PM(Pseudo-Multithreading,假多线程)
PPGA(Plastic Pin Grid Array,塑胶针状网阵封装)
PQFP(Plastic Quad Flat Package,塑料方块平面封装)
PSN(Processor Serial numbers,处理器序列号)
QFP(Quad Flat Package,方块平面封装)
QSPS(Quick Start Power State,快速启动能源状态)
RAS(Return Address Stack,返回地址堆栈)
RAW(Read after Write,写后读)
REE(Rapid Execution Engine,快速执行引擎)
Register Contention(抢占寄存器)
Register Pressure(寄存器不足)
Register Renaming(寄存器重命名)
Remark(芯片频率重标识)
Resource contention(资源冲突)
Retirement(指令引退)
RISC(Reduced Instruction Set Computing,精简指令集计算机)
ROB(Re-Order Buffer,重排序缓冲区)
RSE(register stack engine,寄存器堆栈引擎)
RTL(Register Transfer Level,暫存器轉換層。硬體描述語言的一種描述層次)
SC242(242-contact slot connector,242脚金手指插槽连接器)
SE(Special Embedded,特别嵌入式)
SEC(Single Edge Connector,单边连接器)
SECC(Single Edge Contact Cartridge,单边接触卡盒)
SEPP(Single Edge Processor Package,单边处理器封装)
Shallow-trench isolation(浅槽隔离)
SIMD(Single Instruction Multiple Data,单指令多数据流)
SiO2F(Fluorided Silicon Oxide,二氧氟化硅)
SMI(System Management Interrupt,系统管理中断)
SMM(System Management Mode,系统管理模式)
SMP(Symmetric Multi-Processing,对称式多重处理架构)
SMT(Simultaneous multithreading,同步多线程)
SOI(Silicon-on-insulator,绝缘体硅片)
SOIC (Plastic Small Outline,塑料小型)
SONC(System on a chip,系统集成芯片)
SPGA(Staggered Pin Grid Array、交错式针状网阵封装)
SPEC(System Performance Evaluation Corporation,系统性能评估测试)
SQRT(Square Root Calculations,平方根计算)
SRQ(System Request Queue,系统请求队列)
SSE(Streaming SIMD Extensions,单一指令多数据流扩展)
SFF(Small Form Factor,更小外形格局)
SS(Special Sizing,特殊缩放)
SSP(Slipstream processing,滑流处理)
SST(Special Sizing Techniques,特殊筛分技术)
SSOP (Shrink Plastic Small Outline,缩短塑料小型)
STC(Space Time Computing,空余时间计算)
Superscalar(超标量体系结构)
TAP(Test Access Port,测试存取端口)
TBGA(Tie Ball Grid Array,带状球形光栅阵列)
TCP: Tape Carrier Package(薄膜封装),发热小
TDP(Thermal Design Power,热量设计功率)
Throughput(吞吐量)
TLB(Translate Look side Buffers,转换旁视缓冲器)
TLP(Thread-Level Parallelism,线程级并行)
TMP(Threaded Multi-Path,线程多通道)
TPI(True Performance Initiative/index,真实性能为先/指标)
TQFP (Thin Plastic Quad Flat Pack,薄型方面平面封装)
Trc(Row Cycle Time,列循环时间)
TrD(Transistor Density,晶体管密度)
TSOP(Thin Small Outline Plastic,薄型小型塑料)
USWC(Uncacheabled Speculative Write Combination,无缓冲随机联合写操作)
VALU(Vector Arithmetic Logic Unit,向量算术逻辑单元)
VFSD(Vertex Frequency Stream Divider,顶点频率流分隔)
VID(VID:Voltage identify,电压鉴别号码)
VLIW(Very Long Instruction Word,超长指令字)
VPU(Vector Permutate Unit,向量排列单元)
VPU(vector processing units,向量处理单元,即处理MMX、SSE等SIMD指令的地方)
VSA(Virtual System Architecture,虚拟系统架构)
VTF(VIA Technical Forum,威盛技术论坛)
XBar(Crossbar,交叉口闩仲载逻辑单元)
XP(Experience,体验)
XP(Extra performance,额外性能)
XP(eXtreme Performance,极速性能)

散热器
TFT(Tiny Fin Technology,微型鳍片技术)

2、主板
3GIO(Third Generation Input/Output,第三代输入输出技术)
ACR(Advanced Communications Riser,高级通讯升级卡)
ADIMM(advanced Dual In-line Memory Modules,高级双重内嵌式内存模块)
AGTL+(Assisted Gunning Transceiver Logic,援助发射接收逻辑电路)
AIMM(AGP Inline Memory Module,AGP板上内存升级模块)
AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
AHA(Accelerated Hub Architecture,加速中心架构)
AOI(Automatic Optical Inspection,自动光学检验)
APU(Audio Processing Unit,音频处理单元)
ARF(Asynchronous Receive FIFO,异步接收先入先出)
ASF(Alert Standards Forum,警告标准讨论)
ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
AT(Advanced Technology,先进技术)
ATX(AT Extend,扩展型AT)
BIOS(Basic Input/Output System,基本输入/输出系统)
CNR(Communication and Networking Riser,通讯和网络升级卡)
CSA(Communication Streaming Architecture,通讯流架构)
CSE(Configuration Space Enable,可分配空间)
COAST(Cache-on-a-stick,条状缓存)
DASP(Dynamic Adaptive Speculative Pre-Processor,动态适应预测预处理器)
DB: Device Bay,设备插架
DMI(Desktop Management Interface,桌面管理接口)
DOT(Dynamic Overclocking Technonlogy,动态超频技术)
DPP(direct print Protocol,直接打印协议
DRCG(Direct Rambus clock generator,直接RAMBUS时钟发生器)
DVMT(Dynamic Video Memory Technology,动态视频内存技术)
E(Economy,经济,或Entry-level,入门级)
EB(Expansion Bus,扩展总线)
EFI(Extensible Firmware Interface,扩展固件接口)
EHCI(Enhanced Host Controller Interface,加强型主机端控制接口)
EISA(Enhanced Industry Standard Architecture,增强形工业标准架构)
EMI(Electromagnetic Interference,电磁干扰)
ESCD(Extended System Configuration Data,可扩展系统配置数据)
ESR(Equivalent Series Resistance,等价系列电阻)
FBC(Frame Buffer Cache,帧缓冲缓存)
FireWire(火线,即IEEE1394标准)
FlexATX(Flexibility ATX,可扩展性ATX)
FSB(Front Side Bus,前端总线)
FWH(Firmware Hub,固件中心)
GB(Garibaldi架构,Garibaldi基于ATX架构,但是也能够使用WTX构架的机箱)
GMCH(Graphics & Memory Controller Hub,图形和内存控制中心)
GPA(Graphics Performance Accelerator,图形性能加速卡)
GPIs(General Purpose Inputs,普通操作输入)
GTL+(Gunning Transceiver Logic,发射接收逻辑电路)
HDIT(High Bandwidth Differential Interconnect Technology,高带宽微分互连技术)
HSLB(High Speed Link Bus,高速链路总线)
HT(HyperTransport,超级传输)
I2C(Inter-IC)
I2C(Inter-Integrated Circuit,内置集成电路)
IBASES(Intel Baseline AGP System Evaluation Suite,英特尔基线AGP系统评估套件)
IC(integrate circuit,集成电路)
ICH(Input/Output Controller Hub,输入/输出控制中心)
ICH-S(ICH-Hance Rapids,ICH高速型)
ICP(Integrated Communications Processor,整合型通讯处理器)
IHA(Intel Hub Architecture,英特尔Hub架构)
IMB(Inter Module Bus,隐藏模块总线)
INTIN(Interrupt Inputs,中断输入)
IPMAT(Intel Power Management Analysis Tool,英特尔能源管理分析工具)
IR(infrared ray,红外线)
IrDA(infrared ray,红外线通信接口,可进行局域网存取和文件共享)
ISA(Industry Standard Architecture,工业标准架构)
ISA(instruction set architecture,工业设置架构)
K8HTB(K8 HyperTransport Bridge,K8闪电传输桥)
LSI(Large Scale Integration,大规模集成电路)
LPC(Low Pin Count,少针脚型接口)
MAC(Media Access Controller,媒体存储控制器)
MBA(manage boot agent,管理启动代理)
MC(Memory Controller,内存控制器)
MCA(Micro Channel Architecture,微通道架构)
MCH(Memory Controller Hub,内存控制中心)
MDC(Mobile Daughter Card,移动式子卡)
MII(Media Independent Interface,媒体独立接口)
MIO(Media I/O,媒体输入/输出单元)
MOSFET(metallic oxide semiconductor field effecttransistor,金属氧化物半导体场效应晶体管)
MRH-R(Memory Repeater Hub,内存数据处理中心)
MRH-S(SDRAM Repeater Hub,SDRAM数据处理中心)
MRIMM(Media-RIMM,媒体RIMM扩展槽)
MSI(Message Signaled Interrupt,信息信号中断)
MSPCE(Multiple Streams with Pipelining and Concurrent Execution,多重数据流的流水线式传输与并发执行)
MT=MegaTransfers(兆传输率)
MTH(Memory Transfer Hub,内存转换中心)
MuTIOL(Multi-Threaded I/O link,多线程I/O链路)
NGIO(Next Generation Input/Output,新一代输入/输出标准)
NPPA(nForce Platform Processor Architecture,nForce平台处理架构)
OHCI(Open Host Controller Interface,开放式主控制器接口)
ORB(operation request block,操作请求块)
ORS(Over Reflow Soldering,再流回焊接,SMT元件的焊接方式)
P64H(64-bit PCI Controller Hub,64位PCI控制中心)
PCB(printed circuit board,印刷电路板)
PCBA(Printed Circuit Board Assembly,印刷电路板装配)
PCI(Peripheral Component Interconnect,互连外围设备)
PCI SIG(Peripheral Component Interconnect Special Interest Group,互连外围设备专业组)
PDD(Performance Driven Design,性能驱动设计)
PHY(Port Physical Layer,端口物理层)
POST(Power On Self Test,加电自测试)
PS/2(Personal System 2,第二代个人系统)
PTH(Plated-Through-Hole technology,镀通孔技术)
RE(Read Enable,可读取)
QP(Quad-Pumped,四倍泵)
RBB(Rapid BIOS Boot,快速BIOS启动)
RNG(Random number Generator,随机数字发生器)
RTC(Real Time Clock,实时时钟)
KBC(KeyBroad Control,键盘控制器)
SAP(Sideband Address Port,边带寻址端口)
SBA(Side Band Addressing,边带寻址)
SBC(single board computer,单板计算机)
SBP-2(serial bus protocol 2,第二代串行总线协协)
SCI(Serial Communications Interface,串行通讯接口)
SCK (CMOS clock,CMOS时钟)
SDU(segment data unit,分段数据单元)
SFF(Small Form Factor,小尺寸架构)
SFS(Stepless Frequency Selection,步进频率选项)
SMA(Share Memory Architecture,共享内存结构)
SMT(Surface Mounted Technology,表面黏贴式封装)
SPI(Serial Peripheral Interface,串行外围设备接口)
SSLL(Single Stream with Low Latency,低延迟的单独数据流传输)
STD(Suspend To Disk,磁盘唤醒)
STR(Suspend To RAM,内存唤醒)
SVR(Switching Voltage Regulator,交换式电压调节)
THT(Through Hole Technology,插入式封装技术)
UCHI(Universal Host Controller Interface,通用宿主控制器接口)
UPA(Universal Platform Architecture,统一平台架构)
UPDG(Universal Platform Design Guide,统一平台设计导刊)
USART(Universal Synchronous Asynchronous Receiver Transmitter,通用同步非同步接收传送器)
USB(Universal Serial Bus,通用串行总线)
USDM(Unified System Diagnostic Manager,统一系统监测管理器)
VID(Voltage Identification Definition,电压识别认证)
VLB(Video Electronics Standards Association Local Bus,视频电子标准协会局域总线)
VLSI(Very Large Scale Integration,超大规模集成电路)
VMAP(VIA Modular Architecture Platforms,VIA模块架构平台)
VSB(V Standby,待命电压)
VXB(Virtual Extended Bus,虚拟扩展总线)
VRM(Voltage Regulator Module,电压调整模块)
WE(Write Enalbe,可写入)
WS(Wave Soldering,波峰焊接,THT元件的焊接方式)
XT(Extended Technology,扩充技术)
ZIF(Zero Insertion Force, 零插力插座)

