史上最全PCB及工艺词汇，你都懂吗？_面板厂工艺词汇-CSDN博客

本文链接：https://blog.csdn.net/qq_36492361/article/details/131331592

请添加图片描述

PCB 词汇
1、基材：base material
2、层压板：laminate
3、覆金属箔基材：metal-clad bade material
4、覆铜箔层压板：copper-clad laminate (CCL)
5、单面覆铜箔层压板：single-sided copper-clad laminate
6、双面覆铜箔层压板：double-sided copper-clad laminate
7、复合层压板：composite laminate
8、薄层压板：thin laminate
9、金属芯覆铜箔层压板：metal core copper-clad laminate
10、金属基覆铜层压板：metal base copper-clad laminate
11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
12、基体材料：basis material
13、预浸材料：prepreg
14、粘结片：bonding sheet
15、预浸粘结片：preimpregnated bonding sheer
16、环氧玻璃基板：epoxy glass substrate
17、加成法用层压板：laminate for additive process
18、预制内层覆箔板：mass lamination panel
19、内层芯板：core material
20、催化板材：catalyzed board ,coated catalyzed laminate
21、涂胶催化层压板：adhesive-coated catalyzed laminate
22、涂胶无催层压板：adhesive-coated uncatalyzed laminate
23、粘结层：bonding layer
24、粘结膜：film adhesive
25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film
26、无支撑胶粘剂膜：unsupported adhesive film
27、覆盖层：cover layer (cover lay)
28、增强板材：stiffener material
29、铜箔面：copper-clad surface
30、去铜箔面：foil removal surface
31、层压板面：unclad laminate surface
32、基膜面：base film surface
33、胶粘剂面：adhesive faec
34、原始光洁面：plate finish
35、粗面：matt finish
36、纵向：length wise direction
37、模向：cross wise direction
38、剪切板：cut to size panel
39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
49、超薄型层压板：ultra thin laminate
50、陶瓷基覆铜箔板：ceramics base copper-clad laminates
51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates
一、综合词汇
1、印制电路：printed circuit
2、印制线路：printed wiring
3、印制板：printed board
4、印制板电路：printed circuit board (pcb)
5、印制线路板：printed wiring board(pwb)
6、印制元件：printed component+
7、印制接点：printed contact
8、印制板装配：printed board assembly
9、板：board
10、单面印制板：single-sided printed board(ssb)E
11、双面印制板：double-sided printed board(dsb)
12、多层印制板：mulitlayer printed board(mlb)
13、多层印制电路板：mulitlayer printed circuit boardE
14、多层印制线路板：mulitlayer prited wiring board
15、刚性印制板：rigid printed board
16、刚性单面印制板：rigid single-sided printed boradE
17、刚性双面印制板：rigid double-sided printed borad
18、刚性多层印制板：rigid multilayer printed boardED
19、挠性多层印制板：flexible multilayer printed boardE
20、挠性印制板：flexible printed board
21、挠性单面印制板：flexible single-sided printed board
22、挠性双面印制板：flexible double-sided printed board
23、挠性印制电路：flexible printed circuit (fpc)
24、挠性印制线路：flexible printed wiring
25、刚性印制板：flex-rigid printed board, rigid-flex printed boardE
26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed
27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、齐平印制板：flush printed boardED
29、金属芯印制板：metal core printed boardww
30、金属基印制板：metal base printed boardE
31、多重布线印制板：mulit-wiring printed board
32、陶瓷印制板：ceramic substrate printed board
33、导电胶印制板：electroconductive paste printed board
34、模塑电路板：molded circuit board
35、模压印制板：stamped printed wiring boardw
36、顺序层压多层印制板：sequentially-laminated mulitlayer
37、散线印制板：discrete wiring board
38、微线印制板：micro wire board
39、积层印制板：buile-up printed board
40、积层多层印制板：build-up mulitlayer printed board (bum)
41、积层挠印制板：build-up flexible printed board
42、表面层合电路板：surface laminar circuit (slc)
43、埋入凸块连印制板：b2it printed board!
