全志平台编译和打包系统(2)打包系统

转自:https://www.ebaina.com/articles/140000004575?utm_source=searchindex&utm_medium=list&utm_campaign=140000004575



1.前言
打包的好处:
其他平台是将kernel/uboot/rootfs编译好后直接分开烧写到flash中,分开的话必然需要用户在烧写的时候,指定烧写的bin文件。把这些整合到一个固件文件中的话,在烧写这些到flash的时候会自动去固件里面搜寻需要的内容,这样对用户更透明。
打包脚本为lichee/tools/pack/pack,固件打包主要做3件事:

 1. 将需要的资源文件和二进制文件拷贝到指定目录(lichee/tools/pack/out)
   
 2. 对某些文件进行必要的更新操作(如boot0/uboot头部信息等)

 3. 将lichee/tools/pack/out目录下的文件按照image.cfg、sys_partition.fex进行打包处理



2.拷贝文件
拷贝的文件类型分为几类:工具文件、配置文件、boot0/uboot文件。

工具文件:

split_xxxx.fex    
usbtool_test.fex    
cardscript.fex 		制作量产TF卡时指定boot0和uboot烧写到TF卡的位置 
cardtool.fex    
usbtool.fex    
aultls32.fex  


配置文件:

common/toc/toc1.fex    
common/toc/toc0.fex    
common/toc/boot_package.fex    
common/dtb/sunxi.fex    
common/imagecfg/image_linux.cfg 				linux固件配置表,表示生成固件必要哪些部件,当lichee/tools/pack/out目录下没有所有指定的部件时,打包固件将失败 。很重要,只针对生成linux固件
common/partition/sys_partition_dragonboard.fex 	规定了生成dragonboard固件时MBR中分区信息 ,只针对dragonboard固件
common/partition/sys_partition_linux.fex 		固定了生成linux固件时MBR中分区信息, 很重要,只针对linux固件
chips/${PACK_CHIP}/configs/default/* env.fex 	android固件的env分区
image.cfg 										android固件配置表
env_dragon.fex 									dragonboard固件env分区 
chips/${PACK_CHIP}/configs/${PACK_BOARD}/*.fex *.cfg
Sys_config.fex 									用户配置信息
Sys_partiton.fex 								android固件的分区配置表
Test_cofig.fex 									dragonboard固件的测试配置文件 


Boot0/uboot文件:

boot0_nand.fex 		有nand驱动的boot0
boot0_sdcard.fex 	有mmc驱动的boot0
boot0_spinor.fex 	有spinor驱动的boot0
bl31.bin  
scp.bin  
u-boot-spinor-*.bin 	经过裁剪,适用于spinor平台的uboot
u-boot-*.bin 			普通的uboot
fes1-*.bin 				usb烧写阶段初始化dram的,类似于boot0 ota相关的boot文件 



3.更新文件
到这里,用户的配置信息还没有放入到编译好的bin文件中。但是系统起来的某些关键部件的配置却在用户配置文件里面,比如dram/emmc/nand等的初始化参数就放在sys_config.fex里面。所以需要将这些信息塞到boot0/uboot头部。
转换配置文件
转换配置主要的脚本代码为:

script sys_config.fex > /dev/nullscript
sys_partition.fex > /dev/null

该脚本将用户易读的.fex文件转为代码易操作的.bin文件。最后就会生成sys_config.bin和sys_partition.bin两个文件,后面boot0和uboot就可以通过标准接口去读取sys_config.bin中用户配置。
更新boot0参数
boot0开机后会被自动从介质中读取到sram中,它主要的功能包括:初始化串口、初始化内存、读取uboot。所以必须将sys_config.fex中串口参数、dram参数、jtag参数以及storage参数写入到boot0中(boot0_file_head_t结构体中定义)
更新uboot参数
和boot0类似,也需将sys_config.fex某些配置值写入到u-boot中。主要包括:dram参数、CPU运行频率和电压、串口配置、工作模式(量产和启动)、存储介质类型(nand/emmc/spinor)、nand GPIO信息、sdcard GPIO信息,在spare_boot_data_head结构体中有详细说明。
生成MBR文件
mbr分区记录了固件中有多少个分区以及每个分区的起始地址和大小。它是使用下面的命令生成的:

update_mbr sys_partition.bin N(N为mbr的份数)

