领存Xeon E5 6U VPX高性能计算刀片上市

XEON E5系列是由Intel公司发布的全球首款支持在芯片内集成PCI-E3.0规格的服务器处理器,旨在推动拥有更低功耗,更高密度的服务器实现,其标志着高性能计算的又一次突飞。对此,深圳市领存技术有限公司(简称:领存)独立自主开发了一款基于XEON E5系列处理器的高性能6U-VPX计算刀片——S6VPE-SE2648-C1I1,并正式面向市场开售。

领存S6VPX-SE2648-C1I1计算刀片遵循OpenVPX 6U标准规范,信号定义遵循OpenVPX VITA65标准中的定义要求,具备故障上报、开机自检、运行状态自检等硬件状态信息监控与管理功能,以及向用户软件输出电流、电压、主芯片温度、操作系统及版本、固件版本(如有)等信息的软件接口。同时,该产品还采用通用X86架构多核高性能处理器,理论浮点峰值计算能力≥690GFLOPS,可用于雷达信号处理、数据处理、HPC等高速密集计算的应用场景。

S6VPX-SE2648-C1I1的系统互连接口通过VPX背板互连,主要包括:

▲用于数据平面互连的40GbE以太网接口及RapidIO接口;

▲用于控制平面互连的千兆Serdes接口;

▲用于系统中断和时间同步的单端GPIO;

▲用于扩展平面互连的PCIE接口;

▲用于系统调试维护的JTAG接口;

▲用于机箱管理的IPMB接口;

▲用于识别机箱内部不同槽位的刀片编码识别信号;

▲用于识别不同机箱、机柜的机箱、机柜编码识别信号。

 

主要功能,性能介绍

1,高性能计算能力:通用X86架构多核高性能处理器,理论浮点峰值计算能力≥690GFLOPS;

2,板载32GB内存颗粒;

3,高速串行实时总线:40GbE以太网、RapidIO X4和PCIE 3.0 X8总线;

4,前出接口:指示灯、复位按钮、HJ30J连接器和千兆调试网口;

5,HJ30J连接器主要包含调试所必须的JTAG、串口、VGA、USB接口等;

6,散热方式:支持风冷和液冷等散热方式;

7,工业级工作温度:-40℃~+55℃

 

原理框图

 

                          规格参数

工作环境

 

电气规格

 

机械规格

 

系统配置

 

接口


深圳市领存技术有限公司
联系人:楚先生
联系电话:0755-83258725
地址:深圳市南山区粤海街道高新中一道长园新材料7栋二楼

Abstract This standard describes VITA 46.0 Advanced Module Format for VMEbus systems, an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. Foreword VME has been the de-facto bus standard for Commercial off the Shelf ( COTS ) Circuit Card Assemblies since the 1980’s. VME boards have proven to be remarkably capable of evolving to support newer technologies with innovations such as VME Subsystem Bus, PCI Mezzanine Cards (PMC’s) and VME320. However, advances in technologies, appearing particularly in interconnects, have demonstrated the need for an advance in system development. This advance needs to accommodate high speed interconnect, particularly serial interconnects, and higher power delivery in concert with better heat removal. This draft standard addresses these needs in the context of IEEE 1101 form factor modules. Other specifications may address alternate outlines, such as VITA-48 (Draft). Because electronics miniaturization is driving the plug-in module I/O count, most system interconnects will need:  Multi-gigabit differential technology  Core computing cluster switched fabrics  Serial RapidIO, PCI Express, Advanced Switching Interconnect  Sufficient ports to enable distributed switching or centralized switching The plethora of high-speed interfaces available for tomorrow’s plug-in modules:  Network interfaces (Fibre Channel, 10 GbE XAUI, Infiniband…,)  Digital video (TMDS, PanelLink, OpenLDI…)  Mass storage interface (Fibre Channel, Serial ATA…,)  FPGA-based inter-board connections (e.g. Xilinx RocketIO)  Custom sensor interfaces VITA 46 provides an evolutionary roadmap for VME users:  To leverage the broad spectrum of high-speed interconnect technologies  Backward compatibility with VME bus electrical, software and selected mechanicals  Enables heterogeneous architectures which preserve existing investments in COTS-based systems  Addresses both 3U and 6U form factors with commonality  Harsh environment fit ‘designed-in’ up front in the standard  Rugged air or conduction-cooled form factors  High value placed on rear-panel I/O  High-speed connector survivability/compliance
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