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• Isolated Power Supply for Insulated-Gate Bipolar including methodology, testing, and design files to Transistor (IGBT) Gate Drive quickly evaluate and customize the system. TI Designs • Supports Six IGBT Gate Drivers for 3-Phase help you accelerate your time to market. Inverter (Each Arm in Half-Bridge Configuration) Design Resources • Positive and Negative, Low-Ripple ( < 200 mV) Bias Outputs for Each IGBT of Three-Phase TIDA-00199 Design Page Inverter: 15 V and –8 V LM5160 Product Folder • Operates With 24-V ±20% Input Range ISO5500EVM Tool Folder • Fly-Buck Topology Provides Easy-to-Design Multi- C2000 Piccolo Tool Folder Output Isolated Power Supply Solution With LaunchPAD™ Primary Side Regulation • Output Power: 2.3 W Per IGBT ASK Our E2E Experts • Peak Efficiency of 82% at Balanced Full-Load WEBENCH® Calculator Tools • Output Capacitors Rated to Support Up to 6-A Peak Gate Drive Currents • Design Validated With TI’s Isolated

针对SiC MOSFET的基本特性，对其驱动和保护电路的设计提出以下要求：（1）驱动能力满足要求，要能够提供足够的驱动功率和驱动电流。（2）合理设置门极驱动电阻和Cgs电容，适当增大开关时间，减小di/dt和du/dt，降低电路寄生参数带来的桥臂串扰问题。（3）由于SiC MOSFET的导通阈值电压很低，为保证器件可靠关断，必须采取负压关断来抑制桥臂串扰。（4）PCB布局合理，减小驱动回路面积，避免门极电压振荡。

SiCDescription This reference design is an automotive qualified, isolated gate-driver solution for driving Silicon Carbide (SiC) MOSFETs in half-bridge configuration. The design includes two push-pull bias supplies for the dual-channel isolated gate drivers, respectively, and each supply provides 15 V and –4-V output voltage and 1-W output power. The gate driver is capable of delivering 4-A source and 6-A sink peak current. The driver implements reinforced isolation and can withstand 8-kV Peak and 5.7-kV RMS isolation voltage and > 100-V/ns common mode transient immunity (CMTI). The reference design contains the two-level turnoff circuit, which protects the MOSFET from voltage overshoot during a short-circuit scenario. The DESAT detection threshold and the delay time for second stage turnoff are configurable. The ISO7721- Q1 digital isolator is implemented for interfacing the signals of fault and reset. All was designed on a twolayer PCB board with a compact form factor of 40 mm × 40 mm.