DSP学习资料:基于6U VPX的 XC7VX690T+C6678的双FMC接口雷达通信处理板

 

基于6U VPX的 XC7VX690T+C6678的双FMC接口雷达通信处理板

 

 

  一、板卡概述

高性能VPX信号处理板基于标准6U VPX架构,提供两个标准FMC插槽,适用于电子对抗或雷达信号等领域的高性能采集、回放以及相关处理。通过扣接不同的数据接口FMC子卡的方式,可实现不同采样频率、不同量化位数、不同通道数、不同信号形式的采集、回放、处理的功能模块。高性能VPX信号处理板主要包含大规模FPGA、多核DSP、大容量DDR3存储器、FMC插槽、扩展IO、板载时钟等,模块原理框图如下图所示:

 

二、处理板技术指标

主FPGA子系统规格
  1) 支持扩展2个FMC子卡,符合VITA57标准;
  2) 选用Xilinx 公司Virtex7系列FPGA,型号XC7VX690T-2FFG1761I
  3) FPGA外挂2组DDR3 SDRAM,每组容量4GB,位宽64bit,工作速率1333MHz;
  4) 引出22对LVDS到背板P6;
  5) 引出4组4×GTX连接到P2,每对连接的传输速率不小于6Gbps,可根据需要配置为RapidIO、RocketIO、SATAII/III工作方式;
  6) 通过本地总线、RapidIO与DSP连接;
  7) 提供主FPGA所有接口代码的封装库;
DSP子系统规格
  1) 选用TI公司8核DSP,型号TMS320C6678,工作主频1GHz;
  2) 外挂1组DDR2 SDRAM,容量2GB,位宽64bit,工作速率533MHz;
  3) 提供1组4×RapidIO连接到FPGA;
  4) 通过EMIF总线与配置FPGA互联;
  5) 提供2×PCIe连接到P2;
  6) 提供2个千兆以太网到P4;
  7) 提供1个RS232串口到P4;
  8) 提供1个千兆以太网接口到前面板;
  9) 提供1个RS232串口到前面板;

配置FPGA子系统规格
  1) 选用Xilinx公司Spartan6系列FPGA,型号XC6SLX100;
  2) 配置FPGA用于模块配置控制管理,模块复位初始化管理,模块工作时钟网络管理等工作;
  3) 通过LBC总线与PowerPC互联;
  4) 外接NorFLASH和NandFLASH,NorFLASH容量1Gb;NandFLASH容量8GB;
  5) 输出1路串口到前面板;
  6) 可通过DSO经配置FPGA实现对V7 FPGA进行程序动态加载, S6 给V7 FPGA加载配置时钟不低于50MHz;
  7) 提供配置FPGA所有接口的源码封装库及源码工程。

 

 

转载于:https://www.cnblogs.com/orihard/p/11091299.html

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Abstract This standard describes VITA 46.0 Advanced Module Format for VMEbus systems, an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. Foreword VME has been the de-facto bus standard for Commercial off the Shelf ( COTS ) Circuit Card Assemblies since the 1980’s. VME boards have proven to be remarkably capable of evolving to support newer technologies with innovations such as VME Subsystem Bus, PCI Mezzanine Cards (PMC’s) and VME320. However, advances in technologies, appearing particularly in interconnects, have demonstrated the need for an advance in system development. This advance needs to accommodate high speed interconnect, particularly serial interconnects, and higher power delivery in concert with better heat removal. This draft standard addresses these needs in the context of IEEE 1101 form factor modules. Other specifications may address alternate outlines, such as VITA-48 (Draft). Because electronics miniaturization is driving the plug-in module I/O count, most system interconnects will need:  Multi-gigabit differential technology  Core computing cluster switched fabrics  Serial RapidIO, PCI Express, Advanced Switching Interconnect  Sufficient ports to enable distributed switching or centralized switching The plethora of high-speed interfaces available for tomorrow’s plug-in modules:  Network interfaces (Fibre Channel, 10 GbE XAUI, Infiniband…,)  Digital video (TMDS, PanelLink, OpenLDI…)  Mass storage interface (Fibre Channel, Serial ATA…,)  FPGA-based inter-board connections (e.g. Xilinx RocketIO)  Custom sensor interfaces VITA 46 provides an evolutionary roadmap for VME users:  To leverage the broad spectrum of high-speed interconnect technologies  Backward compatibility with VME bus electrical, software and selected mechanicals  Enables heterogeneous architectures which preserve existing investments in COTS-based systems  Addresses both 3U and 6U form factors with commonality  Harsh environment fit ‘designed-in’ up front in the standard  Rugged air or conduction-cooled form factors  High value placed on rear-panel I/O  High-speed connector survivability/compliance
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