拆机箱太有趣啦~~~~

由于机子不能上网,组长把机箱拆了开来,换了块网卡,瞬间找到了问题所在——网卡坏了。
于是我又学会了一招如何解决不能上网的问题。
下午,我的机子又不能上网了(不知道自己为什么老遇到这样的问题)。于是马上把机子拆了开来,顺便也拆了朱哥的机子,嘿嘿!把朱哥的网卡换在了自己的机子上,结果没驱动。只好把自己新买的网卡换在了朱哥的机子上,发现竟没有问题?!于是又把自己的网卡弄下来,换了一个插槽弄上了自己的机子,结果就能上网了。开心之余还有一丝惆怅,问题太小了,都没机会找组长来解决,又少了一次学习的机会~~~~
仔细装上两个机子,开心的上网了~~~
不一会突然发现桌子上多了三个螺丝???
哪的呢???想了半天不记得是在哪拆下来的,反正不少东西就行了~~~~~~~

转载于:https://www.cnblogs.com/gengxiaochao/archive/2007/09/17/896282.html

Abstract This standard describes VITA 46.0 Advanced Module Format for VMEbus systems, an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. Foreword VME has been the de-facto bus standard for Commercial off the Shelf ( COTS ) Circuit Card Assemblies since the 1980’s. VME boards have proven to be remarkably capable of evolving to support newer technologies with innovations such as VME Subsystem Bus, PCI Mezzanine Cards (PMC’s) and VME320. However, advances in technologies, appearing particularly in interconnects, have demonstrated the need for an advance in system development. This advance needs to accommodate high speed interconnect, particularly serial interconnects, and higher power delivery in concert with better heat removal. This draft standard addresses these needs in the context of IEEE 1101 form factor modules. Other specifications may address alternate outlines, such as VITA-48 (Draft). Because electronics miniaturization is driving the plug-in module I/O count, most system interconnects will need:  Multi-gigabit differential technology  Core computing cluster switched fabrics  Serial RapidIO, PCI Express, Advanced Switching Interconnect  Sufficient ports to enable distributed switching or centralized switching The plethora of high-speed interfaces available for tomorrow’s plug-in modules:  Network interfaces (Fibre Channel, 10 GbE XAUI, Infiniband…,)  Digital video (TMDS, PanelLink, OpenLDI…)  Mass storage interface (Fibre Channel, Serial ATA…,)  FPGA-based inter-board connections (e.g. Xilinx RocketIO)  Custom sensor interfaces VITA 46 provides an evolutionary roadmap for VME users:  To leverage the broad spectrum of high-speed interconnect technologies  Backward compatibility with VME bus electrical, software and selected mechanicals  Enables heterogeneous architectures which preserve existing investments in COTS-based systems  Addresses both 3U and 6U form factors with commonality  Harsh environment fit ‘designed-in’ up front in the standard  Rugged air or conduction-cooled form factors  High value placed on rear-panel I/O  High-speed connector survivability/compliance
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