信号完整性的定义、干扰因素及解决方法详解

何为信号完整性:信号完整性(Signal Integrity,简称SI)是指在信号线上的信号质量。差的信号完整性不是由某一单一因素导致的,而是板级设计中多种因素共同引起的。当电路中信号能以要求的时序、持续时间和电压幅度到达接收端时,该电路就有很好的信号完整性。当信号不能正常响应时,就出现了信号完整性问题。

信号完整性包含:

1、波形完整性(Waveform integrity)

2、时序完整性(Timing integrity)

3、电源完整性(Power integrity)

信号完整性分析的目的就是用最小的成本,最快的时间使产品达到波形完整性、时序完整性、电源完整性的要求。

我们知道:电源不稳定、电源的干扰、信号间的串扰、信号传输过程中的反射,这些都会让信号产生畸变,看下面这张图,你就会知道理想的信号,经过:反射、串扰、抖动,最后变成什么鬼。

如果你的示波器测试上这样的信号,你一定会问,为什么会这样,怎么去解决。

首先我们说一下反射:

反射--初始波

当驱动器发射一个信号进入传输线时,信号的幅值取决于电压、缓冲器的内阻和传输线的阻抗。驱动器端看到的初始电压决定于内阻和线阻抗的分压。

反射系数,其中-1≤ρ≤1

当ρ=0时无反射发生

当ρ=1(Z 2 =∞,开路)时发生全正反射

当ρ=-1(Z 2 =0,短路)时发生全负反射

初始电压,是源电压Vs(2V)经过Zs(25欧姆)和传输线阻抗(50欧姆)分压。

Vinitial=1.33V

后续的反射率按照反射系数公式进行计算

源端的反射率,是根据源端阻抗(25欧姆)和传输线阻抗(50欧姆)根据反射系数公式计算为-0.33;

终端的反射率,是根据终端阻抗(无穷大)和传输线阻抗(50欧姆)根据反射系数公式计算为1;

我们按照每次反射的幅度和延时,在最初的脉冲波形上进行叠加就得到了这个波形,这也就是为什么,阻抗不匹配造成信号完整性不好的原因。

由于连接的存在、器件管脚、走线宽度变化、走线拐弯、过孔会使得阻抗不得不变化。所以反射也就不可避免。

电压后者电流有变化,自然就会往外辐射电磁波

串扰是指当信号在传输线上传播时,因电磁耦合对相邻的传输线产生的不期望的电压噪声。

串扰是由电磁耦合引起的,耦合分为容性耦合和感性耦合两种。

容性耦合是由于干扰源(Aggressor)上的电压变化在被干扰对象(Victim)上引起感应电流从而导致的电磁干扰;

而感性耦合则是由于干扰源上的电流变化产生的磁场在被干扰对象上引起感应电压从而导致的电磁干扰。因此,信号通过一导体时会在相邻的导体上引起两类不同的噪声信号:容性耦合信号和感性耦合信号。

感性耦合:

容性耦合:

