偶然之间

Brain Computer Interfaces Fundamentals to Future Technologies

On-Chip Interconnects Basic Concepts, Designs, and Future Opportunities

Basic Design Approaches to Accelerating Deep Neural Networks

Basics of DAC-based Wireline Transmitters

Calibration Techniques in ADCs

Measuring and Evaluating the Security Level of Circuits

Silicon Photonics – from Basics to ASICs

Fundamentals of Memory Subsystem Design for HPC and AI

Fundamentals of RF and Mm-Wave Power Amplifier Designs

Processor Clock Generation, Distribution, and Clock SensorManagement Loops Phillip Restle, IBM

Clocking, Clock Distribution, and Clock Management in WirelineWireless Subsystems Mozhgan Mansuri, Intel

PLL Architectures, Tradeoffs, and Key Application Considerations Woogeun Rhee, Tsinghua University

PLLs, Clocking, and Clock Distribution Introduction to PLLs Phase Noise, Modeling, and Key Wireless Design Considerations Behzad Razavi, UCLA

Integrated circuits (ICs) and other electronic components form the foundation of the modern systems and infrastructures responsible for energy, finance, communication, defense, and much more. Over the last decade or so, increasing globalization has resulted in a dramatic increase in vulnerabilities within the electronic component supply chain. In particular, the rise of counterfeit ICs has become one of the most serious issues faced by industry, government, and society. Counterfeit ICs are literally a multibillion dollar business and growing at an unprecedented rate, impacting the profits of intellectual property (IP) holders as well as their corporate identities and reputation. Due to the widespread use of electronic components in our day-to-day lives—both directly and indirectly—counterfeit components also pose substantial threats to the health, safety, and security of the population at large. This book is intended to serve as a resource for both beginners and experts in the counterfeit electronic components domain. For newcomers to the area, it shall introduce all of the necessary background material. This book aims to provide a comprehensive description of all different types of counterfeit ICs and the safety and security threat posed by these components. We believe a complete understanding of the detection of such components is a prerequisite if the community wants to stay ahead of the counterfeiters. The physical and electrical test methods described in this book provide guidance for the detection of these counterfeit components. We must also add design-for-anti-counterfeit (DFAC) measures into new ICs for a quick and easy counterfeit detection without the need to perform expensive physical and electrical test methods. This research-based book will provide the necessary road map for the government, industry, test labs, and academia throughout the world who are directly or indirectly impacted by this rampant attack of counterfeiting.

The electronics and information technology revolution continues, but it is a critical time in the development of technology. Once again, we stand on the brink of a new era where emerging research will yield exciting applications and products destined to transform and enrich our daily lives! The potential is staggering and the ultimate impact is unimaginable, considering the continuing marriage of technology with fields such as medicine, communications and entertainment, to name only a few. But who will actually be responsible for transforming these potential new products into reality? The answer, of course, is today’s (and tomorrow’s) design engineers! The design of integrated circuits today remains an essential discipline in support of technological progress, and the authors of this book have taken a giant step forward in the development of a practice-oriented treatise for design engineers who are interested in the practical, industry-driven world of integrated circuit design. The authors, Giovanni Campardo and Rino Micheloni, are very well qualified to effectively address this challenging objective. Both have a solid track record of leading design activities at the STMicroelectronics Flash Division. I should probably mention at this point my association with and knowledge of the accomplishments of these authors. In April 2003, they published a unique Special Issue on the subject of Flash Memories for the Proceedings of the IEEE, the journal for which I am Managing Editor. Therefore, I have firsthand knowledge of their approach to the development of very well crafted technical material.

Emerging non-volatile memory (NVM) technologies, such as PCRAM and STT-RAM, are getting mature in recent years. These emerging NVM technologies have demonstrated great potentials to be the candidates for future computer memory architecture design. It is important for SoC designers and computer architects to understand the benefits and limitations of such emerging memory technologies, to improve the performance/power/reliability of future memory architectures. This chapter gives a brief introduction of these memory technologies, reviews recent advances in memory architecture design, discusses the benefits of using at various levels of memory hierarchy, and also reviews the mitigation techniques to overcome the limitations of applying such emerging memory technologies for future memory architecture design.

