信号完整性 SI(Signal Integrity)

最新推荐文章于 2024-08-10 09:42:15 发布
最新推荐文章于 2024-08-10 09:42:15 发布
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分类专栏： SI PI 文章标签： 信号完整性 SI
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信号完整性(SI)概述
大不列颠小小咸鱼
06-25 2万+
一、信号完整性是指在高速电路设计中由互连线所引起的所有问题。信号具备信号完整性是指在不影响系统中其他信号质量的前提下，接收端能够接收到符合逻辑电平要求、时序要求和相位要求的信号。信号完整性设计的根本性目标是保证信号波形的完整和信号时序的完整。宏观的信号完整性问题可以分为四类： (1)、单条传输线的信号完整性问题。 (2)、相邻传输线间的信号串扰问题。 (3)、与电源和地相关的电源完整性问题(...
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讲述信号完整性的文档，可用于单板芯片等等
信号完整性基础培训（Signal Integrity SI）
09-07
信号完整性基础培训（Signal Integrity SI），对信号性能进行分析
在Altium designer (AD)原理图设计中，“Footprint”、“Simulation”和“Signal Integrity”选项，含义和作用
最新发布
qq_58662017的博客
08-10 335
Footprint确定物理放置；Simulation用于电路行为仿真；用于分析高速信号的传输质量。在实际设计中，三者结合使用，确保电路板设计的功能性、可制造性和信号传输质量。
信号完整性概述
weixin_30852419的博客
01-17 1064
在高速数字设计领域，信号完整性(SI，signal integrity)概念已经被提出来很多年了。而对可编程逻辑器件的设计工程师来说，往往对这个概念没有引起足够的重视。有的人甚至认为，做数字逻辑电路的设计跟这些知识没有什么直接关系，那就非常危险了。 任何危险，只要注意他，就可以设法避免他。 但事实上，设计工程师在设计过程中没有给SI足够的重视，造成设计不稳定，导致功能无法实现，需要重新...
信号完整性
weixin_46969363的博客
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信号完整性是指在电子系统中传输的信号在整个传输过程中能够保持其所期望的形状和波形，以及在接收端被正确解释和识别的程度。它关注的是信号在信号链路（如 PCB、连接器、导线等）上的保持和传播过程中受到的影响，包括信号波形的失真、时序问题、噪声和干扰等。考虑到信号的传输路径、阻抗匹配、信号层与电源层的分离等因素，以降低信号传输中的干扰。使用高质量、合适特性阻抗的传输线，以及质量好的连接器，可以减少信号传输过程中的反射和失真。在长距离信号传输中，使用缓冲器和重驱动器可以提高信号的驱动能力，降低传输线的传输损耗。
信号完整性分析
luolt42的博客
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信号完整性分析
信号完整性SI（Signal_Integrity）概述
05-08
信号完整性（Signal Integrity，简称SI）是高速数字电路设计中的一个核心问题，它与系统的性能紧密相关。随着数字系统速率的快速提升，如处理器速度、存储器访问速度以及通信系统的数据传输速率等的飞速发展，对信号...
信号完整性-教程~Signal Integrity Introduction~intel
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信号完整性（Signal Integrity，简称SI）是现代高速数字设计中不可或缺的一个重要概念，它涉及到电子设备中的信号传输质量，确保信息在系统内的准确无误传递，同时避免信号间的相互干扰，防止信号对设备造成损害，...
硬件设计/电路设计+信号完整性/SI+基础知识概念思维导图
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信号完整性（Signal Integrity，简称SI）是电子设计中不可或缺的一部分，尤其在高速电路设计中扮演着核心角色。信号完整性涉及到确保数字信号在传输路径中能够准确、无误地传输，以保证电子系统正常运行。当信号在...