执行完这个命令后,将会生成sunxi_mbr.fex这个文件。
生成env分区文件
uboot优先使用env分区中的环境变量,如果没有env分区,则使用默认环境变量。现在针对camdroid和android平台




4. 生成固件
经过上面的操作后,即可以执行打包固件的操作了

dragon image.cfg sys_partition.fex

Image.cfg主要功能是:

 - 功能1 确定固件的必须组成部件 如果pack/out目录下没有image.cfg中指定的filename存在,则打包固件就会失败
 - 功能2 和sys_partiton配合生成固件索引表

当发生了下面两种情况,将执行固件打包流程:

(1)在lichee顶层目录执行./build.sh pack
(2)在android顶层目录执行 pack (可带参数)
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bpi_a64_android初步编译为LCD显示20170309_1442.7z banana pi a64 android6.0.1初步编译为LCD显示。初步设置。 bpi_a64_android的编译配置文件排版.txt 2017/3/9 14:33 0、压缩包的处理: rootroot@cm-System-Product-Name:/home/wwt/a64$ tar zxvf BPI-A64-Android_SourceCode.tar.gz 增加3个编译链 Notice: Please download this file to the correct path https://drive.google.com/open?id=0B_YnvHgh2rwjaVRrc2VoR0xLTlE (1)gcc-linaro-aarch64.tar.xz ==> /lichee/buildroot/dl (2)gcc-linaro-aarch64.tar.xz ==> /lichee/brandy/toolchain (3)gcc-linaro-arm.tar.xz ==> /lichee/brandy/toolchain 重新分块压缩: rootroot@cm-System-Product-Name:/home/wwt/a64$ tar zcvf - bpi_a64_android/ | split -b 3900000000 - bpi_a64_android_wyb_patch1.tar.gz 1、编译lichee内核 rootroot@cm-System-Product-Name:/home/wwt/a64$ rootroot@cm-System-Product-Name:/home/wwt/a64$ cd bpi_a64_android/ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android$ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android$ cd lichee/ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee$ ./build.sh config Welcome to mkscript setup progress All available chips: 0. sun50iw1p1 Choice: 0 All available platforms: 0. android 1. dragonboard 2. linux 3. camdroid 4. secureandroid Choice: 0 All available kernel: 0. linux-3.10 1. linux-3.4 Choice: 0 All available boards: 0. bpi-m64-hdmi 1. bpi-m64-lcd Choice: 1 rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee$ ./build.sh Copy boot.img to output directory ... Copy modules to target ... sun50iw1p1 compile Kernel successful INFO: build kernel OK. INFO: build rootfs ... INFO: skip make rootfs for android INFO: build rootfs OK. INFO: ---------------------------------------- INFO: build lichee OK. INFO: ---------------------------------------- rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee$ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee$ 2、编译Android rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee$ cd ../android/ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ source build/envsetup.sh including device/asus/deb/vendorsetup.sh including device/asus/flo/vendorsetup.sh including device/asus/fugu/vendorsetup.sh including device/generic/mini-emulator-arm64/vendorsetup.sh including device/generic/mini-emulator-armv7-a-neon/vendorsetup.sh including device/generic/mini-emulator-mips/vendorsetup.sh including device/generic/mini-emulator-x86_64/vendorsetup.sh including device/generic/mini-emulator-x86/vendorsetup.sh including device/htc/flounder/vendorsetup.sh including device/lge/hammerhead/vendorsetup.sh including device/moto/shamu/vendorsetup.sh including device/softwinner/bpi-m64-hdmi/vendorsetup.sh including device/softwinner/bpi-m64-lcd/vendorsetup.sh including device/softwinner/common/vendorsetup.sh including sdk/bash_completion/adb.bash rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ lunch You're building on Linux Lunch menu... pick a combo: 1. aosp_arm-eng 2. aosp_arm64-eng 3. aosp_mips-eng 4. aosp_mips64-eng 5. aosp_x86-eng 6. aosp_x86_64-eng 7. aosp_deb-userdebug 8. aosp_flo-userdebug 9. full_fugu-userdebug 10. aosp_fugu-userdebug 11. mini_emulator_arm64-userdebug 12. m_e_arm-userdebug 13. mini_emulator_mips-userdebug 14. mini_emulator_x86_64-userdebug 15. mini_emulator_x86-userdebug 16. aosp_flounder-userdebug 17. aosp_hammerhead-userdebug 18. aosp_hammerhead_fp-userdebug 19. aosp_shamu-userdebug 20. bpi_m64_hdmi-eng 21. bpi_m64_hdmi-user 22. bpi_m64_hdmi-userdebug 23. bpi_m64_lcd-eng 24. bpi_m64_lcd-user 25. bpi_m64_lcd-userdebug Which would you