3U VPX板卡设计

最近设计了一块3U VPX CPU板卡,具体硬件设计过程如下:
1:首先了解3U VPX的相关标准,包括板卡尺寸,接插件定义等等;
2:确定板卡要实现的功能,此板卡包含1553B、RS422、CAN总线、IO输入输出、SRIO、以太网、USB、I2C、存储接口等;
(a)1553B接口:1553B协议使用FPGA的PL逻辑解析,外接1553B接口芯片和变压器;
(b)RS422接口:使用C31、C32芯片进行接口转换;
(c)CAN总线:接口采用隔离设计;
(d)以太网:使用PS端RGMII接口,虽然以太网mac芯片支持 1.8V,但是CPU的RGMII不支持1.8V,如果配置1.8V软件会出现警告,其他接口比如I2C、CAN总线与以太网在一个bank,需加接口电平转换芯片。
3:确定CPU型号,选择集成度较高的zynq系列;
4:画原理图,确定好各芯片之间的接口;
5:PCB布局布线,包括DDR3、USB、以太网、CAN总线等接口的差分等长处理,电源层、地层的划分。画完之后如图所示。此版本为调试版,增加了两排排针,正式版再取消。
PCB
后续板卡生产完成后还有焊接、调试工作,目测软件工作量较大,再继续更新。

Abstract This standard describes VITA 46.0 Advanced Module Format for VMEbus systems, an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. Foreword VME has been the de-facto bus standard for Commercial off the Shelf ( COTS ) Circuit Card Assemblies since the 1980’s. VME boards have proven to be remarkably capable of evolving to support newer technologies with innovations such as VME Subsystem Bus, PCI Mezzanine Cards (PMC’s) and VME320. However, advances in technologies, appearing particularly in interconnects, have demonstrated the need for an advance in system development. This advance needs to accommodate high speed interconnect, particularly serial interconnects, and higher power delivery in concert with better heat removal. This draft standard addresses these needs in the context of IEEE 1101 form factor modules. Other specifications may address alternate outlines, such as VITA-48 (Draft). Because electronics miniaturization is driving the plug-in module I/O count, most system interconnects will need:  Multi-gigabit differential technology  Core computing cluster switched fabrics  Serial RapidIO, PCI Express, Advanced Switching Interconnect  Sufficient ports to enable distributed switching or centralized switching The plethora of high-speed interfaces available for tomorrow’s plug-in modules:  Network interfaces (Fibre Channel, 10 GbE XAUI, Infiniband…,)  Digital video (TMDS, PanelLink, OpenLDI…)  Mass storage interface (Fibre Channel, Serial ATA…,)  FPGA-based inter-board connections (e.g. Xilinx RocketIO)  Custom sensor interfaces VITA 46 provides an evolutionary roadmap for VME users:  To leverage the broad spectrum of high-speed interconnect technologies  Backward compatibility with VME bus electrical, software and selected mechanicals  Enables heterogeneous architectures which preserve existing investments in COTS-based systems  Addresses both 3U and 6U form factors with commonality  Harsh environment fit ‘designed-in’ up front in the standard  Rugged air or conduction-cooled form factors  High value placed on rear-panel I/O  High-speed connector survivability/compliance
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