Signal Integrity - Simplified(Eric Bogatin).pdf
01-19
Publisher: Prentice Hall PTR Pub Date: September 15, 2003 ISBN: 0-13-066946-6 Pages: 608 Section 2.7. The Spectrum of an Ideal Square Wave Section 2.8. From the Frequency Domain to the Time Domain Section 2.9. Effect of Bandwidth on Rise Time Section 2.10. Bandwidth and Rise Time Section 2.11. What Does "Significant" Mean? Section 2.12. Bandwidth of Real Signals Section 2.13. Bandwidth and Clock Frequency Section 2.14. Bandwidth of a Measurement Section 2.15. Bandwidth of a Model Section 2.16. Bandwidth of an Interconnect Section 2.17. Bottom Line Chapter 3. Impedance and Electrical Models Section 3.1. Describing Signal-Integrity Solutions in Terms of Impedance Section 3.2. What Is Impedance? Section 3.3. Real vs. Ideal Circuit Elements Section 3.4. Impedance of an Ideal Resistor in the Time Domain Section 3.5. Impedance of an Ideal Capacitor in the Time Domain Section 3.6. Impedance of an Ideal Inductor in the Time Domain Section 3.7. Impedance in the Frequency Domain Section 3.8. Equivalent Electrical Circuit Models Section 3.9. Circuit Theory and SPICE Section 3.10. Introduction to Modeling Section 3.11. The Bottom Line Chapter 4. The Physical Basis of Resistance Section 4.1. Translating Physical Design into Electrical Performance Section 4.2. The Only Good Approximation for the Resistance of Interconnects Section 4.3. Bulk Resistivity Section 4.4. Resistance per Length Section 4.5. Sheet Resistance Section 4.6. The Bottom Line Chapter 5. The Physical Basis of Capacitance Section 5.1. Current Flow in Capacitors Section 5.2. The Capacitance of a Sphere Section 5.3. Parallel Plate Approximation Section 5.4. Dielectric Constant Section 5.5. Power and Ground Planes and Decoupling Capacitance Section 5.6. Capacitance per Length Section 5.7. 2D Field Solvers Section 5.8. Effective Dielectric Constant Section 5.9. The Bottom Line Chapter 6. The Physical Basis of Inductance Section 6.1. What Is Inductance? Section 6.2. Inductance Principle #1: There Are Circular Magnetic-Field Line Loops Around All Currents Section 6.3. Inductance Principle #2: Inductance Is the Number of Webers of Field Line Loops Around a Conductor per Amp of Current Through It Section 6.4. Self-Inductance and Mutual Inductance Section 6.5. Inductance Principle #3: When the Number of Field Line Loops Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor Section 6.6. Partial Inductance Section 6.7. Effective, Total, or Net Inductance and Ground Bounce Section 6.8. Loop Self- and Mutual Inductance Section 6.9. The Power-Distribution System (PDS) and Loop Inductance Section 6.10. Loop Inductance per Square of Planes Section 6.11. Loop Inductance of Planes and Via Contacts Section 6.12. Loop Inductance of Planes with a Field of Clearance Holes Section 6.13. Loop Mutual Inductance Section 6.14. Equivalent Inductance Section 6.15. Summary of Inductance Section 6.16. Current Distributions and Skin Depth Section 6.17. High-Permeability Materials Section 6.18. Eddy Currents Section 6.19. The Bottom Line Chapter 7. The Physical Basis of Transmission Lines Section 7.1. Forget the Word Ground Section 7.2. The Signal Section 7.3. Uniform Transmission Lines Section 7.4. The Speed of Electrons in Copper Section 7.5. The Speed of a Signal in a Transmission Line Section 7.6. Spatial Extent of the Leading Edge Section 7.7. "Be the Signal" Section 7.8. The Instantaneous Impedance of a Transmission Line Section 7.9. Characteristic Impedance and Controlled Impedance Section 7.10. Famous Characteristic Impedances Section 7.11. The Impedance of a Transmission Line Section 7.12. Driving a Transmission Line Section 7.13. Return Paths Section 7.14. When Return Paths Switch Reference Planes Section 7.15. A First-Order Model of a Transmission Line Section 7.16. Calculating Characteristic Impedance with Approximations Section 7.17. Calculating the Characteristic Impedance with a 2D Field Solver Section 7.18. An n-Section Lumped Circuit Model Section 7.19. Frequency Variation of the Characteristic Impedance Section 7.20. The Bottom Line Chapter 8. Transmission Lines and Reflections Section 8.1. Reflections at Impedance Changes Section 8.2. Why Are There Reflections? Section 8.3. Reflections from Resistive Loads Section 8.4. Source Impedance Section 8.5. Bounce Diagrams Section 8.6. Simulating Reflected Waveforms Section 8.7. Measuring Reflections with a TDR Section 8.8. Transmission Lines and Unintentional Discontinuities Section 8.9. When to Terminate Section 8.10. The Most Common Termination Strategy for Point-to-Point Topology Section 8.11. Reflections from Short Series Transmission Lines Section 8.12. Reflections from Short-Stub Transmission Lines Section 8.13. Reflections from Capacitive End Terminations Section 8.14. Reflections from Capacitive Loads in the Middle of a Trace Section 8.15. Capacitive Delay Adders