Processor
NumberTwo or Four SPARC M7 32-Core 4.133GHz processors
ArchitectureSPARC V9 architecture, ECC protected
CPUs4.133GHz 32-Core
Up to 256 threads per processor (up to 8 threads per core)
Cache Per Processor:
Level 1: 16 KB instruction and 16 KB data per core
Level 2: 256 KB L2 I$ per four cores, 256 KB L2 D$ per core pair
Level 3: 64 MB L3$ on chip
Eight accelerators per processor, each supporting four concurrent in-memory query operations with decompression
Thirty-two on-chip encryption instruction accelerators with direct nonprivileged for 15 industry-standard cryptographic algorithms: AES, Camellia, CRC32c, DES, 3DES, DH, DSA, ECC, MD5, RSA, SHA-1, SHA-224, SHA-256, SHA384, SHA-512
Main Memory
CapacitiesTotal DIMM slots:64
DIMM types:DDR4-2133
DIMM size:16GB, 32GB or 64GB
Maximum Configuation (2 processor): 2TB (32 × 64GB)
Maximum Configuration (4 processor):4TB (64 × 64GB)
Standard Integrated Interfaces
Network4 × 10 GbE 100Mbps/1Gbps/10Gbps ports, full duplex only, auto-negotiating (rear)
Network ManagementOne dedicated 10/100Base-T NET MGT port (rear)
Note: This port does not support connections to Gigabit networks.
Serial ManagementTwo RJ-45 SER MGT ports (1 front, 1 rear)
Remote ManagementOnboard system processor, running Oracle Integrated Lights Out Manager (ILOM)
GraphicsTwo high-density DB-15 video ports (1 front, 1 rear)
USBFront: 2 USB 3.0 Ports
Rear: 2 USB 3.0 Ports
Internal: 1 USB 2.0 Port
PCI Expansion Slots16 low-profile PCI-Express 3.0 slots (eight x8 & eight x16) accessed via a PCIe hot-plug carrier
Internal Mass Storage
Disks600GB or 1.2TB 2.5-inch SAS-3 disk drives (up to 8)
400GB, 800GB 2.5-inch SAS-3 solid state drives (up to 8)
1.6TB or 3.2TB NVMe solid state drives (up to 8 with optional NVMe switch cards)
RAID 0, RAID 1, and RAID 1E support
Power Supplies
4 × 3,000 Watt, hot-swappable, 2+2 redundant power supply units (PSU)
Environment
Power Consumption Online power calculator
Voltage200 to 240 VAC
Frequency50 to 60 Hz
Maximum operating input current at 200 VAC22.9A (16A per cord) (Actual amperage draw may exceed rating by no more than 10%)
Maximum operating input power at 200 VAC4,498W (Actual power draw may exceed rating by no more than 10%)
TemperatureOperating:5° C to 35° C (41° F to 95° F)
Nonoperating:-40° C to 65° C (-40° F to 149° F)
Note: Decrease in maximum temperature: above 900 m (2,952 ft.) 1° C/300 m (1.8° F/984 ft.)
HumidityOperating:10% to 90% relative humidity noncondensing, 27° C (81° F) wet bulb
Nonoperating: 93% relative humidity, noncondensing, 38° C (100° F) wet bulb
AltitudeOperating:0m to 3000m (9,840 ft.) except in China markets where regulations may limit installations to a maximum altitude of 2,000 m
Nonoperating:0m to 12000m (39,370 ft.)
Acoustic NoiseOperating at peak power:9.4 B (LwAd, 1B = 10dB)
Operating/Idling: 79.7dB (LpAm, bystander positions)
RegulationsMeets or exceeds the following requirements:
SafetyUL/CSA 60950-1 (2nd Ed), EN 60950-1(2nd Ed), IEC 60950-1(2nd Ed) CB Scheme with all country deviations, CNS 14336-1
EMI/EMCFCC 47 CFR 15, ICES-003, EN55022, EN61000-3-2, EN61000-3-3
ImmunityEN 55024
Regulatory MarkingsNorth America Safety (NRTL), European Union (EU), International CB Scheme, BIS (India), BSMI (Taiwan), RCM (Australia), MSIP (Korea), VCCI (Japan)
European Union DirectivesRestriction of Hazardous Substances (RoHS) Directive 2011/65/EU, Low Voltage Directive 2014/35/EU, EMC Directive 2014/30/EU, and 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) Directive, 2012/19/EU
Dimensions and Weight
Height215 mm (8.5 in.) 5RU
Width445 mm (17.5 in.)
Depth835 mm (32.9 in.)
Weight (approximations)Fully Populated: Appx 89.6 kg (197 lbs) (Includes two processor modules, 64 DIMMs, 8 disk drives, 16 PCIe cards, does not include rackmount kit or system packaging)
Half Populated: Appx 83.5 kg (184.1 lbs) (Includes one processor module, one processor filler module, 32 DIMMs, 8 disk drives, 16 PCIe cards, does not include rackmount kit or system packaging).
Clearance and Service Access
Front914.4 mm (36 in.)
Rear914.4 mm (36 in.)