MT8735_Thermal设计参考资料

MT8735_Thermal_Design_Notices_V0.1

MT8735平台的热策略：

1.手机设计的热考虑

– 对于超薄手机，手机表面的热点明显。在手机或面板背面涂上散热片材料，可以帮助减轻手机表面的热点。建议制作热螺旋体在手机厚度<10 mm的情况下进行设计。(铜箔，石墨是散热片材料)
– 电话厚度要求小于8mm，建议采用金属框架设计。铝镁合金是一种应用广泛的设计。它具有良好的热性能和强度的手机设计。
– MT8735是催化裂化(FCCSP)型包装，在包装顶部进行传热规划是设计中的一项重要的热策略。
– 适用于热设计，摊铺机式屏蔽壳必须应用于设计。
– 在AP顶部与屏蔽壳之间附加TIM是良好的热性能设计。TIM被推荐用于MT8735热设计。
– 在MT8735平台上，PCB尺寸是影响AP性能的关键因素。建议PCB尺寸必须大于3000毫米的设计。
– 较小的PCB会影响AP的性能。如果PCB面积小于推荐面积3000 mm2，则必须添加高性能热解决方案，以弥补PCB尺寸的性能缺口。

2.MT8735性能指标的热设计清单

– 在AP的顶部和底部规划冷却路径是非常重要的。
    AP底部：PCB区域主要是冷却溶液(如果PCB面积小于3000 mm2，请在PCB背面添加热溶液以进行热改善)。
    AP顶部：在AP与屏蔽机箱之间加添TIM
– 在MT8735上应用热摊铺机材料缓解手机表面热点
    附着铜箔或石墨提高计划热性能消除面板热点
    在手机后盖上石墨将有助于缓解手机表面的热点。
– 黑体字项目对AP性能有明显的影响。

MT8735原文资料内容：

1.Thermal Consideration on Phone Design
– For slim phone, hot spot on phone surface was obviously. Apply heat spreader material on back cover of phone or panel side can help to mitigate hot spot on phone surface. Suggest to make heat spreader design in on phone thickness < 10mm. (copper foil, graphite are heat spreader material)
– Requirement for phone thickness was less than 8mm, metal-frame design was recommended for design. Al-mg alloy is popular design for application. It had good thermal performance and strength for phone design.
– MT8735 is FCCSP type package, to plan heat transfer on top side of package is an important thermal strategy for design.

– Apply TIM for thermal design, spreader type shielding case must be applied for design.

– Attach TIM between AP top side and shielding case was good design for thermal performance. TIM was recommended for MT8735 thermal design.

– In MT8735 platform, PCB size is a key factor for release AP performance. Suggest PCB size must be large than 3000 mm2 for design.

– Small PCB will suffer AP performance. If PCB area is less than recommending area 3000mm2, high performance thermal solution must to be added for cover performance gap in PCB size.

2.Thermal design list for MT8735 performance target