44、多层膜基板：multi-layered film substrate(mfs)
45、层间全内导通多层印制板：alivh multilayer printed board
46、载芯片板：chip on board (cob)
47、埋电阻板：buried resistance boardE
48、母板：mother board
49、子板：daughter boardED
50、背板：backplanew
51、裸板：bare board
52、键盘板夹心板：copper-invar-copper board
53、动态挠性板：dynamic flex board
54、静态挠性板：static flex boardww
55、可断拼板：break-away planelE
56、电缆：cable
57、挠性扁平电缆：flexible flat cable (ffc)
58、薄膜开关：membrane switchED
59、混合电路：hybrid circuit
60、厚膜：thick film
61、厚膜电路：thick film circuit
62、薄膜：thin filmE
63、薄膜混合电路：thin film hybrid circuitE
64、互连：interconnection
65、导线：conductor trace lineE
66、齐平导线：flush conductor
67、传输线：transmission line
68、跨交：crossover
69、板边插头：edge-board contactw
70、增强板：stiffener
71、基底：substrate
72、基板面：real estateE
73、导线面：conductor side
74、元件面：component side
75、焊接面：solder side
76、印制：printingE
77、网格：gridE
78、图形：pattern
79、导电图形：conductive pattern
80、非导电图形：non-conductive pattern
81、字符：legendE
82、标志：markE
二、基材：
1、基材：base material
2、层压板：laminate
3、覆金属箔基材：metal-clad bade material*
4、覆铜箔层压板：copper-clad laminate (ccl)E
5、单面覆铜箔层压板：single-sided copper-clad laminate
6、双面覆铜箔层压板：double-sided copper-clad laminate
7、复合层压板：composite laminatew
8、薄层压板：thin laminate
9、金属芯覆铜箔层压板：metal core copper-clad laminate
10、金属基覆铜层压板：metal base copper-clad laminateE
11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
12、基体材料：basis material
13、预浸材料：prepreg
14、粘结片：bonding sheet
15、预浸粘结片：preimpregnated bonding sheer
16、环氧玻璃基板：epoxy glass substrate
17、加成法用层压板：laminate for additive process!
18、预制内层覆箔板：mass lamination panelE
19、内层芯板：core materialw
20、催化板材：catalyzed board ,coated catalyzed laminate
21、涂胶催化层压板：adhesive-coated catalyzed laminate
22、涂胶无催层压板：adhesive-coated uncatalyzed laminate
23、粘结层：bonding layer
24、粘结膜：film adhesiveE
25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film
26、无支撑胶粘剂膜：unsupported adhesive filmE
27、覆盖层：cover layer (cover lay)
28、增强板材：stiffener material
29、铜箔面：copper-clad surface
30、去铜箔面：foil removal surface
31、层压板面：unclad laminate surface
32、基膜面：base film surface
33、胶粘剂面：adhesive faec
34、原始光洁面：plate finish
35、粗面：matt finish
36、纵向：length wise direction
37、模向：cross wise direction
38、剪切板：cut to size panelE
39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)
40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)
41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates7
44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminatesE
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
49、超薄型层压板：ultra thin laminate
50、陶瓷基覆铜箔板：ceramics base copper-clad laminates;
51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates
三、基材的材料
1、 a 阶树脂：a-stage resin
2、 b 阶树脂：b-stage resin/
3、 c 阶树脂：c-stage resin
4、环氧树脂：epoxy resin
5、酚醛树脂：phenolic resin
6、聚酯树脂：polyester resin$
7、聚酰亚胺树脂：polyimide resin
8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin
9、丙烯酸树脂：acrylic resin
10、三聚氰胺甲醛树脂：melamine formaldehyde resin
11、多官能环氧树脂：polyfunctional epoxy resin
12、溴化环氧树脂：brominated epoxy resin
13、环氧酚醛：epoxy novolac
14、氟树脂：fluroresinE
15、硅树脂：silicone resinE
16、硅烷：silaneE
17、聚合物：polymer
18、无定形聚合物：amorphous polymer