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Publisher: Prentice Hall PTR Pub Date: September 15, 2003 ISBN: 0-13-066946-6 Pages: 608 Section 2.7. The Spectrum of an Ideal Square Wave Section 2.8. From the Frequency Domain to the Time Domain Section 2.9. Effect of Bandwidth on Rise Time Section 2.10. Bandwidth and Rise Time Section 2.11. What Does "Significant" Mean? Section 2.12. Bandwidth of Real Signals Section 2.13. Bandwidth and Clock Frequency Section 2.14. Bandwidth of a Measurement Section 2.15. Bandwidth of a Model Section 2.16. Bandwidth of an Interconnect Section 2.17. Bottom Line Chapter 3. Impedance and Electrical Models Section 3.1. Describing Signal-Integrity Solutions in Terms of Impedance Section 3.2. What Is Impedance? Section 3.3. Real vs. Ideal Circuit Elements Section 3.4. Impedance of an Ideal Resistor in the Time Domain Section 3.5. Impedance of an Ideal Capacitor in the Time Domain Section 3.6. Impedance of an Ideal Inductor in the Time Domain Section 3.7. Impedance in the Frequency Domain Section 3.8. Equivalent Electrical Circuit Models Section 3.9. Circuit Theory and SPICE Section 3.10. Introduction to Modeling Section 3.11. The Bottom Line Chapter 4. The Physical Basis of Resistance Section 4.1. Translating Physical Design into Electrical Performance Section 4.2. The Only Good Approximation for the Resistance of Interconnects Section 4.3. Bulk Resistivity Section 4.4. Resistance per Length Section 4.5. Sheet Resistance Section 4.6. The Bottom Line Chapter 5. The Physical Basis of Capacitance Section 5.1. Current Flow in Capacitors Section 5.2. The Capacitance of a Sphere Section 5.3. Parallel Plate Approximation Section 5.4. Dielectric Constant Section 5.5. Power and Ground Planes and Decoupling Capacitance Section 5.6. Capacitance per Length Section 5.7. 2D Field Solvers Section 5.8. Effective Dielectric Constant Section 5.9. The Bottom Line Chapter 6. The Physical Basis of Inductance Section 6.1. What Is Inductance? Section 6.2. Inductance Principle #1: There Are Circular Magnetic-Field Line Loops Around All Currents Section 6.3. Inductance Principle #2: Inductance Is the Number of Webers of Field Line Loops Around a Conductor per Amp of Current Through It Section 6.4. Self-Inductance and Mutual Inductance Section 6.5. Inductance Principle #3: When the Number of Field Line Loops Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor Section 6.6. Partial Inductance Section 6.7. Effective, Total, or Net Inductance and Ground Bounce Section 6.8. Loop Self- and Mutual Inductance Section 6.9. The Power-Distribution System (PDS) and Loop Inductance Section 6.10. Loop Inductance per Square of Planes Section 6.11. Loop Inductance of Planes and Via Contacts Section 6.12. Loop Inductance of Planes with a Field of Clearance Holes Section 6.13. Loop Mutual Inductance Section 6.14. Equivalent Inductance Section 6.15. Summary of Inductance Section 6.16. Current Distributions and Skin Depth Section 6.17. High-Permeability Materials Section 6.18. Eddy Currents Section 6.19. The Bottom Line Chapter 7. The Physical Basis of Transmission Lines Section 7.1. Forget the Word Ground Section 7.2. The Signal Section 7.3. Uniform Transmission Lines Section 7.4. The Speed of Electrons in Copper Section 7.5. The Speed of a Signal in a Transmission Line Section 7.6. Spatial Extent of the Leading Edge Section 7.7. "Be the Signal" Section 7.8. The Instantaneous Impedance of a Transmission Line Section 7.9. Characteristic Impedance and Controlled Impedance Section 7.10. Famous Characteristic Impedances Section 7.11. The Impedance of a Transmission Line Section 7.12. Driving a Transmission Line Section 7.13. Return Paths Section 7.14. When Return Paths Switch Reference Planes Section 7.15. A First-Order Model of a Transmission Line Section 7.16. Calculating Characteristic Impedance with Approximations Section 7.17. Calculating the Characteristic Impedance with a 2D Field Solver Section 7.18. An n-Section Lumped Circuit Model Section 7.19. Frequency Variation of the Characteristic Impedance Section 7.20. The Bottom Line Chapter 8. Transmission Lines and Reflections Section 8.1. Reflections at Impedance Changes Section 8.2. Why Are There Reflections? Section 8.3. Reflections from Resistive Loads Section 8.4. Source Impedance Section 8.5. Bounce Diagrams Section 8.6. Simulating Reflected Waveforms Section 