IP设计工程师

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1. Lead/Senior Physical Design Engineer (Location: SH)

Position Description:

 Focus on high speed digital DDR and HBM IP physical implementation

 Have good physical design experiences in the digital implementation domain including Floorplan, P&R, Physical verification, DFM.

 Have a solid background in circuits, electronics & physics & should be very willing to learn new technology for advance node and design methodology

 Skilled in scripting language, such as Perl, C shell, Make file

 Feeling responsible for technical delivery, good team played, design quality/schedule focus

Position Requirements:

 Essential Qualifications: Have MS degree with 2 ~4+ years of applicable experience, MS degree with 4 ~ 6+years of applicable experience in electrical engineering, microelectronics.

 Essential that the individual demonstrates strong communication skill

 Requires good communication skills in English.

2. Lead/Senior Frontend Implementation Engineer (Location: SH/BJ)

Position Description:

 In charge of DDR and HBM IP Front End Implementation.

 Daily duties include: RTL design Integration, Logic Synthesis, DFT, Static Timing Analysis and Verilog Simulation.

 HDL language Knowledge, like verilog is necessary.

 C/C++/perl/tcl/csh/python, UNIX, Linux experience are plus.

 Excellent analytical and problem-solving skills. Quick learner-able to learn and apply technical and complex topics.

 Excellent communication skills and the uncanny ability in a cooperative team environment are required.

 Self-motivated, result-oriented, can take ownership and follow-through on tasks.

Position Requirements:

Essential Qualifications:

 Master degree or above, 2-5 year working experience

 Major in Micro-electronics, Electronic Engineering, Computer Science, Information Technology or equivalent

 Ability to work effectively alone or as well as in the team.

 Essential that the individual demonstrates strong communication, verbal and written

 Requires good communication skills in English.

Desirable Qualifications:

 Good at any following skill sets: ASIC design, FPGA design, Computer architecture, SOC design based on ARM/MIPS.

 Experience of DDR or memory IPs

3. Lead Product Engineer- DDR PHY (Location: SH)

Position Description:

 Cadence is looking for an individual to work in an established memory controller design IP team. The group provides configurable DDR memory controller and PHY IP for ASICs. The job will be mainly focused on providing technical support to customers, however there will be a variety of other engineering tasks that will allow the candidate to expand skills and responsibilities.

Provide technical support to customers for integration of IP into ASICs including:

 Debugging of customers’ simulation or silicon issues.

 Reviewing of customers’ integration of our IP.

 Reviewing static timing reports to assist with customers’ timing closure.

 Answering technical questions about IP operation.

 Train field engineers in IP operation.

 Interface with the R&D Team to bridge product improvements and resolve customer issues.

Position Requirements:

 Excellent oral and written communication.

 BS + 5 years of prior work-experience or MS + 2 years of prior work-experience

 All front-end skills – RTL design & verification in Verilog, synthesis, static-timing analysis, DFT

 Back-end skills – place & route, physical verification, timing closure

 Time management skills sufficient to balance multiple high-priority projects.

 Willingness to learn new skills and perform tasks that often go outside area of current expertise.

Additional Desirable Qualifications:

 Experience with Static Timing scripts and report analysis

 Familiarity with DDR memory operation, system applications, AXI, OCP, AHB

 Familiarity with Frame maker

 Scripting – in Perl, TCL, etc.

4. Senior Program Manager (Location: SH)

Position Description:

 We are looking for a Senior Program Manager who will be responsible for the overall coordination of Key Customer Engagements and R&D Development Projects within the Design IP Group. The candidate must have experience in IP and/or SoC Design and a history in successfully program managing complex IP/SoC Programs with end customers. A PMP Certification or equivalent is desirable.

