plastic mold

In the future development direction is semiconductor assembly mould to higher precision and more high-speed encapsulation molds - automatic packaging mould development. Automatic encapsulation system is integrated circuit after process encapsulates the high precision, high automation equipment. System set a number of encapsulation work units, Injection Mold,  Injection Molding,  Injection Molder,  plastic mold, each unit of installation mode MGP mould, multiple cassette unit programmed to order, whole set encapsulate piece, feeding, sealing, cutting, qing mold, except glue, receiving at an organic whole. The technology abroad is developing fast, already appeared laoding cover sealing, dispensing encapsulation technology etc, can satisfy all kinds of high density, high lead several product packaging.