芯片组
ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
AGP(Accelerated Graphics Port,图形加速接口)
BMS(Blue Magic Slot,蓝色魔法槽)
I/O(Input/Output,输入/输出)
MIOC: Memory and I/O Bridge Controller,内存和I/O桥控制器
NBC: North Bridge Chip(北桥芯片)
PIIX: PCI ISA/IDE Accelerator(加速器)
PSE36: Page Size Extension 36-bit,36位页面尺寸扩展模式
PXB: PCI Expander Bridge,PCI增强桥
RCG: RAS/CAS Generator,RAS/CAS发生器
SBC: South Bridge Chip(南桥芯片)
SMB(System Management Bus,全系统管理总线)
SPD(Serial Presence Detect,连续存在检测装置)
SSB: Super South Bridge,超级南桥芯片
TDP: Triton Data Path(数据路径)
TSC: Triton System Controller(系统控制器)
QPA: Quad Port Acceleration(四接口加速)

主板技术
Gigabyte
ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
SIV: System Information Viewer(系统信息观察)
磐英
ESDJ(Easy Setting Dual Jumper,简化CPU双重跳线法)
浩鑫
UPT(USB、PANEL、LINK、TV-OUT四重接口)
华硕
C.O.P(CPU overheating protection,处理器过热保护)

3、显示设备
AD(Analog to Digitalg,模拟到数字转换)
ADC(Apple Display Connector,苹果专用显示器接口)
ASIC(Application Specific Integrated Circuit,特殊应用积体电路)
ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
ASC(Anti Static Coatings,防静电涂层)
ASD(Auto Stereoscopic Display,自动立体显示)
AGC(Anti Glare Coatings,防眩光涂层)
AG(Aperture Grills,栅条式金属板)
ARC(Anti Reflect Coating,防反射涂层)
BLA: Bearn Landing Area(电子束落区)
BMC(Black Matrix Screen,超黑矩阵屏幕)
CCS(Cross Capacitance Sensing,交叉电容感应)
cd/m^2(candela/平方米,亮度的单位)
CDRS(Curved Directional Reflection Screen,曲线方向反射屏幕)
CG-Silicon(Continuous Grain Silicon,连续微粒硅)
CNT(carbon nano-tube,碳微管)
CRC(Cyclical Redundancy Check,循环冗余检查)
CRT(Cathode Ray Tube,阴极射线管)
CVS(Compute Visual Syndrome,计算机视觉综合症)
DA(Digital to Analog,数字到模拟转换)
DDC(Display Data Channel,显示数据通道)
DDWG(Digital Display Working Group,数字化显示工作组)
DEC(Direct Etching Coatings,表面蚀刻涂层)
Deflection Coil(偏转线圈)
DFL(Dynamic Focus Lens,动态聚焦)
DFP(Digital Flat Panel,数字平面显示标准)
DFPG(Digital Flat Panel Group,数字平面显示标准工作组)
DFS(Digital Flex Scan,数字伸缩扫描)
DIC: Digital Image Control(数字图像控制)
Digital Multiscan II(数字式智能多频追踪)
DLP(digital Light Processing,数字光处理)
DOSD: Digital On Screen Display(同屏数字化显示)
DPMS(Display Power Management Signalling,显示能源管理信号)
Dot Pitch(点距)
DQL(Dynamic Quadrapole Lens,动态四极镜)
DSP(Digital Signal Processing,数字信号处理)
DSTN(Double layers Super Twisted Nematic,双层超扭曲向列,无源矩阵LCD)
DTV(Digital TV,数字电视)
DVI(Digital Visual Interface,数字化视像接口)
ECD(ElectroChromic Display,电铬显示器)
EFEAL(Extended Field Elliptical Aperture Lens,可扩展扫描椭圆孔镜头)
FED(Field Emission Displays,电场显示器)
Flyback Transformer(回转变压器)
FPD(flat panel display,平面显示器)
FRC: Frame Rate Control(帧比率控制)
GLV(grating-light-valve,光栅亮度阀)
HDMI(High Definition Multimedia Interface,高精度多媒体接口)
HDTV(high definition television,高清晰度电视)
HVD(High Voltage Differential,高分差动)
IFT(Infinite FlatTube,无限平面管,三星丹娜)
INVAR(不胀铜)
IPS(in-plane switching,平面开关)
LCD(liquid crystal display,液晶显示屏)
LCOS: Liquid Crystal On Silicon(硅上液晶)
LED(light emitting diode,光学二级管)
L-SAGIC(Low Power-Small Aperture G1 wiht Impregnated Cathode,低电压光圈阴极管)
LTPS(Low-Temperature Poly-Si,低温多晶硅)
LVD(Low Voltage Differential,低分差动)
LVDS(Low Voltage Differential Signal,低分差动信号)
LRTC(LCD Response Time Compensation,液晶响应时间补偿)
LTPS(Low Temperature Polysilicon,低温多硅显示器)
MALS(Multi Astigmatism Lens System,多重散光聚焦系统)
MDA(Monochrome Adapter,单色设备)
Monochrome Monitor(单色显示器)
MS: Magnetic Sensors(磁场感应器)
MVA(multi-domain vertical alignment,广域垂直液晶队列)
OEL(organic electro-luminescent,有机电镀冷光)
OLED(Organic light-emitting diode,有机电激发光显示器)
OSD(On Screen Display,同屏显示)
PAC(psycho-acoustic compensation,心理声学补偿)
P&D(Plug and Display,即插即显)
PDP(Plasma Display Panel,等离子显示器)
Porous Tungsten(活性钨)
PPI(Pixel Per Inch,像素/英寸)
RGB(Red、Blue、Green,红、蓝、绿三原色)
ROP(raster operations,光栅操作)
RSDS: Reduced Swing Differential Signal(小幅度摆动差动信号)
SC(Screen Coatings,屏幕涂层)
Single Ended(单终结)
Shadow Mask(点状阴罩)
SXGA(Super eXtended Graphics Array,超级扩展型图形阵列)
STN(Super Twisted Nematic,超扭曲向列,无源矩阵)
TCO(The Swedish Confederation of Professional Employees,瑞典专业工作人员联合会)
TDT(Timeing Detection Table,数据测定表)
TMDS(Transition Minimized Differential Signaling,转换极低损耗微分信号)
TN(Twisted Nematic,扭曲液晶向列,无源矩阵LCD)
TN+film(twisted nematic and retardation film,扭曲液晶向列+延迟薄膜)
TICRG: Tungsten Impregnated Cathode Ray Gun(钨传输阴级射线枪)
TFT(thin film transistor,薄膜晶体管,有源矩阵LCD)
Trinitron(特丽珑)
UCC(Ultra Clear Coatings,超清晰涂层)
UFB(Ultra-Fine&Bright,新概念超亮度液晶显示屏)
UXGA (Ultra Extended Graphics Array,极速扩展图形阵列)
VAGP: Variable Aperature Grille Pitch(可变间距光栅)
VBI: Vertical Blanking Interval(垂直空白间隙)
VESA(Video Electronics Standards Association,视频电子标准协会)
VGA(video graphics array,视频图像阵列)
VDT(Video Display Terminals,视频显示终端)
VRR: Vertical Refresh Rate(垂直扫描频率)
VW(Virtual Window,虚拟视窗)
XGA(eXtended Graphics Array,扩展型图形阵列)
YUV(亮度和色差信号)