like? [aosp_arm-eng] 23 ============================================ PLATFORM_VERSION_CODENAME=REL PLATFORM_VERSION=6.0.1 TARGET_PRODUCT=bpi_m64_lcd TARGET_BUILD_VARIANT=eng TARGET_BUILD_TYPE=release TARGET_BUILD_APPS= TARGET_ARCH=arm64 TARGET_ARCH_VARIANT=armv8-a TARGET_CPU_VARIANT=generic TARGET_2ND_ARCH=arm TARGET_2ND_ARCH_VARIANT=armv7-a-neon TARGET_2ND_CPU_VARIANT=cortex-a15 HOST_ARCH=x86_64 HOST_OS=linux HOST_OS_EXTRA=Linux-3.13.0-24-generic-x86_64-with-Ubuntu-14.04-trusty HOST_BUILD_TYPE=release BUILD_ID=MMB29M OUT_DIR=out ============================================ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ extract-bsp /home/wwt/a64/bpi_a64_android/android/device/softwinner/bpi-m64-lcd/bImage copied! /home/wwt/a64/bpi_a64_android/android/device/softwinner/bpi-m64-lcd/modules copied! rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ make -j12 Creating filesystem with parameters: Size: 2147483648 Block size: 4096 Blocks per group: 32768 Inodes per group: 8192 Inode size: 256 Journal blocks: 8192 Label: system Blocks: 524288 Block groups: 16 Reserved block group size: 127 Created filesystem with 2422/131072 inodes and 260574/524288 blocks Install system fs image: out/target/product/bpi-m64-lcd/system.img out/target/product/bpi-m64-lcd/system.img+out/target/product/bpi-m64-lcd/obj/PACKAGING/recovery_patch_intermediates/recovery_from_boot.p maxsize=2192446080 blocksize=4224 total=1034077436 reserve=22146432 #### make completed successfully (57:57 (mm:ss)) #### rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ 3、打包img镜像 rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ pack -d /home/wwt/a64/bpi_a64_android/lichee/tools/pack/sun50iw1p1_android_bpi-m64-lcd_card0.img pack finish rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ pack /home/wwt/a64/bpi_a64_android/lichee/tools/pack/sun50iw1p1_android_bpi-m64-lcd_uart0.img pack finish rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/android$ 4、编译uboot(可选) rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee/brandy$ ./build.sh -p sun50iw1p1 CC external/openssl_ext.c ... make -C /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/spl/ CC /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/spl/ss_spl.c ... CC /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/spl/spc_spl.c ... CC /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/spl/smc_spl.c ... CC /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/spl/gic_spl.c ... CC /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/spl/debug.c ... CC /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/spl/ctype.c ... CC /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/spl/eabi_compat.c ... CC /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/spl/efuse_spl.c ... make -C /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/spl/lib/ make[3]: 没有什么可以做的为 `all'。 /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/../gcc-linaro/bin/arm-linux-gnueabi-gcc -E -include /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/include/u-boot/u-boot.lds.h -DSBROMSWADDR="(0x10480)" -ansi -D__ASSEMBLY__ -P - </home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/main/sboot.lds >/home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/sboot.lds /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/../gcc-linaro/bin/arm-linux-gnueabi-ld /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/dram/libchipid.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/dram/libdram.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/mmc/libmmc.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/arch/arm/cpu/armv7/sun50iw1p1/nand/libnand.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/flash/libflash.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/libs/libgeneric.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/load/libload.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/main/libmain.