windows-ch341转iic协议工具和驱动
1 在c盘下以管理员权限运行i2c_driver.EXE,安装驱动;
安装完之后打开设备管理器,会新增外部接口设备,注意这里不是新增端口;
>>外部接口>>USB-EEP/I2X...CH341A
2 打开供应商的i2c工具;即可使用iic读写;
SGM4808数据手册
音频点击弹出消除器,
专为高保真音响系统(HiFi Audio System)或便携式设备设计
音频点击弹出消除器的主要功能是在音频信号传输或电源切换时,减少或消除由于各种因素(如开关动作、电源不稳定等)产生的点击和弹出噪声
HDCP2.2协议规范的pdf
一份中文,一份英文的;
是hdcp2.2应用在HDMI上的协议文档;
中国移动家庭类蓝牙设备接入规范.pdf
中国移动蓝牙协议的profile
本标准主要规定了中国移动智慧家庭蓝牙设备与和家亲APP及蓝牙中枢间的接入方式
及通讯要求,供合作伙伴进行设备对接和集成开发。
quartus-modelsim工具.rar
包含文件MentorKG.exe和patch_dll.bat;适用于modelsim-altera系列和modelsim系列的大部分版本;笔者所用版本为modelsim-altera10.1d;
1.下载本文件;
2.复制文件中的MentorKG.exe和patch_dll.bat到Modelsim安装目录的win32aloem文件夹下
3.运行patch_dll.bat,将生成的LICENSE.TXT文件另存为LICENSE.dat并置于此文件夹下
4.在环境变量的用户环境变量一栏新建环境变量MGLS_LICENSE_FILE、LM_LICENSE_FILE指向LICENSE.dat
C6678-SPIboot-usersManual.pdf
C6678 SPI Boot Example
Purpose
The purpose of this lab is to demonstrate all the steps that are needed to boot an allocation from SPI
flash memory.
Dependencies:
Code composer Studio v5 or v6
MCSDK or Processor SDK RTOS software for C6678
Note: Files under mcsdk_2_01_XX_YY\tools\boot_loader have been moved to
pdk_c66xx_2_0_0\packages\ti\boot
Task 1: Observe the source file and build the application. Verify that it works
correctly
The example application included in the package can be built using gmake or CCS in the Windows
environment
MT6328_PMIC_Data_Sheet_V1.pdf
完整版数据手册,共304页;
Document Revision History .............................................................................................2
Table of Contents..............................................................................................................3 1 Overview ..................................................................................................................6
1.1 Features ..................................................................................................................................... 6
1.2 Applications............................................................................................................................... 6
1.3 General Descriptions................................................................................................................. 6
1.4 Ordering Information ................................................................................................................7
1.5 Top Marking Definition .............................................................................................................7
1.6 Pin Assignments and Descriptions .......................................................................................... 8 2 Electrical Characteristics ....................................................................................... 13
2.1 Absolute Maximum Ratings over Operating Free-Air Temperature Range .........................13
2.2 Thermal Characteristic ............................................................................................................13
2.3 Pin Voltage Range ....................................................................................................................13
2.4 Recommended Operating Range ............................................................................................ 17
2.5 Electrical Characteristics ......................................................................................................... 17
2.6 Regulator Output .....................................................................................................................18
2.7 Driver ....................................................................................................................................... 25
2.8 Class AB/D Audio Amplifier................................................................................................... 25
2.9 Audio CODEC.......................................................................................................................... 29
2.10 Battery Charger ........................................................................................................................35
2.11 BC1.x .........................................................................................................................................35
2.12 Down Load Without Battery....................................................................................................35
2.13 AUXADC.................................................................................................................................. 36
2.14 Fuel Gauge............................................................................................................................... 36
3 Functional Descriptions......................................................................................... 37
3.1 General Descriptions................................................................................................................37
3.2 PMIC Functional Blocks ..........................................................................................................37
3.2.1 Power-On/Off Sequence .......................................................................................... 38
3.2.2 Buck Converter and Application Reference ............................................................ 40
3.2.3 Low Dropout Regulator (LDOs) and Application Reference ..................................41
3.2.4 Drivers ....................................................................................................................... 43
3.2.5 Vibrator Driver.......................................................................................................... 44
3.2.6 Audio CODEC and Accessory Detection.................................................................. 45
3.2.7 Class-AB/D Audio Amplifier.................................................................................... 46
3.2.8 Battery Charger (Charger Controller).......................................................................47
3.2.9 AUXADC ....................................................................................................................51
3.2.10 Fuel Gauge .................................................................................................................51
w25q128fv rev.m 05132016 kms.pdf
2. FEATURES................................................................................................................................................ 5
3. PACKAGE TYPES AND PIN CONFIGURATIONS ................................................................................... 6
3.1 Pin Configuration SOIC / VSOP 208-mil........................................................................................... 6
3.2 Pad Configuration WSON 6x5-mm / 8x6-mm .................................................................................. 6
3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm .................................................. 6
