u012441962的博客

Ultra-low-power with FlexPowerControl – 1.71 V to 3.6 V power supply – -40 °C to 85/105/125 °C temperature range – 300 nA in V BAT mode: supply for RTC and 32x32-bit backup registers – 30 nA Shutdown mode (5 wakeup pins) – 120 nA Standby mode (5 wakeup pins) – 420 nA Standby mode with RTC – 1.1 µA Stop 2 mode, 1.4 µA with RTC – 100 µA/MHz run mode (LDO Mode) – 39 μA/MHz run mode (@3.3 V SMPS Mode) – Batch acquisition mode (BAM) – 4 µs wakeup from Stop mode – Brown out reset (BOR) – Interconnect matrix • Core: Arm ® 32-bit Cortex ® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 80 MHz, MPU, 100DMIPS and DSP instructions • Performance benchmark – 1.25 DMIPS/MHz (Drystone 2.1) – 273.55 CoreMark ® (3.42 CoreMark/MHz @ 80 MHz) • Energy benchmark – 294 ULPMark™ CP score – 106 ULPMark™ PP score • Clock Sources – 4 to 48 MHz crystal oscillator – 32 kHz crystal oscillator for RTC (LSE) – Internal 16 MHz factory-trimmed RC (±1%) – Internal low-power 32 kHz RC (±5%) – Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25 % accuracy) – 3 PLLs for system clock, USB, audio, ADC • Up to 114 fast I/Os, most 5 V-tolerant, up to 14 I/Os with independent supply down to 1.08 V • RTC with HW calendar, alarms and calibration • LCD 8× 40 or 4× 44 with step-up converter • Up to 24 capacitive sensing channels: support touchkey, linear and rotary touch sensors • 16x timers: 2x 16-bit advanced motor-control, 2x 32-bit and 5x 16-bit general purpose, 2x 16- bit basic, 2x low-power 16-bit timers (available in Stop mode), 2x watchdogs, SysTick timer • Memories – Up to 1 MB Flash, 2 banks read-while- write, proprietary code readout protection – Up to 128 KB of SRAM including 32 KB with hardware parity check – External memory interface for static memories supporting SRAM, PSRAM, NOR and NAND memories – Quad SPI memory interface • 4x digital filters for sigma delta modulator • Rich analog peripherals (independent supply) – 3x 12-bit ADC 5 Msps, up to 16-bit with hardware oversampling, 200 µA/Msps – 2x 12-bit DAC output channels, low-power sample and hold – 2x operational amplifiers with built-in PGA – 2x ultra-low-power comparators • 20x communication interfaces – USB OTG 2.0 full-speed, LPM and BCD – 2x SAIs (serial audio interface) – 3x I2C FM+(1 Mbit/s), SMBus/PMBus – 5x USARTs (ISO 7816, LIN, IrDA, modem)

Dynamic Efficiency Line with BAM (Batch Acquisition Mode) – 1.7 V to 3.6 V power supply – - 40°C to 85/105/125 °C temperature range • Core: Arm ® 32-bit Cortex ® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 512 Kbytes of Flash memory – 128 Kbytes of SRAM • Clock, reset and supply management – 1.7 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Power consumption – Run: 100 µA/MHz (peripheral off) – Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ @ 25C; 65 µA max @25 °C – Stop (Flash in Deep power down mode, slow wakeup time): down to 9 µA @ 25 °C; 28 µA max @25 °C – Standby: 1.8 µA @25 °C / 1.7 V without RTC; 11 µA @85 °C @1.7 V – V BAT supply for RTC: 1 µA @25 °C • 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels • General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support • Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex ® -M4 Embedded Trace Macrocell™ • Up to 81 I/O ports with interrupt capability – Up to 78 fast I/Os up to 100 MHz – Up to 77 5 V-tolerant I/Os • Up to 13 communication interfaces – Up to 3 x I 2 C interfaces (SMBus/PMBus) – Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) – Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), SPI2 and SPI3 with muxed full-duplex I 2 S to achieve audio class accuracy via internal audio PLL or external clock – SDIO interface (SD/MMC/eMMC) – Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY • CRC calculation unit • 96-bit unique ID • RTC: subsecond accuracy, hardware calendar • All packages (WLCSP49, LQFP64/100, UFQFPN48, UFBGA100) are ECOPACK ® 2 Table 1. Device summary Reference Part number STM32F411xC STM32F411CC, STM32F411RC, STM32F411VC STM32F411xE STM32F411CE, STM32F411RE, STM32F411VE WLCSP49 ???? UFQFPN48 (7 × 7 mm) UFBGA100 (7 × 7 mm) (2.999x3.185 mm) LQFP100 (14 × 14mm) LQFP64 (10x10 mm) www.st.com Contents STM32F411xC STM32F411xE