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/openssl/libopenssl.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/spl/libsource_spl.o /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/spl/lib/libgeneric.o -L /home/wwt/a64/bpi_a64_android/lichee/brandy/gcc-linaro/bin/../lib/gcc/arm-linux-gnueabi/4.6.3 -lgcc -T/home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/sboot.lds -o sboot.axf -Map sboot.map /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/../gcc-linaro/bin/arm-linux-gnueabi-objcopy -O binary /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/sboot.axf /home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/sunxi_spl/sbrom/sboot.bin "sboot_sun50iw1p1.bin" -> "/home/wwt/a64/bpi_a64_android/lichee/brandy/u-boot-2014.07/../../tools/pack/chips/sun50iw1p1/bin/sboot_sun50iw1p1.bin" rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee/brandy$ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee/brandy$ 5、配置menuconfig(裁剪内核) rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee$ ./build.sh config Welcome to mkscript setup progress All available chips: 0. sun50iw1p1 Choice: 0 All available platforms: 0. android 1. dragonboard 2. linux 3. camdroid 4. secureandroid Choice: 0 All available kernel: 0. linux-3.10 1. linux-3.4 Choice: 0 All available boards: 0. bpi-m64-hdmi 1. bpi-m64-lcd Choice: 1 rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee$ cd linux-3.10/ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee/linux-3.10$ cp .config bak1_orig.config rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee/linux-3.10$ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee/linux-3.10$ rootroot@cm-System-Product-Name:/home/wwt/a64/bpi_a64_android/lichee/linux-3.10$ make ARCH=arm64 menuconfig (1)改大打印缓存 General setup ---> (17) Kernel log buffer size (16 => 64KB, 17 => 128KB) 修改为: (18) Kernel log buffer size (16 => 64KB, 17 => 128KB) (2)只保留博通/正基的WIFI/BT:AP6212等 Device Drivers ---> [*] Network device support ---> [*] Wireless LAN ---> <M> Broadcom FullMAC wireless cards support (/system/vendor/modules/fw_bcmdhd.bin) Firmware path (/system/vendor/modules/nvram.txt) NVRAM path Enable Chip Interface (SDIO bus interface support) ---> Interrupt type (Out-of-Band Interrupt) ---> <M> Realtek 8723B SDIO or SPI WiFi <M> Realtek 8723BS_VQ0 WiFi <M> Realtek 8189F SDIO WiFi 修改为: < > Realtek 8723B SDIO or SPI WiFi < > Realtek 8723BS_VQ0 WiFi < > Realtek 8189F SDIO WiFi (3)关闭SELinux安全内核方便调试 Security options ---> [*] NSA SELinux Support [*] NSA SELinux boot parameter (1) NSA SELinux boot parameter default value [ ] NSA SELinux runtime disable [*] NSA SELinux Development Support [*] NSA SELinux AVC Statistics (1) NSA SELinux checkreqprot default value [ ] NSA SELinux maximum supported policy format version 修改为: [ ] NSA SELinux Support (4)在内核中增加USB摄像头/打开UVC的驱动 Device Drivers ---> <*> Multimedia support ---> [ ] Media USB Adapters ---> 修改为: [*] Media USB Adapters ---> --- Media USB Adapters *** Webcam devices *** < > USB Video Class (UVC) 修改为: <M> USB Video Class (UVC) [*] UVC input events device support (NEW)
Hololens 2是一款由微软开发的增强现实(AR)头戴式设备,用于开发和部署AR应用程序。下面是关于Hololens 2编译打包的介绍: 1. 开发环境准备:首先,您需要安装Windows 10操作系统,并确保已安装最新版本的Visual Studio和Windows SDK。您还需要下载并安装Hololens 2的开发工具包(HoloLens 2 Development Edition)。 2. 创建项目:使用Visual Studio创建一个新的Universal Windows Platform (UWP)项目。选择合适的模板,例如C#或C++。 3. 配置项目:在项目属性中,选择目标设备为Hololens 2,并选择合适的目标版本和最低版本。您还可以配置其他设置,如应用程序图标、权限等。 4. 编写代码:根据您的需求,编写AR应用程序的代码。您可以使用Unity引擎或直接使用C#或C++编写代码。 5. 调试和测试:使用Hololens 2模拟器或实际设备进行调试和测试。您可以在Visual Studio中启动调试会话,并在Hololens 2上运行和测试应用程序。 6. 打包应用程序:在完成开发和测试后,您可以将应用程序打包为可部署的应用程序包(.appx文件)。在Visual Studio中,选择生成解决方案并生成应用程序包。 7. 部署应用程序:将生成的应用程序包安装到Hololens 2设备上。您可以使用Windows Device Portal或通过USB连接将应用程序包传输到设备上。 8. 运行应用程序:在Hololens 2设备上,找到并启动已安装的应用程序。您可以通过手势、语音或控制器与应用程序进行交互。

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