4、视频
3D:Three Dimensional,三维
3DCG(3D computer graphics,三维计算机图形)
3DS(3D SubSystem,三维子系统)
A-Buffer(Accumulation Buffer,积聚缓冲)
AA(Accuview Antialiasing,高精度抗锯齿)
ADC(Analog to Digital Converter,模数传换器)
ADI(Adaptive De-Interlacing,自适应交错化技术)
AE(Atmospheric Effects,大气雾化效果)
AFC(Advanced Frame Capture、高级画面捕获)
AFR(Alternate Frame Rendering,交替渲染技术)
Anisotropic Filtering(各向异性过滤)
APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
AR(Auto-Resume,自动恢复)
AST(amorphous-silicon TFT,非晶硅薄膜晶体管)
AV(Analog Video,模拟视频)
AV(Audio & Video,音频和视频)
B Splines(B样条)
BAC(Bad Angle Case,边角损坏采样)
Back Buffer,后置缓冲
Backface culling(隐面消除)
Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
Bilinear Filtering(双线性过滤)
B.O.D.E(Body、Object、Design、Envioment,人体、物体、设计、环境渲染自动识别)
BSP(Binary Space Partitioning,二进制空间分区)
CBMC(Crossbar based memory controller,内存控制交叉装置)
CBU(color blending unit,色彩混和单位)
CEA(Critical Edge Angles,临界边角)
CEM(cube environment mapping,立方环境映射)
CG(C for Graphics/GPU,用于图形/GPU的可编程语言)
CG(Computer Graphics,计算机生成图像)
Clipping(剪贴纹理)
Clock Synthesizer,时钟合成器
compressed textures(压缩纹理)
Concurrent Command Engine,协作命令引擎
CSC(Colorspace Conversion,色彩空间转换)
CSG (constructive solid geometry,建设立体几何)
CSS(Content Scrambling System,内容不规则加密)
DAC(Digital to Analog Converter,数模传换器)
DCD(Directional Correlational De-interlacing,方向关联解交错)
DCT(Display Compression Technology,显示压缩技术)
DDC(Dynamic Depth Cueing,动态深度暗示)图像
DDP(Digital Display Port,数字输出端口)
DDS(Direct Draw Surface,直接绘画表面)
Decal(印花法,用于生成一些半透明效果,如:鲜血飞溅的场面)
DFP(Digital Flat Panel,数字式平面显示器)
DFS: Dynamic Flat Shading(动态平面描影),可用作加速
Dithering(抖动)
Directional Light,方向性光源
DM(Displacement mapping,位移贴图)
DME(Direct Memory Execute,直接内存执行)
DOF(Depth of Field,多重境深)
dot texture blending(点型纹理混和)
DOT3(Dot product 3 bump mapping,点乘积凹凸映射)
Double Buffering(双缓冲区)
DPBM(Dot Product Bump Mapping,点乘积凹凸映射)
DQUICK(DVD Qualification and Integration Kit,DVD资格和综合工具包)
DRA(deferred rendering architecture,延迟渲染架构)
DRI(Direct Rendering Infrastructure,基层直接渲染)
DSP(Dual Streams Processor,双重流处理器)
DVC(Digital Vibrance Control,数字振动控制)
DVI(Digital Video Interface,数字视频接口)
DVMT(Dynamic Video Memory Technology,动态视频内存技术)
DxR: DynamicXTended Resolution(动态可扩展分辨率)
DXTC(Direct X Texture Compress,DirectX纹理压缩,以S3TC为基础)
Dynamic Z-buffering(动态Z轴缓冲区),显示物体远近,可用作远景
E-DDC(Enhanced Display Data Channel,增强形视频数据通道协议,定义了显示输出与主系统之间的通讯通道,能提高显示输出的画面质量)
Edge Anti-aliasing(边缘抗锯齿失真)
E-EDID(Enhanced Extended Identification Data,增强形扩充身份辨识数据,定义了电脑通讯视频主系统的数据格式)
eFB(embedded Frame Buffer,嵌入式帧缓冲)
eTM(embedded Texture Buffer,嵌入式纹理缓冲)
Execute Buffers,执行缓冲区
Embosing,浮雕
EMBM(environment mapped bump mapping,环境凹凸映射)
Extended Burst Transactions,增强式突发处理
Factor Alpha Blending(因子阿尔法混合)
Fast Z-clear,快速Z缓冲清除
FB(fragment buffer,片段缓冲)
FL(fragment list,片段列表)
FW(Fast Write,快写,AGP总线的特殊功能)
Front Buffer,前置缓冲
Flat(平面描影)
FL(Function Lookup,功能查找)
FMC(Frictionless Memory Control,无阻内存控制)
Frames rate is King(帧数为王)
FRC(Frame Rate Control,帧率控制)
FSAA(Full Scene/Screen Anti-aliasing,全景/屏幕抗锯齿)
Fog(雾化效果)
flip double buffered(反转双缓存)
fog table quality(雾化表画质)
F-Buffer(Fragment Stream FIFO Buffer,片段流先入先出缓冲区)
GPT(Graphics Performance Toolkit,图形性能工具包)
FRJS(Fully Random Jittered Super-Sampling,完全随机移动式超级采样)
Fur(软毛效果)
GART(Graphic Address Remappng Table,图形地址重绘表)
GI(Global Illumination,球形光照)
GIC(Gold Immersion Coating,化金涂布技术,纯金材质作为PCB最终层,提升信号完整性)
GIF(Graphics Interchange Format,图像交换格式)
Gouraud Shading,高洛德描影,也称为内插法均匀涂色
GPU(Graphics Processing Unit,图形处理器)
GTF(Generalized Timing Formula,一般程序时间,定义了产生画面所需要的时间,包括了诸如画面刷新率等)
GTS(Giga Textel Sharder,十亿像素填充率)
Guard Band Support(支持保护带)
HAL(Hardware Abstraction Layer,硬件抽像化层)
HDR(High Dynamic Range,高级动态范围)
HDRL(high dynamic-range lighting,高动态范围光线)
HDVP(High-Definition Video Processor,高精度视频处理器)
HEL: Hardware Emulation Layer(硬件模拟层)
HLSL(High Level Shading Language,高级描影语言)
HMC(hardware motion compensation,硬件运动补偿)
Hierarchical Z(Z分级)
high triangle count(复杂三角形计数)
HOS(Higher-Order Surfaces,高次序表面)
HPDR(High-Precision Dynamic-Range,高精度动态范围)
HRAA(High Resolution Anti-aliasing,高分辨率抗锯齿)
HSI(High Speed Interconnect,高速内连)
HSR(Hidden Surface Removal,隐藏表面移除)
HTP(Hyper Texel Pipeline,超级像素管道)
HWMC(Hardware Motion Compensation,硬件运动补偿)
ICD(Installable Client Driver,可安装客户端驱动程序)
iDCT(inverse Discrete Cosine Transformation,负离散余弦转换)
IDE(Integrated Development Environment,集成开发环境)
Immediate Mode,直接模式
IMMT(Intelligent Memory Manager Technology,智能内存管理技术)
Imposters(诈欺模型)
IPEAK GPT(Intel Performance Evaluation and Analysis Kit - Graphics Performance Toolkit,英特尔性能评估和分析套件 - 图形性能工具包)
IPPR: Image Processing and Pattern Recognition(图像处理和模式识别)
IR(Immediate Rendering,直接渲染)
IRA(immediate-mode rendering architecture,即时渲染架构)
IQ(inverse quantization,反转量子化)
ITC(Internal True Color,内部真彩色)
IVC(Indexed Vertex Cache,索引顶点缓存)
JFAA(Jitter Free Anti Aliasing,自由跳跃进抗锯齿)
JGSS(Jittered Grid Super-Sampling,移动式栅格超级采样)
JPRS(Jittered pseudo random sampling,抖动假取样)
Key Frame Interpolation,关键帧插补
large textures(大型纹理)
LE(low end,低端)
LF(Linear Filtering,线性过滤,即双线性过滤)
LFB(Linear Frame-Buffer,线性帧缓冲)
LFM(Light Field Mapping,光照区域贴图)
lighting(光源)
lightmap(光线映射)
LMA(Lightspeed memory Architecture,光速内存架构)
Local Peripheral Bus(局域边缘总线)
LOD(Levels-of-Detail,细节级)
Lossless Z Compression,无损Z压缩
LPF(Low-past filter,低通道滤波器)
LSR(Light Shaft Rendering,光线轴渲染)
mipmapping(MIP映射)
MAC(Mediocre Angle Case,普通角采样)
Matrix Vertex Blending,矩阵顶点混和
MCM(Multichip Module,多芯片模块)
Membrane lighting,隔膜光线
Mipmap LOD Bias Adjustment(映射LOD偏移调节)
Modulate(调制混合)
Motion Compensation,动态补偿
motion blur(模糊移动)
MPPS:Million Pixels Per Second,百万个像素/秒
MRT(Multiple Render Targets,多重渲染目标)
MSAA(multisampling Scene/Screen Anti-aliasing,多重采样抗锯齿)
Multiplicative Texture Blending(乘法纹理混合)
Multi-Resolution Mesh,多重分辨率组合
Multi Threaded Bus Master,多线程主控
Multitexture(多重纹理)
MVSD(Motion Vector Steered de-interlacing,移动向量控制解交错)
MXM(Mobile PCI Express Module,移动PCI Express模块)
NURBS(Non Uniform Relational B Splines,非统一相关B样条)
nerest Mipmap(邻近MIP映射,又叫点采样技术)
NGP(Next-Generation Graphics Port,下一代图形接口)
NSR(nVidia Shading Rasterizer,nVidia描影光栅引擎)
NXL(NVIDIA XPress Link,nViadia X紧迫链路)
OGSS(Ordered Grid Super-Sampling,顺序栅格超级采样)
ORB(Online ResultBrowser,在线分数浏览)
OTES(Outside Thermal Exhaust System,向外热排气系统)
Overdraw(透支,全景渲染造成的浪费)
partial texture downloads(并行纹理传输)
Parallel Processing Perspective Engine(平行透视处理器)
PC(pipeline combining,管道结合)
Perspective Correction(透视纠正)
Perspective Divide,透视分隔
PGC(Parallel Graphics Configuration,并行图像设置)
PureHAL(Pure Hardware Abstraction Layer,纯硬件处理层)
PIP(Picture In Picture,画中画)
pixel(Picture element,图像元素,又称P像素,屏幕上的像素点)
PM(parallax mapping,视差映射)
Point Primitive Support(支持原始点)
point light(一般点光源)
point sampling(点采样技术,又叫邻近MIP映射)
Point Sprit(点碎片纹理)
Positional Lights(定点光源)
Precise Pixel Interpolation,精确像素插值
precomputed/preimaged(预计算/预描绘)
Procedural textures(可编程纹理)
Projected Textrues(投射纹理)
PS(Pixel Shaders,像素描影)
PT(Projective textures,投影纹理)
PTC(Palletized Texture Compression,并行纹理压缩)
PVA(Patterned Vertical Alignment,图像垂直调整)
PVPU(Programable Vertex Processing Unit,可编程顶点处理单元)
QC(Quad Cache,四重缓存)
QDR(Quad Data Rate,四倍速率)
QDR SDRAM(Quad Data Rate,四倍速率 SDRAM)
RAMDAC(Random Access Memory Digital to Analog Converter,随机存储器数/模转换器)
Range Fog(延伸雾化)
PB(Priority buffer,优先缓冲)
PJSS(programmable jitter table,可编程抖动表)
ps(picoseconds,皮秒,微微秒,百亿分之一秒)
Reflection mapping(反射贴图)
render(着色或渲染)
Rendering to a Window(窗口透视)
RGBA(Red、Blue、Green + Alpha,红、蓝、绿 + Alpha通道)
RGSS(Rotated Grid Super-Sampling,旋转栅格超级采样)
RM(Retention Mechanism,保持机构)
RSAA(Random Sampling Anti aliasing,随机采样抗锯齿)
RTV(Real Time Video,实时视频)
S端子(Seperate)
S3(Sight、Sound、Speed,视频、音频、速度)
S3TC(S3 Texture Compress,S3纹理压缩,以前仅支持S3显卡)
S3TL(S3 Transformation & Lighting,S3多边形转换和光源处理)
SB(Shadow Buffer,描影缓冲)
Screen Buffer(屏幕缓冲)
SDTV(Standard Definition Television,标准清晰度电视)
SEM(spherical environment mapping,球形环境映射)
SGCT(self-gauging clock technology,自测量时钟技术)
Shading,描影
SIF2(SUMA Individual Analog Filter 2,SUMA独立模拟过滤器2)
Single Pass Multi-Texturing,单通道多纹理
SLAM(Symmetrically Loaded Acoustic Module,平衡装载声学模块)
SLI(Scanline Interleave,扫描线间插,3Dfx的双Voodoo 2配合技术)
Smart Filter(智能过滤)
soft shadows(柔和阴影)
soft reflections(柔和反射)
spot light(小型点光源)
SRA(Symmetric Rendering Architecture,对称渲染架构)
Specular Gouraud Shading(镜面高洛德描影)
SS(Smart Shader,智能描影)
SSAA(Super-Sampling Anti-aliasing,超级采样抗锯齿)
Stencil Buffers(模板缓冲)
Stream Processor(流线处理)
Subpixel Accurate Rasterizing(区块子像素精确光栅化)
Subtractive Texture Blending(反纹理混合)
Super Sampling(超级采样)
SuperScaler Rendering,超标量渲染
Table Fog(雾化函数表)
TBFB(Tile Based Frame Buffer,碎片纹理帧缓存)
TBR(Tile Based rendering,瓦片纹理渲染)
tessellation(镶嵌)
texel(T像素,纹理上的像素点)
Texture Alpha Blending(纹理Alpha混合)
Texture Clamping(纹理箝入)
Texture Fidelity(纹理真实性)
Texture Mirroring(纹理反射)
texture swapping(纹理交换)
Texture Wrapping(纹理外包)
T&L(Transform and Lighting,多边形转换与光源处理)
T-Buffer(T缓冲,3dfx Voodoo5的特效,包括全景反锯齿Full-scene Anti-Aliasing、动态模糊Motion Blur、焦点模糊Depth of Field Blur、柔和阴影Soft Shadows、柔和反射Soft Reflections)
TCA(Twin Cache Architecture,双缓存结构)
TIFF(Tagged Image File Format,标签图像文件格式)
Triangle Setup,三角形设置
Transparency(透明状效果)
Transformation(三角形转换)
Trilinear Filtering(三线性过滤)
Texture Modes,材质模式
TMIPM: Trilinear MIP Mapping(三次线性MIP材质贴图)
TMU(Texture Map Unit,纹理映射单元)
UCA(Unified Compiler Architecture,统一编译架构)
UDA(Unified Driver Architecture,统一驱动程序架构)
UDOT(UltraSharp Display Output Technology,超清晰显示输出技术)
UMA(Unified Memory Architecture,统一内存架构)
UMA(Unified Motherboard Architecture,统一主板架构)
UPT(unreal performance test,虚幻引擎性能测试)
VA(Vernier Acuity,视敏度)
VDM(Virtual Displacement Mapping,虚拟位移映射)
Visualize Geometry Engine,可视化几何引擎
Vertex Alpha Blending(顶点Alpha混合)
Vertex Fog(顶点雾化)
Vertex Lighting(顶点光源)
Vertical Interpolation(垂直调变)
Viewport Transform,视点转换
VIP(Video Interface Port,视频接口)
VIVO(video input/output,视频输入/输出)
ViRGE: Video and Rendering Graphics Engine(视频描写图形引擎)
VMR(Video Mixing Renderer,视频混合渲染器)
VMS(Virtual Memory System,虚拟内存系统)
VOC(Visual Online Communication,视觉在线通讯)
Voxel(Volume pixels,立体像素,Novalogic的技术)
VP(vertex processors,顶点处理器)
VPE(Video Processing Engine,视频处理引擎)
VPU(Vertex Processing Unit,顶点处理单元)
VPU(Visual Processing Unit,虚拟处理器单元)
VQTC(Vector-Quantization Texture Compression,向量纹理压缩)
VS(Vertex Shaders,顶点描影)
VS(Visibility Subsystem,可见子系统)
VSA(Voodoo Scalable Architecture,可升级Voodoo架构)
VSIS(Video Signal Standard,视频信号标准)
VSync(Vertical Sync,重直同步刷新)
VT(Volume textures,体积纹理)
VT(Vertex Texturing,顶点纹理绘制)
VTC(Volume Texture Compression,体积纹理压缩)
W-Fog(W雾化)
Xabre(“Sabre”(基础)+eXtraordinary(非凡)+Advanced(先进)+Brilliant(卓越)+Rapture(欢喜)+Enrichment(丰富))
XBA(Xtreme Bandwidth Architecture,极速带宽架构)
YAB NCTC(Narrow Channel Texture compression,狭窄通道纹理压缩)
Z Buffer(Z缓存)
ZRT(Zone Rendering Technology,区域渲染技术)
ZOC(Z-Occlusion Culling,Z闭塞选择)