19、结晶现象：crystalline polamer
20、双晶现象：dimorphism
21、共聚物：copolymer
22、合成树脂：synthetic
23、热固性树脂：thermosetting resin
24、热塑性树脂：thermoplastic resin
25、感光性树脂：photosensitive resin
26、环氧当量：weight per epoxy equivalent (wpe)
27、环氧值：epoxy value
28、双氰胺：dicyandiamide
29、粘结剂：binder
30、胶粘剂：adesive
31、固化剂：curing agentw
32、阻燃剂：flame retardant
33、遮光剂：opaquer
34、增塑剂：plasticizersE
35、不饱和聚酯：unsatuiated polyester
36、聚酯薄膜：polyester
37、聚酰亚胺薄膜：polyimide film (pi)
38、聚四氟乙烯：polytetrafluoetylene (ptfe)
39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)E
40、增强材料：reinforcing material
41、玻璃纤维：glass fiber
42、 e 玻璃纤维：e-glass fibre
43、 d 玻璃纤维：d-glass fibre
44、 s 玻璃纤维：s-glass fibreE
45、玻璃布：glass fabric
46、非织布：non-woven fabric
47、玻璃纤维垫：glass matsE
48、纱线：yarn
49、单丝：filament
50、绞股：strandE
51、纬纱：weft yarnED
52、经纱：warp yarn
53、但尼尔：denier
54、经向：warp-wise
55、纬向：weft-wise, filling-wise$
56、织物经纬密度：thread count
57、织物组织：weave structureE
58、平纹组织：plain structure
59、坏布：grey fabric
60、稀松织物：woven scrimE
61、弓纬：bow of weaveE
62、断经：end missingw
63、缺纬：mis-picks
64、纬斜：biasw
65、折痕：crease
66、云织：waviness
67、鱼眼：fish eye
68、毛圈长：feather length5
69、厚薄段：markE
70、裂缝：splitw
71、捻度：twist of yarn
72、浸润剂含量：size contentw
73、浸润剂残留量：size residue
74、处理剂含量：finish level
75、浸润剂：size
76、偶联剂：couplint agentw
77、处理织物：finished fabric
78、聚酰胺纤维：polyarmide fiber
79、聚酯纤维非织布：non-woven polyester fabricE
80、浸渍绝缘纵纸：impregnating insulation paper
81、聚芳酰胺纤维纸：aromatic polyamide paper
82、断裂长：breaking length
83、吸水高度：height of capillary rise
84、湿强度保留率：wet strength retention
85、白度：whitenness
86、陶瓷：ceramics
87、导电箔：conductive foilE
88、铜箔：copper foil,
89、电解铜箔：electrodeposited copper foil (ed copper foil)
90、压延铜箔：rolled copper foil
91、退火铜箔：annealed copper foil
92、压延退火铜箔：rolled annealed copper foil (ra copper foil)
93、薄铜箔：thin copper foil
94、涂胶铜箔：adhesive coated foilE
95、涂胶脂铜箔：resin coated copper foil (rcc)
96、复合金属箔：composite metallic material*
97、载体箔：carrier foil
98、殷瓦：invar
99、箔（剖面）轮廓：foil profile
100、光面：shiny side
101、粗糙面：matte side
102、处理面：treated sideE
103、防锈处理：stain proofingE
104、双面处理铜箔：double treated foilE
四、设计
1、原理图：shematic diagram
2、逻辑图：logic diagram
3、印制线路布设：printed wire layoutED
4、布设总图：master drawingED
5、可制造性设计：design-for-manufacturability
6、计算机辅助设计：computer-aided design.(cad)
7、计算机辅助制造：computer-aided manufacturing.(cam)E
8、计算机集成制造：computer integrat manufacturing.(cim)
9、计算机辅助工程：computer-aided engineering.(cae)
10、计算机辅助测试：computer-aided test.(cat)
11、电子设计自动化：electric design automation .(eda)
12、工程设计自动化：engineering design automaton .(eda2)E
13、组装设计自动化：assembly aided architectural design. (aaad)
14、计算机辅助制图：computer aided drawing
15、计算机控制显示：computer controlled display .(ccd)
16、布局：placement:
17、布线：routing
18、布图设计：layoutED
19、重布：rerouting
20、模拟：simulation
21、逻辑模拟：logic simulation
22、电路模拟：circit simulation
23、时序模拟：timing simulation
24、模块化：modularization
25、布线完成率：layout effeciency
26、机器描述格式：machine descriptionm format .(mdf)
27、机器描述格式数据库：mdf databse
28、设计数据库：design database
29、设计原点：design origin
30、优化（设计）：optimization (design)
31、供设计优化坐标轴：predominant axis
32、表格原点：table origin
33、镜像：mirroringw
34、驱动文件：drive file!
