Android4.0 USB挂载内核驱动层流程分析（三）

接上篇《Android4.0 USB挂载内核驱动层流程分析（二）》
1.android_bind

static int android_bind(struct usb_composite_dev *cdev)
{
	struct android_dev *dev = _android_dev;    //回头看Android4.0 USB挂载内核驱动层流程分析（一），static int __init init(void) 函数中_android_dev = dev; _android_dev是一个静态结构体
	struct usb_gadget	*gadget = cdev->gadget;
	int			gcnum, id, ret;


	usb_gadget_disconnect(gadget);    //初始化前确保是断开的


	ret = android_init_functions(dev->functions, cdev);    //这里的function们就是之前包括mass_storage_function在内的功能。下边分析
	if (ret)
		return ret;


	/* Allocate string descriptor numbers ... note that string
	 * contents can be overridden by the composite_dev glue.
	 */
	id = usb_string_id(cdev);    //通过读取设备ID来填充一下驱动参数
	if (id < 0)
		return id;
	strings_dev[STRING_MANUFACTURER_IDX].id = id;
	device_desc.iManufacturer = id;


	id = usb_string_id(cdev);
	if (id < 0)