5、音频
3DPA(3D Positional Audio,3D定位音频)
AAC(Advanced Audio Compression,高级音频压缩)
AC(Acoustic Edge,声学边缘)
AC(Audio Codec,音频多媒体数字信号编解码器)
AC-3(Audio Coding 3,第三代音响编码)
AC97(Audio Codec '97,多媒体数字信号解编码器1997年标准)
ACIRC(Advanced Cross Interleave Reed - Solomon Code,高级交叉插入里德所罗门代码)
ADIP(ADdress In Pre-groove,地址预刻)
AFC(Amplitude-frequency characteristic,振幅频率特征)
AMC(audio/modem codec,音频/调制解调器多媒体数字信号编解码器)
APS(Audio Production Studio,音频生产工作室)
APX(All Position eXpansion全方位扩展)
ASIO(Audio Streaming Input and Output interface,音频流输入输出接口)
ATRAC(Adaptive TRansform Acoustic Coding,可适应转换声学译码,MD专用数字声音数据压缩系统)
AUD_EXT(Audio Extension,音频扩展)
AUX(Auxiliary Input,辅助输入接口)
CBR(Constant Bit Rate,固定比特率)
CS(Channel Separation,声道分离)
CMSS(Creative Multi Speaker Surround,创新多音箱环绕)
CPRM(Content Protection for recordable media,记录媒体内容保护)
DAB(digital audio broadcast,数字音频广播)
DBBS(Dynamic Bass Boost System,动态低音增强系统)
DCC(Digital Compact Cassette,数字盒式磁带)
DDMA(Distributed DMA,分布式DMA)
DDSS(Dolby Digital Surround Sound,杜比数字环绕声)
DHT(Dolby Headphone Technology,杜比耳机技术)
DLS(Downloadable Sounds Level,可下载音色)
DLS-2(Downloadable Sounds Level 2,第二代可下载音色)
DS3D(DirectSound 3D Streams)
DSD(Direct Stream Digital,直接数字信号流)
DSL(Down Loadable Sample,可下载的取样音色)
DSO(Dynamic Sound-stage Organizer,动态声音层组建)
DSP(Digital Sound Field Processing,数字音场处理)
DTS(Digital Theater System,数字剧院系统)
DTT(DeskTop Theater,桌面剧院)
EAX(Environmental Audio Extensions,环境音效扩展技术)
EFM (Eight to Fourteen Modulation,8位信号转换为14位信号)
ESP(Electronic-Shock Protection,电子抗震系统)
Extended Stereo(扩展式立体声)
FM(Frequency Modulation,频率调制)
FIR(finite impulse response,有限推进响应)
FPS(FourPointSurround,创新的四点环绕扬声器系统)
FR(Frequence Response,频率响应)
FSE(Frequency Shifter Effect,频率转换效果)
GM(General Midi,普通MIDI)
HDA(high-efficiency Audax High Definition Aerogel,高效高清楚气动)
Hi-fi(high fidelity,高精度设备)
HPF(High-Pass Filter,高通滤波器)
HRTF(Head Related Transfer Function,头部关联传输功能)
I3DL2(Interactive 3D Level 2,第二级交互式3D音效)
IID(Interaural Intensity Difference,两侧声音强度差别)
IIR(infinite impulse response,无限推进响应)
Interactive Around-Sound(交互式环绕声)
Interactive 3D Audio(交互式3D音效)
ITD(Interaural Time Difference,两侧声音时间延迟差别)
LFE(Low Frequency Sound Channel,低频声音通道)
LP(Long Play,长时间播放)
LPF(Low-Pass Filter,低通滤波器)
MC(modem codec,调制解调器多媒体数字信号编解码器)
MDLP(MiniDisc Long Play,长时间播放迷你光盘)
MFM(Magnetic field modulation,磁场调制)
MIDI(Musical Instrument Digital Interface,乐器数字接口)
NC(Noise Canceling,降噪)
NDA: non-DWORD-aligned ,非DWORD排列
NVH(Noise、Vibration、Harshness,噪声、振动和刺耳声)
QEM(Qsound Environmental Modeling,Qsound环境建模扬声器组)
QMSS(QSound Multi Speaker System,Qsound多音箱系统)
Raw PCM: Raw Pulse Code Modulated(元脉码调制)
RMA: RealMedia Architecture(实媒体架构)
RMAA(Right Mark Audio Analyzer,公正标识音频分析软件)
RTSP: Real Time Streaming Protocol(实时流协议)
SACD(Super Audio CD,超级音乐CD)
SCMS(Serial Copy Management System,连续复制管理系统,限制数字拷贝)
SDMI(Secure Digital Music Initiative,安全式数字音乐)
SNR(Signal to Noise Ratio,信噪比)
S/PDIF(Sony/Phillips Digital Interface,索尼/飞利普数字接口)
SP(Stream Processor,音频流处理器)
SPU(Sound Processor Unit,声音处理器)
SPX(Sound Production Experience,声音生成体验)
SPX(Sound Production eXtensions,声音生成扩展)
SRC(Sampling Rate Convertor,采样率转换器,把48KHz转为MD适用的44.1KHz)
SRS: Sound Retrieval System(声音修复系统)
Surround Sound(环绕立体声)
Super Intelligent Sound ASIC(超级智能音频集成电路)
TAD(Telephone Answering Device,电话应答设备)
TC(Time Scaling,时间缩放)
TDMA(Transparent DMA,透明DMA)
THD+N(Total Harmonic Distortion plus Noise,总谐波失真加噪音)
TOC (Table Of Contents,MD内容表,包括磁盘名称、轨数、演奏时间)
TVA(Time Variable Amplitude,可随时间变化的音量)
TVF(Time Variable Filter,可随时间变化的滤波器)
UDAC-MB(universal distribution with access control-media base,通用分配存取控制媒体基准)
UTOC (User Table of Contents,可录式MD内容表)
VBR(Variable Bit Rate,动态比特率)
WG(Wave Guide,波导合成)
WT(Wave Table,波表合成)