The analysis of big data at exascale (1018 bytes or flops) has introduced the emerging need to reexamine the existing hardware platform that can support intensive dataoriented computing. A big-data-driven application requires huge bandwidth with maintained low-power density. For example, web-searching application involves crawling, comparing, ranking, and paging of billions of web pages with extensive memory access. At the same time, the analysis of such a huge data at exascale is a national interest due to cybersecurity need. One needs to provide scalable bigdata storage and processing solution that can detect malicious attack from the sea of data, which is beyond the capability of a pure software-based data analytic solution. The key bottleneck is from the current data storage and processing hardware, which has not only the well-known memory wall and power wall with limited accessing bandwidth but also large leakage power at advanced CMOS technology nodes. One needs to design an energy-efficient hardware platform for future big-data storage that can also support data-intensive processing for data recognition in both image and security applications. Memory is any physical device that is able to temporarily or permanently hold the state of information. Memories can be generally classified into two categories: volatile and nonvolatile. Static and dynamic random-access memories (SRAM and DRAM) are examples of volatile memories that can be accessed in nanosecond of speed, but the stored data will be lost when powered off. The flash and hard disk drive (HDD) are examples of nonvolatile memories. Imagine the life where one can start a computer in the blink of an eye, without having to wait for the operation system to load, or transfer full-length high-definition movie by memory stick in seconds rather than hours. Such a life would happen if a universal nonvolatile memory could be developed that not only can retain information without external power but also can be accessed in high speed. In general, the following criteria examine the new memory technologies: (1) Scalability for high-density integration (2) Low energy consumption for mobile access (3) High endurance capable of 1012 writing/erasing cycles

The new Springer book, Advances in Memristors, Memristive Devices and Systems, consists of 20 contributed chapters by subject experts who are specialized in the various topics addressed in this book. The special chapters have been brought out in this book after a rigorous review process in the broad areas of modeling and applications of memristors, memristive devices and systems. Special importance was given to chapters offering practical solutions and novel methods for the recent research problems in the modeling and applications of memristors, memristive devices and systems. This book discusses trends and applications of memristors and memristive devices in engineering.

ASCONTEXTforthisbook,computermemoryhierarchyrangesfromcache(fastestandmostexpensive)tomainmemory,tomassstorage(slowestandleastexpensive).Cachememory,immediatelyaccessiblebythecentralprocessingunit,isusuallystaticrandom-accessmemory(SRAM).Mainmemoryisusuallydynamicrandom-accessmemory(DRAM);likeSRAM,itrequirespowertomaintainitsmemorystate,butadditionallymustbeelectricallyrefreshed,typicallyevery64ms(1).Massstorageisexemplifiedbynonvolatileflashmemory(oftheNANDandNORvarieties)andmagnetichard-diskdrives.

靜電放電(Electrostatic Discharge, ESD)是造成大多 數的電子元件或電子系統受到過度電性應力(Electrical Overstress EOS)破壞的主要因素。這種破壞會導致半導體 元件以及電腦系統等，形成一種永久性的毀壞，因而影響 積體電路(Integrated Circuits, IＣs)的電路功能，而使 得電子產品工作不正常。 而靜電放電破壞的產生，多是由於人為因素所形成，但又很難避免。電子元件或系統在製造、生產、組裝、測試、存放、搬運等的過程中，靜電會累積在人體、儀器、儲放設備等之中，甚至在電子元件本身也會累積靜電，而人們在不知情的情況下，使這些物體相互接觸，因而形了一放電路徑，使得電子元件或系統遭到靜電放電的肆虐。

This book contains extended and revised versions of the best papers that were presented during the 20th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 20th conference was held at the Dream Inn Hotel, Santa Cruz, California, USA (October 7–10, 2012). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver,Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice, Atlanta, Rhodes, Florian´opolis, Madrid, and Hong Kong.

精通Visual C++6精通Visual C++6精通Visual C++6精通Visual C++6

高质量C++编程指南高质量C++编程指南高质量C++编程指南高质量C++编程指南

Linux初学者入门Linux初学者入门Linux初学者入门Linux初学者入门Linux初学者入门Linux初学者入门

清华大学校园地图高清3D版本.清华大学校园地图高清3D版本.清华大学校园地图高清3D版本.清华大学校园地图高清3D版本.

一个很好用的布尔运算库，支持与或非想减运算。封装的很好。支持多边形运算。

Iterative methods for sparse linear systems (1st edition)

ZeniEDA熊猫EDA介绍 ZeniEDA熊猫EDA介绍ZeniEDA熊猫EDA介绍

实时天气观测小软件（可以详细的知道各种外部天气条件哦）