华为芯片设计面试题_美国限制华为新政出台，麒麟芯片设计生产均被掐断，内含政策原文...

美国商务部下属的工业和安全局(BIS)今天宣布了计划，声称将限制华为使用美国技术和软件在国外设计和制造其半导体的能力。

这一公告无异于直接阻断了华为暗中规避美国出口管制条例的做法。工业和安全局正在修改其由来已久的外国生产的直接产品规则和实体名单(Entity List)，专门且具有战略性地针对华为的这一做法：采购属于某些美国软件和技术的直接产品的半导体。

自从2019年工业和安全局将华为技术公司及其名下的114家海外分公司添加到实体名单上以来，希望出口美国产品的公司必须获得许可证。

美国商务部声称：华为继续使用美国的软件和技术来设计半导体，通过委托使用美国设备的海外芯片制造厂生产半导体，违反实体名单确保国家安全和外交政策的目的。

美国商务部部长Wilbur Ross说：“尽管美国商务部去年采取了‘实体名单’行动，但华为及其国外分公司仍加大了努力，通过本土化做法规避出于美国国家安全目的而实施的这些限制。然而，这种本地化做法仍有赖于美国的技术。这不是负责任的全球企业公民应有的行为。我们必须修改被华为和海思半导体所利用的规则，并防止美国技术支持有悖于美国国家安全和外交政策利益的有害活动。”

具体来说，这番针对性的规则变化将使以下国外生产的产品受到《出口管理条例》(EAR)的约束：

(i)由华为及其在实体名单上的分公司(比如海思半导体)生产的产品，这些产品又是某些美国商业管制清单(CCL)软件和技术的直接产品，比如半导体设计；(本条禁令主要限制华为使用美国软件进行芯片设计)

(ii)利用华为或其在实体名单上的分公司(比如海思半导体)的设计规范生产的产品，这些产品又是位于美国境外的某些CCL半导体制造设备的直接产品，比如芯片组。这类外国生产的产品仅在明确知道它们要转出口、从国外出口或(国内)转移到华为或其在实体名单上的任何分公司时，才需要许可证。(本条禁令主要限制给华为供货的芯片制造商，比如台积电)

麒麟系列芯片均受影响

美国商务部称：为了防止对使用美国半导体制造设备的外国芯片制造厂立即造成不利的经济影响——这些制造厂已从[规则生效日期]开始对基于华为设计规范的产品启动任何生产步骤，此类外国生产的产品不受这些新的许可要求的约束，只要它们在生效日期后120天内转出口、从国外出口或(国内)转移。

这次新的政策，不仅针对华为芯片的设计能力，同时针对为华为生产芯片的代工厂，比如台积电。

虽然台积电之前宣称7纳米生产线美国技术占比仅有7%，但还是有在使用美国设备和软件，按照本次最新政策，台积电需要向美国商务部申请才可以继续给华为提供芯片。尽管台积电可以找到其它供应商替代美国设备，例如日本的日立高科技公司、东京电子和国际电气就拥有相关技术，但仓促改建产线根本不现实。

如果台积电无法获得美国商务部许可证或者临时许可，那么120天后华为将不能继续从台积电获得芯片，目前台积电生产的7纳米芯片包括麒麟990、麒麟820、麒麟985就只能供货到九月份，就算加上一些芯片备货，华为7纳米芯片最多能够坚持到今年年底。更为关键的是，目前已经在小批量验证阶段的5纳米芯片麒麟1020将会无法按时推出，华为年底的旗舰机Mate40生死难料。

华为Mate40使用的麒麟1020芯片

如果这种情况成为现实，那么华为只能转而依靠中芯国际，但中芯国际也会受到美国限制政策干扰，就算中芯国际能够顶住美国的压力继续给华为供货，那么华为的手机芯片恐怕明年还会停留在7纳米的水平上，而且中芯国际能否支撑如此大批量的7纳米芯片生产还是未知数。

如果这种情况发生，那么明年华为手机面对高通骁龙875和苹果A15的5纳米芯片竞争，在计算能力上将没有任何优势，只能依靠强大的拍照能力和领先的5G性能继续保持一定竞争力，另外或许可以在鸿蒙系统上做文章，通过鸿蒙系统的性能优势保持流畅度的领先。

华为的2020年果然比2019年更加地困难，尽管华为已经做了大量准备，但是也仅仅能够做到活下去，想进一步扩大市场份额已变得极为困难，希望华为能够顶住。

美国商务部英文原文：

Commerce Addresses Huawei’s Efforts to Undermine Entity List, Restricts Products Designed and Produced with U.S. Technologies

The Bureau of Industry and Security (BIS) today announced plans to protect U.S. national security by restricting Huawei’s ability to use U.S. technology and software to design and manufacture its semiconductors abroad. This announcement cuts off Huawei’s efforts to undermine U.S. export controls. BIS is amending its longstanding foreign-produced direct product rule and the Entity List to narrowly and strategically target Huawei’s acquisition of semiconductors that are the direct product of certain U.S. software and technology.

Since 2019 when BIS added Huawei Technologies and 114 of its overseas-related affiliates to the Entity List, companies wishing to export U.S. items were required to obtain a license.However, Huawei has continued to use U.S. software and technology to design semiconductors, undermining the national security and foreign policy purposes of the Entity List by commissioning their production in overseas foundries using U.S. equipment.

“Despite the Entity List actions the Department took last year, Huawei and its foreign affiliates have stepped-up efforts to undermine these national security-based restrictions through an indigenization effort. However, that effort is still dependent on U.S. technologies,” said Secretary of Commerce Wilbur Ross. “This is not how a responsible global corporate citizen behaves. We must amend our rules exploited by Huawei and HiSilicon and prevent U.S. technologies from enabling malign activities contrary to U.S. national security and foreign policy interests.”

Specifically, this targeted rule change will make the following foreign-produced items subject to the Export Administration Regulations (EAR):

(i) Items, such as semiconductor designs, when produced by Huawei and its affiliates on the Entity List (e.g., HiSilicon), that are the direct product of certain U.S. Commerce Control List (CCL) software and technology; and

(ii) Items, such as chipsets, when produced from the design specifications of Huawei or an affiliate on the Entity List (e.g., HiSilicon), that are the direct product of certain CCL semiconductor manufacturing equipment located outside the United States. Such foreign-produced items will only require a license when there is knowledge that they are destined for reexport, export from abroad, or transfer (in-country) to Huawei or any of its affiliates on the Entity List.

To prevent immediate adverse economic impacts on foreign foundries utilizing U.S. semiconductor manufacturing equipment that have initiated any production step for items based on Huawei design specifications as of [date of rule effective date], such foreign-produced items are not subject to these new licensing requirements so long as they are reexported, exported from abroad, or transferred (in-country) by 120 days from the effective date.

原文链接：https://www.commerce.gov/news/press-releases/2020/05/commerce-addresses-huaweis-efforts-undermine-entity-list-restricts

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