6、RAM & ROM
ABB(Advanced Boot Block,高级启动块)
ABP: Address Bit Permuting,地址位序列改变
ADT(Advanced DRAM Technology,先进DRAM技术联盟)
AL(Additive Latency,附加反应时间)
ALDC(Adaptive Lossless Data Compression,适应无损数据压缩)
ATC(Access Time from Clock,时钟存取时间)
ATP(Active to Precharge,激活到预充电)
BEDO(Burst Enhanced Data-Out RAM,突发型数据增强输出内存)
BPA(Bit Packing Architecture,位封包架构)
AFC media(antiferromagnetically coupled media,反铁磁性耦合介质)
BLP(Bottom Leaded Package,底部导向封装)
BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
CAS(Column Address Strobe,列地址控制器)
CCT(Clock Cycle Time,时钟周期)
CDRAM(Cache DRAM,附加缓存型DRAM)
CL(CAS Latency,CAS反应时间)
CMR(Colossal Magnetoresistive,巨磁阻抗)
CPA(Close Page Autoprecharge,接近页自动预充电)
CSP(Chip Size Package,芯片尺寸封装)
CTR(CAS to RAS,列地址到行地址延迟时间)
DB: Deep Buffer(深度缓冲)
DD(Double Side,双面内存)
DDBGA(Die Dimension Ball Grid Array,内核密度球状矩阵排列)
DDR(Double Date Rate,上下行双数据率)
DDR SDRAM(Double Date Rate,上下行双数据率SDRAM)
DRCG(Direct Rambus Clock Generator,直接RAMBUS时钟发生器)
DIL(dual-in-line)
DIVA(Data IntensiVe Architecture,数据加强架构)
DIMM(Dual In-line Memory Modules,双重内嵌式内存模块)
DLL(Delay-Locked Loop,延时锁定循环电路)
DQS(Bidirectional data strobe,双向数据滤波)
DRAM(Dynamic Random Access Memory,动态随机存储器)
DRDRAM(Direct RAMBUS DRAM,直接内存总线DRAM)
DRSL(Direct RAMBUS Signaling Level,直接RAMBUS信号级)
DRSL(Differential Rambus Signaling Levels,微分RAMBUS信号级)
DSM(Distributed shared memory,分布式共享内存)
ECC(Error Checking and Correction,错误检查修正)
ED(Execution driven,执行驱动)
EDO(Enhanced Data-Out RAM,数据增强输出内存)
EHSDRAM(Enhanced High Speed DRAM,增强型超高速内存)
EL DDR(Enhanced Latency DDR,增强反应周期DDR内存)
EMS(Enhanced Memory System,增强内存系统)
EMS(Expanded Memory Specification,扩充内存规格)
EOL(End of Life,最终完成产品)
EPROM(erasable, programmable ROM,可擦写可编程ROM)
EPOC(Elevated Package Over CSP,CSP架空封装)
EPV(Extended Voltage Proteciton,扩展电压保护)
ESDRAM(Enhanced SDRAM,增强型SDRAM)
ESRAM(Enhanced SRAM,增强型SRAM)
EEPROM(Electrically Erasable Programmable ROM,电擦写可编程只读存储器)
FCRAM(Fast Cycle RAM,快周期随机存储器)
FEMMA(Foldable Electronic Memory Module Assembly,折叠电子内存模块装配)
FM(Flash Memory,快闪存储器)
FMD ROM (Fluorescent Material Read Only Memory,荧光质只读存储器)
FPM(Fast Page Mode,快页模式内存)
HDSS( Holographic Data Storage System,全息数据存储系统)
HMC(holographic media card,全息媒体卡)
HMD(holographic media disk,全息媒体磁盘)
HSDRAM(High Speed DRAM,超高速内存)
LRU(least recently used,最少最近使用)
MADP(Memory Address Data Path,内存地址数据路径)
MDRAM(Multi Bank Random Access Memory,多储蓄库随机存储器)
MRAM(Magnetic Random Access Memory,磁性随机存取存储器)
ns(nanosecond,纳秒,毫微秒,10亿分之一秒)
NVRAM(Non-Volatile RAM,非可变性RAM)
NWX(no write transfer,非写转换)
ODR(Octal Data Rate,八倍数据率)
ODT(on-die termination,片内终结器)
OP(Open Page,开放页)
PIROM:Processor Information ROM,处理器信息ROM
PLEDM: Phase-state Low Electron(hole)-number Drive Memory
PLL(Phase Lock Loop,相位锁定环)
PRISM(Photorefractive Information Storage Material,摄影折射信息存储原料)
PROM(Programmable Read Only Memory,可编程只读存储器)
PTA(Precharge to Active,预充电到激活)
QBM(Quad Band Memory,四倍边带内存)
QRSL(Quad Rambus Signaling Levels,四倍RAMBUS信号级)
RAC(Rambus Asic Cell,Rambus集成电路单元)
RAC(Row Access Time,行存取时间)
RAM(Random Access Memory,随机存储器)
RAS(Row Address Strobe,行地址控制器)
RAT(Precharge to Active Trp,预充电到激活时间)
RCD(Row to Cas Delay,行地址到列地址控制器延迟时间)
RDF(Rambus Developer Forum,RAMBUS发展商论坛)
RDRAM(Rambus Direct RAM,直接型RambusRAM)
RIMM(RAMBUS In-line Memory Modules,RAMBUS内嵌式内存模块)
ROM(read-only memory,只读存储器)
RRAM(Resistance RAM,非挥发性阻抗存储器)
RP(RAS Pre-charge Times,行地址预充电时间)
RL(Read Latency,读取反应时间)
SCP(CHIP SCALE PACKGE,芯片比例封装)
SD(Single Side,单面内存)
SDRAM(Synchronous Dynamic RAM,同步动态内存)
SDR(Single Date Rate,单数据率)
SDR SDRAM(Single Date Rate,单数据率SDRAM)
SGRAM(synchronous graphics RAM,同步图形随机储存器)
SIMM(Single Inline Memory Module,单边直线内存模块)
SLM(Spatial Light Modulator,空间光线调节器)
SM(Smart Media,智能存储卡)
SMRAM(System Management RAM,系统管理内存)
SODIMM(Small Outline Dual In-line Memory Modules,小型双重内嵌式内存模块)
SPD(Serial Presence Detect,串行存在检查)
SRAM(Static Random Access Memory,静态随机存储器)
SRAM(single-transistor DRAM,单晶体管DRAM)
SSFDC(Solid State Floppy Disk Card,固态软盘卡,通常指Smart Media)
SSTL(Stub Series Terminated Logic,残余连续终结逻辑电路)
TCP(Tape Carrier Packaging,带载封装)
TCSR(temperature compensated self refresh,温度补偿自刷新)
TD(Trace driven,追踪驱动)
TOM(Top of main memory,主内存顶端)
TSOPs(thin small outline packages,小型薄型封装)
UMA(Upper Memory Area,上部内存区)
ULVS(ultra low voltage signal,超低电压信号)
USWV(Uncacheable, Speculative, Write-Combining非缓冲随机混合写入)
VCRAM(Virtual Channel Memory,虚拟通道内存)
VCMA(Virtual Channel Memory architecture,虚拟通道内存结构)
VCSDRAM(Virtual Channel SDRAM,虚拟通道内存)
VM(Virtual Memory,虚拟存储器)
VR(Virtual Register,虚拟寄存器)
WBGA(Windows-BGA,WBGA的面积尺寸为传统TSOP封装的36.52%,重量为传统TSOP的23.37%,整个WBGA的面积与内核的比例为128%,也就是说,封装的面积仅比管芯大28%。
WL(Write Latency,写反应时间)
WORM(write-once/read many,写一次读多次介质)
XDR(eXtreme Data Rate,极速数据率)
XMS(Extended Memory,扩展内存)