Main Job Tasks and Responsibilities

 lead the planning and track the implementation of project

 facilitate the definition of project scope, goals and deliverables

 define project tasks and resource requirements

 develop full scale project plans

 manage/track project resource allocation

 plan and schedule project timelines

 track project deliverables using appropriate tools

 provide direction and support to project team

 support quality assurance

 constantly monitor and report on progress of the project to all stakeholders

 present reports defining project progress, problems and solutions

 implement and manage project changes and interventions to achieve project outputs

 manage customer engagement – project and relationship management

 collaborate with Sales, Marketing, Finance and Engineering to assure effective and efficient project execution

Position Requirements:

Education and Experience

 knowledge of both theoretical and practical aspects of project management

 knowledge of project management techniques and tools

 direct work experience in project management capacity

 proven experience in people management

 proven experience in strategic planning

 proven experience in risk management

 proven experience in change management

 proficient in project management software

 min 7+ years verifiable successes managing SoC/IP deliverables

 BSEE at a min. MSEE & MBA preferred

Key competencies

 critical thinking and problem solving skills

 planning and organizing

 decision-making

 communication skills

 influencing and leading

 team work

 conflict management

 adaptability

5. Principal Design Engineer (Location: BJ)

Position Description:

 Cadence/Tensilica is a leading provider of configurable embedded processor technology and DSPs for various markets. As a member of the DSP engineering group you will be responsible for verification of advanced DSP cores and their instruction set architectures and hardware implementations. You will implement architectural simulation test benches in C/C++/RTL, write C/assembly language diagnostics, assertion checkers or coverage monitors to meet target verification goals. You will also assist with developing test plans, debugging failures and analyzing coverage information. You will work closely with the market-specific DSP teams, Design Verification, and RTL and EDA teams.

Position Requirements:

 Knowledge of DSPs, instructions sets, computer arithmetic concepts, and processor architecture concepts

 Good knowledge of C (C++ will be a plus)

 Working knowledge of Verilog and popular EDA simulators and testbench methodologies

 Knowledge of scripting languages such as Makefile/Perl is desired

 Knowledge of assembly programming and programming in a high level language such as C

 Good English communication skills – both written and verbal

 Strong problem solving skills along with an ability to work independently and in cooperation with global teams

 MS degree in EE/CS with 3 to 5 years industry experience required.

6. Principal R&D Application Engineer (Location: SH)

Position Description:

 The Applications Engineer is responsible for working directly with customers, the internal development organization, sales/FAEs and other members of Cadence’s Xtensa Applications Engineering team. In this capacity, it is the direct responsibility of this individual to provide technical support, applications know how and training to use Cadence Tensilica’s microprocessor in SoCs.

Responsibilities:

 Provide support for Cadence’s Tensilica IP products, specifically hardware flow and verification for SoC implementation

 Become an expert and provide guidance on using Tensilica provided scripts for synthesis, place and route and layout. Also guide customers to use verification environment, power analysis scripts for Tensilica processors in stand-alone and/or embedded in an SoC.

 Provide customer training for general Xtensa architecture and tools.

 Provide quality solutions to customer issues in timely manner

 Influence future Xtensa products by providing customer feedback back to the hardware and software development groups.

 Work closely with Applications Engineering group located in San Jose, CA USA and Pune India to stay up-to-date with the latest tools and architecture.

Position Requirements:

 BS in EE/CS (MS preferred) or equivalent plus 8 to 12 years work experience.

 In-depth understanding of Computer architecture/ RISC processors/ DSPs

 Hands-on experience in DSP processor implementation in SoC.

 Hands-on experience in synthesis using latest technology libraries

 Expert knowledge hardware design basics, Verilog language and of using various hardware design products like Cadence RTL compiler

 Experience in development or testing of any of complex SoC using RISC or DSP processors. Deep knowledge of SoC system architecture, interfaces, and interconnects.

 Experience in SoC system simulation and verification.

 Familiar with on-chip bus protocols such as AMBA (AXI, AHB, APB), and on-chip trace and debug (JTAG, CoreSight).

 Knowledge of DSP processors like audio processing, image processing will be plus.

 Must have good English written and verbal communication skills as well as good problem solving skills.

 Able to travel occasionally within China and 2 to 4-weeks per year to International locations.


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