3.4 Pin Configuration SOIC 300-mil........................................................................................................ 7
3.5 Pin Description SOIC 300-mil ........................................................................................................... 7
3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array).............................................................. 8
3.7 Ball Description TFBGA 8x6-mm...................................................................................................... 8
3.8 Pin Configuration PDIP 300-mil ........................................................................................................ 9
3.9 Pin Description PDIP 300-mil............................................................................................................ 9
4. PIN DESCRIPTIONS............................................................................................................................... 10
4.1 Chip Select (/CS) ............................................................................................................................ 10
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................................... 10
4.3 Write Protect (/WP)......................................................................................................................... 10
4.4 HOLD (/HOLD)................................................................................................................................ 10
4.5 Serial Clock (CLK) .......................................................................................................................... 10
4.6 Reset (/RESET) .............................................................................................................................. 10
5. BLOCK DIAGRAM................................................................................................................................... 11
6. FUNCTIONAL DESCRIPTIONS.............................................................................................................. 12
6.1 SPI / QPI Operations ...................................................................................................................... 12
6.1.1 Standard SPI Instructions...............................................................................................................................12
6.1.2 Dual SPI Instructions......................................................................................................................................12
6.1.3 Quad SPI Instructions.....................................................................................................................................13
6.1.4 QPI Instructions..............................................................................................................................................13
6.1.5 Hold Function .................................................................................................................................................13
6.1.6 Software Reset & Hardware /RESET pin .......................................................................................................14
6.2 Write Protection .............................................................................................................................. 15
6.2.1 Write Protect Features ...................................................................................................................................15
7. STATUS AND CONFIGURATION REGISTERS..................................................................................... 16
7.1 Status Registers.............................................................................................................................. 16
7.1.1 Erase/Write In Progress (BUSY) – Status Only..............................................................................................16
7.1.2 Write Enable Latch (WEL) – Status Only .......................................................................................................16
7.1.3 Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable .............................................................16
W25Q128FV
Publication Release Date: May 13, 2016
- 2 -
MT6328-MEDIATEK.pdf
数据手册,Document Revision History .............................................................................................2
Table of Contents..............................................................................................................3 1 Overview ..................................................................................................................4
1.1 Features ..................................................................................................................................... 4
1.2 Applications............................................................................................................................... 4
1.3 General Descriptions................................................................................................................. 4
1.4 Ordering Information ................................................................................................................5
1.5 Top Marking Definition .............................................................................................................5
1.6 Pin Assignments and Descriptions .......................................................................................... 6 2 MT6328 Packaging..................................................................................................11
2.1 Package Dimensions ................................................................................................................ 11
Appendix ........................................................................................................................ 12
Lists of Tables and Figures
Table 1-1. MT6328 pin descriptions ............................................................................................................ 6
Figure 1-1. MT6328 VFBGA 206 (6.6x6.6mm) pin assignment................................................................ 6
签名文件.rar signapk.jar platform.x509.pem platform.pk8
signapk.jar platform.x509.pem platform.pk8
一共包含三个签名文件,用来给安卓程序签名需要使用。
Fusion Digital Power Designer User Guide.pdf
Fusion Digital Power Designer User’s Guide
For Version 1.3.23 or Higher · User’s Guide Last Updated on 15 September 2007
Documentation for the Microsoft WindowsTM application used to monitor and configure Texas
Instruments UCD91XX and UCD92XX PMBusTM digital power controllers.
sllu093.pdf
USB TO GPIO转接器的使用说明。用作主机 PC(兼容 IBM™)与一个或多个从属器件(通过标准 A 型转迷你 B 型 USB 电缆实现)之间的接口适配器或桥接器。USB 接口适配器与主机 PC 之间的通信通过 USB 实现,而 USB 接口适配器与从属器件之间的通信通过内部集成电路 (I²C)、SMBus、PMBus 和/或通用输入/输出 GPIO 实现。桥接器转换 USB 与串行协议之间的通信事务
S50卡中文简介.pdf
非接触式IC卡中的一种,S50卡