本文介绍了一种半导体器件设计，包括两个芯片：一个基本芯片和一个包含高速串行接口的芯片。高速串行接口负责在芯片间通过串行总线与外部设备高效传输数据。特别关注了两芯片上连接区域的布局，一侧的pad区域用于连接外部设备，另一侧连接内部电路。
摘要：
A semiconductor device includes a first semiconductor chip, and a second semiconductor chip which includes a high-speed serial I/F circuit which transfers serial data between the high-speed serial I/F circuit and an external device through a serial bus and is stacked on the first semiconductor chip. A pad region in which pads (electrodes) for connecting the external device and the high-speed serial I/F circuit are disposed is provided along a first side of the second semiconductor chip which is the short side. A pad region in which pads for connecting an internal circuit included in the first semiconductor chip and the high-speed serial I/F circuit are disposed is provided along a second side of the second semiconductor chip which is the long side.
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