OCP(open compute project)

最新推荐文章于 2025-03-11 11:21:51 发布

anjuenz87013

最新推荐文章于 2025-03-11 11:21:51 发布

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原文链接：http://www.cnblogs.com/soul-stone/p/8372690.html

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本文概述了开放计算项目(OCP)的三大核心领域：硬件管理，高性能计算(HPC)及网络。硬件管理聚焦于代码贡献流程、固件统一管理及硬件事件远程访问等。HPC项目涵盖低延迟交换、可扩展存储及OCP机械规格等内容。网络部分则涉及无线校园分支、开放网络安装环境、SONIC及Switch Abstraction Interface等方面。

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http://www.opencompute.org/

项目列表：

3、HARDWARE Management

OpenBMC - framework & processes to contribute code, manage source tree & check-in process, oversee build tools and utilities.
Rack Management Controllers- Rack level management solutions (HW, SW, API) and technologies. Review, recommend, collaborate on RM contributions
DMTF Redfish API - review & adopt initial “OCP profile”
Provide uniform management of firmware, alerting of hardware events and remote hardware access. Our focus will be on process automation and scalability by leveraging existing open standards whenever possible. We will coordinate with other groups within the OCP foundation to drive efforts.
Provide a required process for submitting specifications to other workgroups that include a specification for hardware mgmt. The hardware management group will provide a template containing a recommended set or actions and events.

4、HPC

HPC Project Scope:

• Low latency top of rack switching

• Combined Switch and micro servers

• Combined compute and switching

• Low latency scalable storage

• Connectivity from HPC Fabrics/clustering technology to out of cluster networking via ethernet

• OCP mechanicals (19 and 21 inch)

• APIs and software interfaces

• Open Hardware compute and switching Development of OCP HPC Interconnect silicon spec (can build on existing mainstream technologies such as PCIe, RapidIO, Infiniband, Ethernet)

5、NETWORKING

Campus Branch Wireless (CBW)

Open Network Install Environment (ONIE)

Open Network Linux (ONL)

SONIC

Switch Abstraction Interface (SAI)

转载于:https://www.cnblogs.com/soul-stone/p/8372690.html