8.7. Measuring Reflections with a TDR Section 8.8. Transmission Lines and Unintentional Discontinuities Section 8.9. When to Terminate Section 8.10. The Most Common Termination Strategy for Point-to-Point Topology Section 8.11. Reflections from Short Series Transmission Lines Section 8.12. Reflections from Short-Stub Transmission Lines Section 8.13. Reflections from Capacitive End Terminations Section 8.14. Reflections from Capacitive Loads in the Middle of a Trace Section 8.15. Capacitive Delay Adders Section 8.16. Effects of Corners and Vias Section 8.17. Loaded Lines Section 8.18. Reflections from Inductive Discontinuities Section 8.19. Compensation Section 8.20. The Bottom Line Chapter 9. Lossy Lines, Rise-Time Degradation, and Material Properties Section 9.1. Why Worry About Lossy Lines Section 9.2. Losses in Transmission Lines Section 9.3. Sources of Loss: Conductor Resistance and Skin Depth Section 9.4. Sources of Loss: The Dielectric Section 9.5. Dissipation Factor Section 9.6. The Real Meaning of Dissipation Factor Section 9.7. Modeling Lossy Transmission Lines Section 9.8. Characteristic Impedance of a Lossy Transmission Line Section 9.9. Signal Velocity in a Lossy Transmission Line Section 9.10. Attenuation and the dB Section 9.11. Attenuation in Lossy Lines Section 9.12. Measured Properties of a Lossy Line in the Frequency Domain Section 9.13. The Bandwidth of an Interconnect Section 9.14. Time-Domain Behavior of Lossy Lines Section 9.15. Improving the Eye Diagram of a Transmission Line Section 9.16. Pre-emphasis and Equalization Section 9.17. The Bottom Line Chapter 10. Cross Talk in Transmission Lines Section 10.1. Superposition Section 10.2. Origin of Coupling: Capacitance and Inductance Section 10.3. Cross Talk in Transmission Lines: NEXT and FEXT Section 10.4. Describing Cross Talk Section 10.5. The SPICE Capacitance Matrix Section 10.6. The Maxwell Capacitance Matrix and 2D Field Solvers Section 10.7. The Inductance Matrix Section 10.8. Cross Talk in Uniform Transmission Lines and Saturation Length Section 10.9. Capacitively Coupled Currents Section 10.10. Inductively Coupled Currents Section 10.11. Near-End Cross Talk Section 10.12. Far-End Cross Talk Section 10.13. Decreasing Far-End Cross Talk Section 10.14. Simulating Cross Talk Section 10.15. Guard Traces Section 10.16. Cross Talk and Dielectric Constant Section 10.17. Cross Talk and Timing Section 10.18. Switching Noise Section 10.19. Summary of Reducing Cross Talk Section 10.20. The Bottom Line Chapter 11. Differential Pairs and Differential Impedance Section 11.1. Differential Signaling Section 11.2. A Differential Pair Section 11.3. Differential Impedance with No Coupling Section 11.4. The Impact from Coupling Section 11.5. Calculating Differential Impedance Section 11.6. The Return-Current Distribution in a Differential Pair Section 11.7. Odd and Even Modes Section 11.8. Differential Impedance and Odd-Mode Impedance Section 11.9. Common Impedance and Even-Mode Impedance Section 11.10. Differential and Common Signals and Odd- and Even-Mode Voltage Components Section 11.11. Velocity of Each Mode and Far-End Cross Talk Section 11.12. Ideal Coupled Transmission-Line Model or an Ideal Differential Pair Section 11.13. Measuring Even- and Odd-Mode Impedance Section 11.14. Terminating Differential and Common Signals Section 11.15. Conversion of Differential to Common Signals Section 11.16. EMI and Common Signals Section 11.17. Cross Talk in Differential Pairs Section 11.18. Crossing a Gap in the Return Path Section 11.19. To Tightly Couple or Not to Tightly Couple Section 11.20. Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements Section 11.21. The Characteristic Impedance Matrix Section 11.22. The Bottom Line Appendix A. 100 General Design Guidelines to Minimize Signal-Integrity Problems Section A.1. Minimize Signal-Quality Problems on One Net Section A.2. Minimize Cross Talk Section A.3. Minimize Rail Collapse Section A.4. Minimize EMI Appendix B. 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects Section B.1. Chapter 2 Section B.2. Chapter 3 Section B.3. Chapter 4 Section B.4. Chapter 5 Section B.5. Chapter 6 Section B.6. Chapter 7 Section B.7. Chapter 8 Section B.8. Chapter 9 Section B.9. Chapter 10 Section B.10. Chapter 11 Appendix C. Selected References About the Author

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