Section 8.16. Effects of Corners and Vias Section 8.17. Loaded Lines Section 8.18. Reflections from Inductive Discontinuities Section 8.19. Compensation Section 8.20. The Bottom Line Chapter 9. Lossy Lines, Rise-Time Degradation, and Material Properties Section 9.1. Why Worry About Lossy Lines Section 9.2. Losses in Transmission Lines Section 9.3. Sources of Loss: Conductor Resistance and Skin Depth Section 9.4. Sources of Loss: The Dielectric Section 9.5. Dissipation Factor Section 9.6. The Real Meaning of Dissipation Factor Section 9.7. Modeling Lossy Transmission Lines Section 9.8. Characteristic Impedance of a Lossy Transmission Line Section 9.9. Signal Velocity in a Lossy Transmission Line Section 9.10. Attenuation and the dB Section 9.11. Attenuation in Lossy Lines Section 9.12. Measured Properties of a Lossy Line in the Frequency Domain Section 9.13. The Bandwidth of an Interconnect Section 9.14. Time-Domain Behavior of Lossy Lines Section 9.15. Improving the Eye Diagram of a Transmission Line Section 9.16. Pre-emphasis and Equalization Section 9.17. The Bottom Line Chapter 10. Cross Talk in Transmission Lines Section 10.1. Superposition Section 10.2. Origin of Coupling: Capacitance and Inductance Section 10.3. Cross Talk in Transmission Lines: NEXT and FEXT Section 10.4. Describing Cross Talk Section 10.5. The SPICE Capacitance Matrix Section 10.6. The Maxwell Capacitance Matrix and 2D Field Solvers Section 10.7. The Inductance Matrix Section 10.8. Cross Talk in Uniform Transmission Lines and Saturation Length Section 10.9. Capacitively Coupled Currents Section 10.10. Inductively Coupled Currents Section 10.11. Near-End Cross Talk Section 10.12. Far-End Cross Talk Section 10.13. Decreasing Far-End Cross Talk Section 10.14. Simulating Cross Talk Section 10.15. Guard Traces Section 10.16. Cross Talk and Dielectric Constant Section 10.17. Cross Talk and Timing Section 10.18. Switching Noise Section 10.19. Summary of Reducing Cross Talk Section 10.20. The Bottom Line Chapter 11. Differential Pairs and Differential Impedance Section 11.1. Differential Signaling Section 11.2. A Differential Pair Section 11.3. Differential Impedance with No Coupling Section 11.4. The Impact from Coupling Section 11.5. Calculating Differential Impedance Section 11.6. The Return-Current Distribution in a Differential Pair Section 11.7. Odd and Even Modes Section 11.8. Differential Impedance and Odd-Mode Impedance Section 11.9. Common Impedance and Even-Mode Impedance Section 11.10. Differential and Common Signals and Odd- and Even-Mode Voltage Components Section 11.11. Velocity of Each Mode and Far-End Cross Talk Section 11.12. Ideal Coupled Transmission-Line Model or an Ideal Differential Pair Section 11.13. Measuring Even- and Odd-Mode Impedance Section 11.14. Terminating Differential and Common Signals Section 11.15. Conversion of Differential to Common Signals Section 11.16. EMI and Common Signals Section 11.17. Cross Talk in Differential Pairs Section 11.18. Crossing a Gap in the Return Path Section 11.19. To Tightly Couple or Not to Tightly Couple Section 11.20. Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements Section 11.21. The Characteristic Impedance Matrix Section 11.22. The Bottom Line Appendix A. 100 General Design Guidelines to Minimize Signal-Integrity Problems Section A.1. Minimize Signal-Quality Problems on One Net Section A.2. Minimize Cross Talk Section A.3. Minimize Rail Collapse Section A.4. Minimize EMI Appendix B. 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects Section B.1. Chapter 2 Section B.2. Chapter 3 Section B.3. Chapter 4 Section B.4. Chapter 5 Section B.5. Chapter 6 Section B.6. Chapter 7 Section B.7. Chapter 8 Section B.8. Chapter 9 Section B.9. Chapter 10 Section B.10. Chapter 11 Appendix C. Selected References About the Author
【嵌入式】信号完整性（SI）设计
m0_51186267的博客
06-07 948
广义上讲，信号完整性(Signal Integrity,SI)包括由于互连、电源、器件等引起的所 有信号质量及延时等问题
信号完整性知识点
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IC-信号完整性
hepiaopiao_wemedia的博客
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信号完整性（Signal Integrity）：是指信号在传输线上的传输质量。在到达接收端时，可以达到要求的时序、电压幅度和电流持续时间。信号完整性包括：时序完整性(timing integrity)、波形完整性(waveframe integrity)、电压完整性(power integrity)。信号完整性分析就是指：利用最小的成本和最快的时间达到三个完整性。 信号完整性的噪声源主要包括： ...
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信号完整性（SI）是指在电子系统中传输的信号是否能够保持其原始的形状和质量。信号完整性基础培训（Signal Integrity SI）PDF文件提供了与信号完整性相关的基础知识和培训内容。 该培训材料涵盖了以下主要内容： 1. 信号完整性概述：介绍了信号完整性的基本概念、重要性和应用领域。 2. 传输线理论：解释了信号在传输线上传播的原理和特性，包括传输线的阻抗匹配、传输速度和传输延迟等。 3. 反射和终端：讲解了信号在传输线上反射和终端的影响，以及如何有效地减少反射并提高信号品质。 4. 串扰和噪声：介绍了信号之间的串扰和噪声对信号完整性的影响，以及如何进行抑制和降噪的方法。 5. PCB设计技巧：探讨了信号完整性在PCB设计中的关键问题，包括布线规则、层堆栈设计和功率平面规划等。 6. 仿真与分析工具：介绍了常用的信号完整性仿真和分析工具，如SPICE、IBIS和SI软件等，以及其使用方法和应用。 通过学习信号完整性基础培训，您将获得必要的知识和技能，能够更好地理解并应用信号完整性的原理和方法。这将有助于您在电子系统设计和布线中避免信号干扰与降噪问题，提高信号的可靠性和性能，确保系统正常运行。
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