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Analog4Fun
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3 Packages Comparison: LFC, CSP and QFN
LFC (Low Profile Fine-pitch Chip Carrier), CSP (Chip Scale Package), and QFN (Quad Flat No-leads) are all types of integrated circuit packaging technologies, each with its own characteristics and applications. Here are the key differences between them:LFC原创 2024-04-04 00:17:46 · 353 阅读 · 1 评论 -
Dependent source model (VCVS, CCCS, CCVS, VCCS)
原创 2024-01-23 06:00:49 · 392 阅读 · 1 评论 -
Review of CMRR
Input CM variations disturb the bias pionts, alternating the small-signal gain and possibly limiting the output voltage swings. More troublesome is the variation of the diff output as a result of a change in Vin,cm, since the circuit is not fully symmetric原创 2024-01-18 05:45:58 · 351 阅读 · 1 评论 -
Jitter
1. Period Jitterfile:///Users/ssong/Downloads/AN10007-Jitter-and-measurement%20(3).pdf1.1 Period jitter is the deviation in cycle time of a clock signal with respect to the ideal period over a number of randomly selected cycles.Period jitter is...原创 2022-04-20 01:15:03 · 593 阅读 · 0 评论 -
Dennard scaling
Dennard提出,晶体管的尺寸在每一代技术中都缩小了30% (0.7倍),因此它们的面积A减少了50%。这意味着电路减少了30% (0.7倍)的延迟,因此增加了约40% (1.4倍)的工作频率。最后,为了保持电场恒定,电压降低了30%,能量降低了65%,功率降低了50%。因此,在每一代技术中,晶体管密度增加一倍,电路速度提高40%,功耗(晶体管数量增加一倍)保持不变(https://www.ithome.com/0/451/930.htm)。1 Dennard et al. Design of...原创 2022-02-20 07:59:24 · 277 阅读 · 0 评论 -
Resistor Tempco
TSMCPpoly (Neg tempco)typ: 39.96K ohm-40C: 41.04K ohm, +2.7%125C: 38.84K ohm, -2.8%Rmetal (Pos tempco)typ: 5 ohm-40C: 4.192 ohm, -16.16%125C: 6.222 ohm, +24.44%原创 2022-02-11 03:23:03 · 253 阅读 · 0 评论