7、磁盘
AAT(Average access time,平均存取时间)
ABS(Auto Balance System,自动平衡系统)
AM(Acoustic Management,声音管理)
ASC(Advanced Size Check,高级尺寸检查)
ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
AST(Average Seek time,平均寻道时间)
ATA(Advanced Technology Attachment,高级技术附加装置)
ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
BBS(BIOS Boot Specification,基本输入/输出系统启动规范)
BPI(Bit Per Inch,位/英寸)
bps(bit per second,位/秒)
bps(byte per second,字节/秒)
CAM(Common Access Model,公共存取模型)
CF(CompactFlash Card,紧凑型闪存卡)
CHS(Cylinders、Heads、Sectors,柱面、磁头、扇区)
CSS(Common Command Set,通用指令集)
DBI(dynamic bus inversion,动态总线倒置)
DIT(Disk Inspection Test,磁盘检查测试)
DMA(Direct Memory Access,直接内存存取)
DTR(Disk Transfer Rate,磁盘传输率)
EIDE(enhanced Integrated Drive Electronics,增强形电子集成驱动器)
eSATA(External Serial ATA,扩展型串行ATA)
FDB(fluid-dynamic bearings,动态轴承)
FAT(File Allocation Tables,文件分配表)
FC(Fibre Channel,光纤通道)
FDBM(Fluid dynamic bearing motors,液态轴承马达)
FDB(Fluid Dynamic Bearing,非固定动态轴承)
FDC(Floppy Disk Controller,软盘驱动器控制装置)
FDD(Floppy Disk Driver,软盘驱动器)
GMR(giant magnetoresistive,巨型磁阻)
HDA(Head Disk Assembly,头盘组件)
HiFD(high-capacity floppy disk,高容量软盘)
IDE(Integrated Drive Electronics,电子集成驱动器)
IPEAK SPT(Intel Performance Evaluation and Analysis Kit - Storage Performance Toolkit,英特尔性能评估和分析套件 - 存储性能工具包)
JBOD(Just a Bunch Of Disks,磁盘连续捆束阵列)
LBA(Logical Block Addressing,逻辑块寻址)
MR(Magneto-resistive Heads,磁阻磁头)
MBR(Master Boot Record,主引导记录)
ms(Millisecond,毫秒)
MSR(Magnetically induced Super Resolution,磁感应超分辨率)
MTBF(Mean Time Before Failure,平均无故障时间)
NQC(Native Queuing Command,内部序列命令)
NTFS(Net Technology File System,新技术文件系统)
OTF(on-the-fly,高速数据传输错误纠正)
PCBA(Pring Circuit Board Assembly,印刷电路电路板组件)
PIO(Programmed Input Output,可编程输入输出模式)
PRML(Partial Response Maximum Likelihood,最大可能部分反应,用于提高磁盘读写传输率)
RAID(Redundant Array of Independent Disks,独立磁盘冗余阵列)
RAID(Redundant Array of Inexpensive Disks ,廉价磁盘冗余阵列)
RPM(Rotation Per Minute,转/分)
RSD: Removable Storage Device(移动式存储设备)
RST(Read Service Times,读取服务时间)
SAMS(Seagate's Advanced Multi Drive System,希捷高级多硬盘系统)
SAS(Serial Attached SCSI,串行SCSI)
SATA(Serial ATA,串行ATA)
SBT(sound barrier technology,声音阻碍技术)
SCSI(Small Computer System Interface,小型计算机系统接口)
SCMA:SCSI Configured Auto Magically,SCSI自动配置
SLDRAM(Synchnonous Link DRAM,同步链路内存)
S.M.A.R.T.(Self-Monitoring, Analysis and Reporting Technology,自动监测、分析和报告技术)
SPS(Shock Protection System,抗震保护系统)
SSO(simultaneously switching outputs,同时开关输出)
STA(SCSI Trade Association,SCSI同业公会)
STR(sequential transfer rates,连续内部数据传输率)
TCQ(tagged command queuing,标签命令序列)
TFI(Thin-Film Inducted Heads,薄膜感应磁头)
TPI (Track Per Inch,磁道/英寸)
Ultra CF(Ultra CompactFlash Card,超级紧凑型闪存卡)
Ultra DMA(Ultra Direct Memory Access,超高速直接内存存取)
LVD(Low Voltage Differential)
Wpcom(Write-Precompensation Cylinders,写电流补偿柱面数)
WST(Write Service Times,写入服务时间)