35、中间文件：intermediate file
36、制造文件：manufacturing documentation
37、队列支撑数据库：queue support database
38、元件安置：component positioning
39、图形显示：graphics dispaly
40、比例因子：scaling factor
41、扫描填充：scan filling
42、矩形填充：rectangle filling
43、填充域：region filling
44、实体设计：physical design
45、逻辑设计：logic design
46、逻辑电路：logic circuit
47、层次设计：hierarchical designw
48、自顶向下设计：top-down design
49、自底向上设计：bottom-up design
50、线网：net
51、数字化：digitzing#
52、设计规则检查：design rule checking
53、走（布）线器：router (cad)
54、网络表：net list
55、计算机辅助电路分析：computer-aided circuit analysis
56、子线网：subnet
57、目标函数：objective function
58、设计后处理：post design processing (pdp)
59、交互式制图设计：interactive drawing designE
60、费用矩阵：cost metrix
61、工程图：engineering drawingE
62、方块框图：block diagramE
63、迷宫：mozew
64、元件密度：component density
65、巡回售货员问题：traveling salesman problem
66、自由度：degrees freedom
67、入度：out going degree
68、出度：incoming degree
69、曼哈顿距离：manhatton distance
70、欧几里德距离：euclidean distance
71、网络：network
72、阵列：array
73、段：segment+
74、逻辑：logic
75、逻辑设计自动化：logic design automation
76、分线：separated time
77、分层：separated layer
78、定顺序：definite sequence7
五、形状与尺寸：
1、导线（通道）：conduction (track)
2、导线（体）宽度：conductor width
3、导线距离：conductor spacingE
4、导线层：conductor layer
5、导线宽度/间距：conductor line/space
6、第一导线层：conductor layer no.1
7、圆形盘：round pad
8、方形盘：square pad
9、菱形盘：diamond padE
10、长方形焊盘：oblong pad
11、子弹形盘：bullet pad
12、泪滴盘：teardrop padED
13、雪人盘：snowman padE
14、 v 形盘：v-shaped padE
15、环形盘：annular pad: F
16、非圆形盘：non-circular pad
17、隔离盘：isolation pad
18、非功能连接盘：monfunctional pad
19、偏置连接盘：offset land
20、腹（背）裸盘：back-bard land
21、盘址：anchoring spaur
22、连接盘图形：land pattern
23、连接盘网格阵列：land grid array
24、孔环：annular ring
25、元件孔：component hole
26、安装孔：mounting hole
27、支撑孔：supported holeE
28、非支撑孔：unsupported hole
29、导通孔：viaE
30、镀通孔：plated through hole (pth)
31、余隙孔：access hole
32、盲孔：blind via (hole)
33、埋孔：buried via hole#
34、埋/盲孔：buried /blind via
35、任意层内部导通孔：any layer inner via hole (alivh)
36、全部钻孔：all drilled holew
37、定位孔：toaling hole
38、无连接盘孔：landless holeE
39、中间孔：interstitial holeE
40、无连接盘导通孔：landless via hole
41、引导孔：pilot hole
42、端接全隙孔：terminal clearomee hole
43、准表面间镀覆孔：quasi-interfacing plated-through hole
44、准尺寸孔：dimensioned hole
45、在连接盘中导通孔：via-in-pad"
46、孔位：hole location
47、孔密度：hole density
48、孔图：hole pattern
49、钻孔图：drill drawingE
50、装配图：assembly drawing
51、印制板组装图：printed board assembly drawing
52、参考基准：datum referance