BCM策略路由交换芯片

BCM几个交换芯片的寄存器和相关的路由 

EGR_L3_NEXT_HOP、EGR_L3_INTF、ING_L3_NEXT_HOP

BCM XGS系列SDK中和路由相关的几个命令

l3 l3table、 l3 defip 、 l3 intf


当中l3 intf命令配置了EGR_L3_INTF寄存器, 本质上是配置了3层转发接口 也就是我们常说的vlanif接口。

l3 l3table命令和l3 defip命令都配置了EGR_L3_NEXT_HOP寄存器也就是下一跳出口寄存器。l3 l3table 也会生成主机路由ARP表项。


BCM XGSIII系列交换芯片FP 策略路由功能配置顺序:

1. 创建fp group时增加bcmfieldqualifyl3routable匹配

fp qset add bcmfieldqualifydstip

fp qset add bcmfieldqualifyl3routable

fp group create -0x7fffffff 1


2. 创建fp group entry

fp entry create 1 1 


3. 配置fp匹配域TCAM data 和mask

fp qual 1 bcmfieldqualifydstip 192.168.0.12 255.255.255.255
fp qual 1 bcmfieldqualifyinport ge26 0x00000000003fffffffffffff


4.配置fp policy action

fp action add 1 bcmfieldactionl3switch 2


5.安装fp entry

fp entry reinstall 1


6.配置egr_l3_next_hop寄存器

l3 defip add vrf=0 ip=目的IP mask=掩码 MAC=目的MAC intf=intfnum port=目的端口
eg:
l3 defip add VRF=0 IP=192.168.2.54 MaSk=255.255.255.0 Mac=38:83:45:f2:3a:00 INtf=1 port=ge28

#l3 l3table add VRF=0 IP=192.168.2.54 Mac=38:83:45:f2:3a:00 INtf=1 Hit=1 MOdule=0 Port=ge28


7.配置egr_l3_intf寄存器 

l3 intf add vlan=vid MAC=交换机MAC地址 intf=intfnum
eg:
l3 intf add Vlan=1 Mac=02:10:18:F1:23:3F INtf=1


这样配置后, 通过fp过滤的流在运行策略时会依据l3 switch提供的索引‘2’去索引EGR_L3_NEXT_HOP表获取下一跳

目的MAC地址和Intf_num, 之后用取得的intf_num索引EGR_L3_INTF表,得到出口源MAC地址和出口VID。

然后。交换芯片将报文的源MAC地址替换成从EGR_L3_INTF表中取得的源MAC地址, 并将报文从VLAN - vid转发出去。

本质上来说,EGR_L3_NEXT_HOP表里存储的是主机路由的MAC信息和intf_num信息。





版权声明:本文博客原创文章。博客,未经同意,不得转载。

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Single-Chip 16-Port SerDes Gigabit Switch.The BCM5396 is a 16-port Gigabit Ethernet (GbE) switch integrated with 16 1.25G SerDes/SGMII port interfaces for connecting to external Gigabit PHYs or fiber modules. The BCM5396 provides the lowestcost GbE functionality to the desktop switching solution or WebSmart™ application. The BCM5396 is a highly integrated solution, combining all of the functions of a high-speed switch system, including packet buffer, Media Access Controllers (MACs), address management, and a nonblocking switch controller into a single monolithic 0.13 µm CMOS device. The BCM5396 complies with the IEEE 802.3™, 802.3u, 802.3ab, and 802.3x specifications, including the MAC control PAUSE frame and auto-negotiation subsections, providing compatibility with all industry-standard Ethernet, Fast Ethernet, and GbE devices. The BCM5396 device provides integrated 1.25G SerDes, reducing board footprint requirements. The 16 ports have SGMII interfaces for connecting with external GbE transceivers. 16-port 10/100/1000 Mbps integrated switch controller via 1.25G SerDes/SGMII/fiber • Embedded 256 KB on-chip packet buffer • One 10/100/1000 Mbps In-band Management Port (IMP) with GMII/RGMII/RvMII/MII interface for PHY-less connection to a CPU/management entity (for management purposes only) • Integrated address management • Supports up to 4K MAC addresses • Supports jumbo frames up to 9728 bytes. • Supports EEPROM for low-cost chip configuration • Integrated Motorola® SPI-compatible interface • Supports port mirroring • Port-based VLAN and 4K IEEE 802.1Q tag VLAN • Port-, DiffServ-, MAC-, and IEEE 802.1p-based QoS for four queues • Supports Spanning Tree, Rapid Spanning Tree, and Multiple Spanning Tree protocols (802.1D/1s/1w) • Supports IEEE Standard 802.1X port security • Supports pseudo-PHY MDIO access • MAC-based trunking with link fail-over • Ethernet-in-the-last-mile (EFM) support: OAM and P • Low-power (2.2W total) 1.2V core/2.5V (SGMII I/ O)/3.3V (GMII/MII/RvMII) and 2.5V RGMII operation with 3.3V I/O tolerance • 256-pin FBGA package

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