目 录
第1章 题意分析与解决方案.......................... ...........................................1 1.1 技术指标................................................................................ ....2 1.2 控制方案.............................................................................. ......2
第2章 硬件设计.............................................................................. ....3 2.1.1 AT89C51AT89C51单片机引脚功能........。..........................................5 2.1.2 AT89C51单片机时钟电路及时序.....................................................5 2.1.3 AT89C51单片机复位电路.............................................................5 2.2 温度检测电路设计................ ..........................................................6 2.2.1 温度传感器.............................................................................8 2.2.2 变送器....................................... ...........................................8 2.3 温度控制电路设计............. .............................................................8 2.4 键盘及显示电路设计............... .......................................................10 2.4.1 键盘电路设计.........................................................................10 2.4.2 数码管显示电路设计.................................................................11
第3 章 控制程序设计...........................................................................14
3.2 功能模块...................................................................................14
2.1 单片机电路设计............... .............................................................4
3.2 功能模块.................................................... ...............................14 3.3 资源分配模块.............. ................................................. ..............14 3.3 软件功能设计...... ........................................................................14
3.4.1 键盘管理..................... .........................................................15
3.4.2 显示管理............ ..................................................................16 3.4.3 温度检测模块.........................................................................18 3.4.4 温度控制模块.........................................................................19