Seagate硬盘技术
AAM(Automatic Acoustic Management,自动机械声学管理)
CBDS(Continuous Background Defect Scanning,连续后台错误扫描)
DiscWizard(磁盘控制软件)
DST(Drive Self Test,磁盘自检程序)
SeaShield(防静电防撞击外壳)

8、光驱
ADIP(Address In Pre-Groove,预凹槽寻址)
ASPI(Advanced SCSI Programming Interface,高级SCSI可编程接口)
ATAPI(AT Attachment Packet Interface,AT扩展包接口)
BCF(Boot Catalog File,启动目录文件)
BURN-Proof(Buffer UnderRuN-Proof,防止缓冲区溢出,三洋的刻录保护技术)
BIF(Boot Image File,启动映像文件)
CAV(Constant Angular Velocity,恒定角速度)
CD(Compact Disc)
CDR(CD Recordable,可记录光盘)
CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
CDRW(CD-Rewritable,可重复刻录光盘)
CLV(Constant Linear Velocity,恒定线速度)
DAE(digital Audio Extraction,数据音频抓取)
DAO(Disc At Once,整盘刻录)
DAO-RAW(Disc At Once Read after Write,整盘刻录-写后读)
DDSS(Double Dynamic Suspension System,双悬浮动态减震系统)
DDSS II(Double Dynamic Suspension System II,第二代双层动力悬吊系统)
DVD(Digital Video/Versatile Disk,数字视频/万能光盘)
DVD-R(DVD Recordable,可记录DVD盘)
DVD-RW(DVD Rewritable,可重复刻录DVD盘)
DVD-RAM(Digital Video/Versatile Disk - Random Access Memory,随机存储数字视频/万能光盘)
ESER(EAC Secure Extract Ripping,EAC安全抓取复制)
GM(Glass Mould,玻璃铸制)
GSM(Galvanization Superconductive Material,电镀锌超导材料)
IPW(Incremental Packet Writing,增量包刻录)
LIMDOW(Light Intensity Modulation Direct OverWrite,光学调制直接覆盖)
LG(Land Groove,岸地凹槽)
MAMMOS(magnetic amplifying magneto-optical system,磁畴放大播放系统)
MD(MiniDisc,微型光盘)
ML(multi-level,多层光盘技术)
MO(Magneto Optical,磁光盘)
OTF(On The Fly,飞速刻录)
OWSC(Optimum Write Speed Control、优化写入速度控制)
PCAV(Part Constant Angular Velocity,部分恒定角速度)
PPLS(Pure Phase Laser System,纯相位激光系统)
RS-PC(Reed-Solomon Product Code,里德所罗门编码)
RLL(Run Length limited,运行长度限制码)
SACD(Super Audio CD,超级音频CD)
SAO(Sessino At Once,区段刻录)
SARC(Super-Advanced Rapid Cooling,超高级快速冷却)
SC(Spin Coat,旋转覆盖)
SCM(Spin Coat Method,旋压覆盖法)
SLL(SeamLess Link,无缝连接)
SMT(Superconductive Microtherm Technology,超导体散热材料)
Super RENS(super resolution near-field structure,超精细近场结构)
TAO(Track At Once,轨道刻录)
TBW(Thermo Balanced Writing,热电平衡写入)
VCD(Video COMPACT DISC,视频CD)
VIPC(Intelligent Variable Power Correct,智能变功纠错技术)
WD(Working Distance,工作距离)

特殊技术
SOS(Smart Object Salvation,智能目标分析拯救系统)
TADS(Target Acquisition and Designantion For DVD,DVD目标获取和指定)


9、打印机
AAS(Automatic Area Seagment?)
dpi(dot per inch,每英寸的打印像素)
ECP(Extended Capabilities Port,延长能力端口)
EPP(Enhanced Parallel Port,增强形平行接口)
IPP(Internet Printing Protocol,因特网打印协议)
MPT(Micro Piezo Technology,微针点压电)
ppm(paper per minute,页/分)
SPP(Standard Parallel Port,标准并行口)
TA(Thermo Autochrome,全彩色感热式热感打印)
TB(Thermal Bubble,热泡式)
TET(Text Enhanced Technology,文本增强技术)
USBDCDPD(Universal Serial Bus Device Class Definition for Printing Devices,打印设备的通用串行总线级标准)
VD(Variable Dot,变点式列印)

10、扫描仪
CIS(Contact Image Sensors,接触图像传感器)
TWAIN(Toolkit Without An Interesting Name,无注名工具包协议)

