The causes and optimization measures of open circuit in packaging process

In electronics manufacturing, (Open Circuit) is a common problem, which can cause the current in the circuit to fail to flow, thus affecting the function of the entire electronic product. We can further refine and expand these contents for the reasons of open circuit and its improvement suggestions.

Cause and detailed analysis

1.1 Open circuit caused by pin coplanarity

Coplanarity problems: There may be small differences in the height of the pins of the components (e.g. QFP pin ±25μm), which may cause some pins to fail to make adequate contact with the solder during welding.

Solder paste thickness: The thickness of the solder paste printing also affects the solder joint quality. A paste that is too thin may not cover all pins, while a paste that is too thick may cause other problems (such as bridging).

Solution: In addition to reducing the non-coplanarity of the pins and adjusting the thickness of the solder paste, you can also consider using components with better coplanarity, or using advanced welding techniques (such as laser welding) to ensure solder joint quality.

1.2 Pillow-shaped solder joint caused by pin oxidation

Oxide layer: The oxide layer on the pin surface prevents wetting between the solder and the pin, resulting in a poor solder joint.

The solution:

Pretreatment: Clean or deoxidize the pins/pads before welding.

Use high-activity solders: Choose solders with higher activity to improve wettability.

Control the welding environment: Keep the welding area clean and dry, and use an inert gas atmosphere to reduce oxidation

1.3 Other open circuit reasons

Stele and core suction: These phenomena can cause irregular shape of solder joints and affect electrical connections.

Placement alignment: Inaccurate placement of components or printed boards can also lead to an open circuit.

Warping: The warping of a printed board or component may stress the solder joints, causing an open circuit.

Solution:

Optimize the welding process to reduce the occurrence of stele and core suction.

Improve the accuracy of automatic mounting equipment to ensure the accurate placement of components.

The warping of printed boards and components should be considered in the design, and appropriate reinforcement measures should be taken.

Detailed implementation of improvement and optimization measures

(1) Refer to the solution of poor wetting, stele and core suction

Poor wetting: using the previously mentioned cleaning, deoxidation, use of active solder and other methods.

Set up a monument: adjust welding parameters (such as preheating temperature, welding time), optimize pad design, use flux, etc.

Core suction: Control of gas flow during welding, use of appropriate solder formulations, etc.

(2) Strengthen the components or avoid localized heating

Reinforcement: The components are reinforced before welding to reduce movement and deformation during welding.

Uniform heating: Optimize the heating equipment to ensure uniform heat distribution during welding and avoid local overheating.

(3) Improve the alignment of the patch

High-precision equipment: the use of higher precision automatic mounting equipment.

Visual inspection system: A visual inspection system is introduced in the mounting process to monitor and adjust the location of components in real time.

(4) Reduce the temperature gradient between the printed board and the components

Preheat: Preheat the printed board and components before welding so that they reach a similar temperature.

Optimize the heating curve: According to the material characteristics of printed boards and components, design a reasonable heating curve to reduce temperature gradients.

(5) HASL printed board to avoid the formation of excessive intermetallic compounds

Control the thickness of the coating: Control the thickness of the coating during the HASL (hot air smoothing) process to avoid excessive thickness resulting in excessive intermetallic compounds.

Select the right material: Select the coating material that is not easy to form intermetallic compounds.

Post-treatment: Proper post-treatment is performed after welding to remove excess intermetallic compounds or improve solder joint quality.