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Handling EMI IN Swithc Mode Power Supply Design
Introduction
When designing switch mode power supplies (SMPS),
undesirable noise and Electromagnetic Interference (EMI)
are always present. Their effects are even more severe as the
switching frequency increases, especially in applications
requiring the use of small size transformer and capacitors.
This application note describes the nature and sources of
EMI noise, and the design techniques used to reduce their
shortcomings. All the examples of the circuitry used are
referred to flyback topology however, they are also
applicable to any other common SMPS topology.
Noise Sources
The most effective way to handle EMI is to minimize its
source, then use filters to filter away the remaining noise.
Therefore understanding the noise sources will greatly help
to reduce the effects of EMI.
Noise Generated in the Primary Side of the
Switching Regulator
In a linear regulator, output voltage regulation is achieved
by dissipating the voltage drop in the form of heat. The
switching regulator achieves output regulation by switching
on and off the output transistor and varying the on time.
However, switching the transistor on and off causes the
generation of high frequency noise.
Primary Voltage and Current Waveforms
The Drain–to–Source voltage of the transistor, VDS, has
a high dv/dt characteristics. At the same time, the leakage
inductance results in voltage spikes and ringing,
consequently generating noise due to the high dv/dt as
shown in Figure 1 and 2.
Typically, the collector or drain of the transistor is
connected to the tab of the package. (TO–220, TO247 and
etc.) The package’s tab becomes an antenna radiating noise.
Its effects become even more severe when a heatsink is
added on to it. In some high voltage regulator ICís like the
MC3337X Series, a relatively quiet source is connected to
the TO–220 tab to helps reduce the related common
2012-11-01
ELECTROMAGNETIC_COMPATIBILITY_INMICROWAVE_ENGINEERING
ELECTROMAGNETIC COMPATIBILITY IN MICROWAVE ENGINEERING
Outline
1.Printed circuit board design
2.Electromagnetic shielding
3.Transients
4.Reverberation camber
Common used PCBs
•Commonly used PCBs have four layerswhere ICs, modules, and discrete components are mounted on the top and bottom surfaces ,power and ground planes are embedded in the inner two layers, and viasare used as interconnections through layers
2012-11-01
Printed circuit board design techniques for EMC compliance
Preface
Printed Circuit Board Design Techniques for EMC Compliance: A
Handbook for Designers, Second Edition, is a significant enhancement to
the first edition. The first edition was well received within the engineering
community worldwide and was translated into international languages. The
intent of the present volume is to expand upon concepts presented in the
earlier edition, to justify why a specific design technique works, and to
show when it is appropriate for use. Additional techniques based on
technological changes within the last few years are also incorporated.
These techniques and enhancements are based on questions, comments,
and discussions received from engineers around the world.
This book presents information never before published within the
engineering community, dealing exclusively with printed circuit boards
(PCBs). When writing the first edition, it was impossible to anticipate the
amount of variations possible, or what the intended audience expected
from a book directed toward nondegreed engineers. A thorough
understanding of the concepts presented herein will assist during the
design and layout process. Note the key word here —"concepts."
Printed Circuit Board Design Techniques for EMC Compliance will help
minimize the emission or reception of unwanted radio frequency (RF)
energy generated by components and circuits, thus achieving acceptable
levels of electromagnetic compatibility (EMC) for electrical equipment. The
field of EMC consists of two distinct areas:
1. Emissions: Propagation of electromagnetic interference (EMI) from
noncompliant devices (culprits) and, in particular, radiated and
conducted electromagnetic interference.
2. Susceptibility or immunity: The detrimental effects on susceptible
devices (victims) in forms that include EMI, electrostatic discharge
(ESD), and electrical overstress (EOS).
The primary goal of the engineer is to ensure proper operation and
performance of a product when used within an intended electromagnetic
environment. These design requirements are in addition to making a
product function as desired for use within a specific, end-use environment.
Information presented in this guideline is intended for those who design
and layout printed circuit boards. EMC and compliance engineers will also
find the information presented herein helpful in solving design problems at
both the PCB and system level. This book can be used as a reference
document for any design project.
The focus of this book is strictly on the PCB. Containment techniques
(shielding), internal and external cabling, power supply design, and other
system-level subassemblies that use PCBs as a subcomponent will not be
discussed. Again, as in the first edition, excellent reference material on
these aspects of EMC system-level engineering is listed in the References
section at the ends of chapters.
2012-11-01
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