11、公司名称
3Nod(三诺)
10MOONS(天敏)
A4tech(双飞燕)
ABIT(升技)
Acer(宏基)(笔记本以及品牌电脑使用的牌子)
Accolade(崇盛)
Acorp(佰钰)
ACTIMA(长谷)
AD(Analog Device Inc,类比设备公司)
Addonics(花王)
ADI(诚洲)
AGFA(爱克发)
Airwebs(联尚)
Aiwa(爱华)
AL(Advanced Logic Inc,先进逻辑公司)
Albatron(青云)
AMAZON(亚马逊)
Amax(中宇)
AMC(Applied Microsystems, Corp,实用微系统公司)
AMD(Advanced Micro Device,超微半导体)
AMI(American Megatrends Incorporated,美国趋势科技)
AOC(冠捷)
AOPen(Acer Open,建碁)
Apacer(宇瞻)
APC(American Power Conversion,美国能源转换)
Apple(苹果)
APT(中达国际)
ArtMedia(亚美达)
ASF(Applied Science Fiction)
Asion(亚逊)
ASUS(华硕)
ATi(治天,扬智)
Asource(源兴)
Atrend(中凌)
AVC(Asian Vital Components,奇鈜科技,亚洲关键部件生产商)
Award(爱华)
Aztech(爱捷特)
Bell(贝尔)
Benq(Bring Enjoyment and Quality to Life,明基,传达资讯生活真善美)
BETOP(北通)
Bigata(百佳泰)
BIGHAND(大手)
BioStar(映泰)
BOE(Beijing Over East,京东方)
Brother(兄弟)
BTC(英群)
BUDDY(霸迪)
C&T(Chips and Technologies, Inc. 芯片和技术公司)
Canon(佳能)
Casio(卡西欧)
Cardex(耕宇)
Cellink(浩年)
Chaintech(承启)
Chaoyi-tech(超意数码)
Chic(业盛)
China(Sciences Group 中科
Cisco(思科)
CL(Cirrus Logic)
CMedia(骅讯)
color(七彩虹)
Creative(创新)
Creative(Idea(创新锐)
Compaq(康柏)
CSUN(世讯)
CTX(中强)
CVICSE(中创)
DataExpert(联讯)
Dataland(迪兰恒进)
Daywoo(大宇)
DDD(三帝,秦众QinZhong)
DDD(Dynamic Digital Depth Inc.,动态数字境深公司,http://www.ddd.com)
DEC(Digital Equipment Corp. 数据设备公司)
DELL(戴尔)
delta(台达)
DESHARK(帝鲨)
DFI(友通,钻石)
Diamond(帝盟)
DGC(大吉)
Diamond(帝盟)
DTI(Dimension Technologies Inc,维度技术公司)
DTK(创宏)
EAR(Extreme Audio Reality)
Ecom(龙维)
ECS(精英)
Eagles(金鹰)
EagleTec(鹰泰)
EMC(唯冠,华冠)
EPO(仪宝)
EPOX(磐英 现正更名为“磐正”)
Epson(爱普生)
Ericsson(爱立信)
Etech(力宜)
ETOP(顶坚)
FIC(First International Computer,Inc.第一国际计算机公司)大众
FLY(福扬)
FMI(Fujitsu Microelectronics, Inc.)富士通微电子
Founder(北大方正)
Freetech(富棋)
FST(Future Sound Technologies)未来音乐技术
Fujistu(富士通)
FujiFilm(富士林)
Gadmei(佳的美)
Gainward(耕宇)
Gamtec(和跃)
Geil(Gold Empire International Ltd,金皇国际有限公司)
Genius(胜盈)
Genuine(捷元)
Gigabyte(技嘉)
GoldSun(高圣)
Gigabyte(技嘉)
GreatWall(长城)
Guillemot&Hercules(大力神)
GVC(致福)
Haier(海尔)
Hanwang(汉王)
Hardlink(固网)
Hayes(贺氏)
Hedy(七喜)
High-Edge(高尖)
HighPower(海霸)
Hitachi(日立)
Hoxtek(富本)
HP(Hewlett-Packard,美国惠普公司)
HP-Link(和平)
HuaWei(华为)
Huaqi(华旗)
Hyundai(现代)
IBM (International Business Machine Corp.,国际商业机器)
IDG(International Data Group,国际数据集团)
IDT(Integrated Device Technology, Inc. 综合设备技术公司)
ICS(Integrated Circuit Systems,集成电路系统)
IIYAMA(饭山)
Imagic(梦想家)
Intel(英特尔)
Iwill(艾崴)
IMS: International Meta System
Infineon(亿恒,英飞凌)
Iomega(艾美加)
ITE(Integrated Technology Express, Inc. 综合技术加速公司)
JetBoard(捷波)
Jetway(捷锐)
Jhncc(华鑫)
JNC(捷讯)
Joytech(阿波罗)
K&G(将王)
Kinpo(联宝)
Kingfore(金佛)
Kinghorse()
Kingmax(胜创)
KingNet(金浪)
Kingstone(金仕顿)
Kodak(柯达)
lander(建达蓝德)
LangChao(浪潮)
Leaktek(丽台)
Legend(联想)
LEMEL(联强)
LEO(大众)
Lexmark(利盟)
LG(乐金)(Goldstar,高士达)
Liteon(建兴)
Longway(龙维)
Lucent(朗讯)
LuckyStar(联胜)
MagicPro(辉煌)
MAG(美格)
MANLI(万丽)
Matsonic(松力)
Maxtor(迈拓)
Maxell(万胜)
Maxtor(迈拓)
MediaTek(联发)
Megastar(皇朝)
Megtron(美创)
Microsoft(微软)
Micron(美光,美凯龙)
Microtek(全友(台湾中晶))
Mida(美达)
Minolta(美能达)
Mitsubshi(三菱)
Mitsumi(美上美)
MLE:Microsoft Learning and Entertainment,微软教学与娱乐公司
MoSyS(Monolithic System Technology, Inc.,单片电路系统技术公司)
Motorola(摩托罗拉)
MS(Microsoft,微软)
MSI(MicroStar,微星)
Mustek(台湾鼎展科技)
Nanya(南亚)
NAI: Network Associates Incorporation,前身为McAfee。
National(松下)
NDL(Numerical Design Limited,数字设计有限公司)
NEC(日电)
NETAC(朗科)
Nightingale(夜莺)
Nikon(尼康)
Nissan(日产)
NMC(New Media Communication,新型媒体通信)
NOKIA(诺基亚)
Norcent(宏盛)
NS(National Semiconductor,国家半导体)
NTC(Nanya Technology Corp. ,南亚科技)
NTT(nippon telegraph and telephone,日本电报和电话公司)
NumberNine(第9)
OAK(海洋)
Octek(海洋)
Olympas(奥林巴斯)
OMEGA(奥米加)
Ondata(昂达)
Origo(欧瑞格)
Palit(小精灵)
Panasonic(松下)
Paradise(奔驰/新天下)
pcchips(明致/鑫明)
PenPower(蒙恬)
Penrod(彭路得)
Permier(普立尔)
Philips Semiconductors(飞利普半导体)
Pilotide(旗舰)
Pine(松景)
Pioneer(先锋)
PMI: Pacific Magtron International
PowerColor(憾讯)
PROCOMP(博达)
QDI(Quality Delivery Innovation,品质递送创新,联想)
QDI(Quantum Design Incorporation,量子设计公司)
Quanta(广达)
Quantum(昆腾)
Quantum3D(昆腾3D)
Qxcomm(全向)
RCC(Reliance Computer Corporation,信心计算机公司,ServerWorks的前身)
Realtek(瑞昱)
Redfox(红狐)
Ricoh(理光)
Rongfeng(融丰)
RPE(Royal Philips Electronics,皇家飞利浦电子公司)
Samaung(三星)
Sanyo(三洋)
SAST(先科)
SBELL(上海贝尔)
SCE(sony computer entertainment,索尼计算机娱乐部)
Seagate(希捷)
Seagull(海鸥)
SeeThru(世和资讯)
SGI(Silicon Graphics Inc,硅图形公司)
SMC(Standard Microsystems Corp. 标准微系统公司)
SMIC(Semiconductor Manufacturing International Corporation,中芯国际集成电路制造有限公司)
Shuttle(浩鑫)
Siemens(西门子)
SIPIX(矽峰)
SiS(Silicon Integrated Systems,硅片综合系统公司,矽统)
Soltek(硕泰克)
Sony(索尼)
Soyo(梅捷)
Sparkle(旌宇)
Speedy(讯怡)
Start(Star,实达)
STM(STMicroelectronics,意法半导体,由意大利SGS Microelettronica及法国Thomsom半导体公司合并而成)
Stones(四通利方)
Sun Microsystems(升阳/太阳微系统)
SuperMicro(超微)
Superpower(上普)
Taicom(台康)
Teac(泰克)
Teclast(台电)
Tekram(建邦)
TENDA(吉顺通)
Thunis(清华紫光)
TI(Texas Instruments Inc. 德州仪器)
Titan(提坦)
Togotech(岛谷科技)
Tontru(同创)
TopStar(国傲通,顶星)
TORiSAN(三井)
Toshiba(东芝)
TP-link(普瑞尔)
Transmeta(全美达)
Trident(泰鼑)
Triplex(启亨)
TSMC(Taiwanese Semiconductor Manufacturing Company,台湾积体电路)
TW(同维)
TwinMOS(勤茂)
Transcend(创建、宇瞻)
Twinhead(伦飞)
Tyan(泰安)
UEI(Universal Electronics Inc.,世界电器)
Umax(力捷)
UMC(United Microelectronics Corporation,台湾联华电子公司,半导体制造商)
Uniark(天虹)
Unika(双敏)
USI(Universal Scientific Industrial,通用科学工业)
USTC(Union Semiconductor Technology Corp,联合半导体技术公司)
V^3(V Cubed Semiconductor,V立方半导体)
VIA(威盛)
ViewSonic(优派国际)
Viguar(伟格)
VuegoBrisa(明基电通)
WD(Western Digital,西部数据)
Winbond(华邦)
Wintime(富品)
Winward()
Xerox(施乐)
XGI(Xabre Graphic Inc,前图强,SiS的独立的图形芯片业务部门)
Xoceco(厦华)
Yamaha(雅马哈)
Yuan(小影霸)
ZD(Ziff-Davis出版公司)
Zeling(则灵)
Zida(华基)
Zoltrix(速捷时)


12、组织和会议
ADT(Advanced DRAM Technology,高级内存技术)
ANSI(American National Standards Institute,美国国立标准协会)
BAD(Best Amiga Dominators)
CBF: Cable Broadband Forum,电缆宽带论坛
CEA(Consumer Electronics Association,消费者电子协会)
CEMA(Consumer Electronics Manufacturing Association(消费者电子制造业协会)
CPE: Customer Premise Equipment(用户预定设备)
CSA(Canadian Standards Association,加拿大标准协会)
DCA: Defense Communication Agency,国防部通信局
DOJ: Department of Justice(反不正当竞争部门)
DSP: Delivery Service Partner(交付服务合伙人)
DVB:Digital Video Broadcasting,数字视频广播
E3(Electronic Entertainment Expo,电子娱乐展览会)
EFF: Electronic Frontier Foundation(电子前线基金会)
EPA(Environmental Protection Agency,美国环境保护局)
ETRI(Electronics and Telecommunications Research Institute,电子和电信研究协会)
FCC(Federal Communications Commission,联邦通信委员会)
FTC(Federal Trade Commission,联邦商业委员会)
GDC(Game Developer Conference,游戏发展商会议)
HTTC(HyperTransport Technology Consortium,HyperTransport技术协会)
ICT(Information and Communications Technology,信息和通讯技术)
IEC(International Electrotechnical Commission,国际电子技术委员会)
ISSCC(International Solid-State Circuits Conference,国际晶体管电路讨论会)
ICSA: International Computer Security Association(国际计算机安全协会),它的前身为NCSA(National Computer
Security Association,国家计算机安全协会)
ITU(International Telecommunications Union,国际电信同盟)
IEEE(Institute of Electrical and Electronics Engineers,电子电路工程师协会)
IETF(Internet Engineering Task Force,因特网工程任务组)
IFWP: International Forum White Paper,国际白皮书论坛
ISC(International Steering Committee,国际筹划指导委员会)
ISO/MPEG: International Standard Organization's Moving Picture Expert Group(国际标准化组织的活动图片专家组)
ISOM(International Symposium on Optical Memory,光盘国际会议)
ISSCC(IEEE International Solid-State Circuits Conference,IEEE国际固态电路协议)
ITAA: Information Technology Association of American,美国信息技术协会
ITWG(international technology working groups,国际技术工作组)
JCIA(Japan Camera Industry Association,日本摄影机工业协会)
JEDEC(Joint Electronic Device Engineering

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