TI BLE ： GAP Bond Manager

// Setup the GAP Bond Manager
{
uint32 passkey = 0; // passkey "000000"
uint8 pairMode = GAPBOND_PAIRING_MODE_WAIT_FOR_REQ;
uint8 mitm = TRUE;
uint8 ioCap = GAPBOND_IO_CAP_DISPLAY_ONLY;
uint8 bonding = TRUE;
GAPBondMgr_SetParameter( GAPBOND_DEFAULT_PASSCODE, sizeof ( uint32 ), &passkey );
GAPBondMgr_SetParameter( GAPBOND_PAIRING_MODE, sizeof ( uint8 ), &pairMode );
GAPBondMgr_SetParameter( GAPBOND_MITM_PROTECTION, sizeof ( uint8 ), &mitm );
GAPBondMgr_SetParameter( GAPBOND_IO_CAPABILITIES, sizeof ( uint8 ), &ioCap );
GAPBondMgr_SetParameter( GAPBOND_BONDING_ENABLED, sizeof ( uint8 ), &bonding );
}

转载于:https://www.cnblogs.com/wwjdwy/p/3631411.html