翻译

  ICT,ATE 是根據電器特性進行元件測試﹐ATE與ICT的差別在于﹕1.ATE 測試時比ICT多測試T/U元件;

 

2.ATE可以通過模擬電源測試各電壓﹐而ICT不可以實現﹔

 

       ICT,ATE 共同缺點﹕1.大電容與小電容并聯﹐小電容不能COVER  如800UF與100NF; 2. 小電阻與大電阻并聯時﹐大電阻不會COVER;  3.MOS管并聯﹐不能COVER其中一個﹔4. 受治具空間的影響﹐某些功能不能實現﹔5.特殊元件不能實現測試﹐如溫控電阻﹐雷擊電阻等﹔

 

      如何規定哪些元件用ICT, ATE cover ﹕   能有測試點的元件都要求加入ICT/ATE測試。

 

如何定義ICT, ATE cover rate:     元件有在測試﹐機器自動算出COVER RATE;

 

為何不斷修改coverge, 不能一次完成:     cover 能力 是不斷提高的。  通過大家的反應和TE的不斷試驗去發現問題并想辦法去COVER它 "

 

 

 

 

ICT( In Circuit test)  ATE(Auto Test Equipment)

The elements of testing by ICT&ATE on motherboard is according to its electrical character. The different between ICT and ATE  as follow:

1.         T/U components are tested by ATE but no ICT.

2.         ATE can simulate the M/B power supply, then test the voltage on specifically point.

 

The disadvantage both in ICT and ATE:

1.         Small capacitance miss can’t be cover when it parallel connects with big capacitance. For example when one 800UF parallel connects with one 100Uf, the 100UF capacitance couldn’t be covered.

2.         as the same, when a small resistance parallel with a big one, the big resistance can’t be covered.

3.         if MOS&FET parallel with another, ICT&ATE just can covered when both of them are fail;

4.         some functions can’t be performanced limited by the space of fixture.

5.         special component couldn’t be tested, such as thermal resistance,

 

How to decide the component should test by whether ICT or ATE:

  

All the components connected with test point should by test in ICT/ATE.

 

How to define the coverage of ICT/ATE.

 

 

Cover rate could be calculate automatically (by machine)

Why need to modify the coverage again and again, can’t be finished once.

 

 

The competence of coverage has been advancing constantly.

 

Based on others’ feedback and TEs’ attempt, we can found out the problem and try to solve it.