加固机箱设计资料第289篇:基于3U VPX的 5槽加固机箱

基于3U VPX的 5槽加固机箱

一、产品简介 
      VPX-305 机箱平台是4U高度 3U 5S的一种便携式VPX机箱。由北京太速科技研发,机箱提供1个VPX总线系统槽和4个VPX 外设槽。主要用于组建VPX测试系统。整机美观大方、小巧灵活、安全可靠。可用于外场测试。 
      VPX-305采用工业级3U300W的CPCI交流电源,为系统提供可靠的电压。机箱主板上有用来连接显示器的接口,也有RS232、USB、LAN等接口监控机箱状态。

注:机箱可根据客户要求配置,包含背板槽位和电源类型。

 

 

二、产品特点

  1)符合VITA 46.0规范

   2)符合VITA 46.3规范

   3)符合 VITA 46.4规范

   4)符合VITA 46.10 规范

   5)符合VITA 62规范

   6)符合VITA 65规范

   7)支持3U VPX模块

   8)工业级300W CPCI 电源

   9)1个系统插槽和4个的VPX 外围插槽

   10)背板设计符合标准VPX规范传输要求,数据传输速率2.5、3.25、5、6.25Gbps;

   11)背板在机箱内垂直安装,一共5个槽位,由右至左分别为Slot1~Slot5。其中Slot1为CPU板槽, Slot2~Slot5为用户板槽:Slot1与Slot2~Slot5的每槽通过×4 Rapid IO互联;

   12)支持标准VPX板卡,单槽宽度5HP(兼容4HP宽板卡),采用垂直插卡方式;

   13)背板正面Slot1~Slot5均压接J0-J2 3个连接器;

   14)背板不支持后I/O;

   15)背板每槽安装2个定位销;

   16)带滤网的冷却风扇,上下通风

三、物理特性:

    工作温度:-40 ℃ ~ +85 ℃

    存储温度:-55 ℃ ~ +85℃

    相对湿度:10 ~ 90%

    背板尺寸:128.70×160.84×5.4(高×宽×厚,mm) 

    机箱尺寸:232×195×177(长×宽×高,mm)不含橡胶包角和提手

四、供电要求: 

    电源接入方式: 220V交流输入47pin 连接器,电源与背板一体化设计

    阻抗控制:50 ohm ±10% for strip trace

                   100ohm ±10%for differential signal trace 

 

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Abstract This standard describes VITA 46.0 Advanced Module Format for VMEbus systems, an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. Foreword VME has been the de-facto bus standard for Commercial off the Shelf ( COTS ) Circuit Card Assemblies since the 1980’s. VME boards have proven to be remarkably capable of evolving to support newer technologies with innovations such as VME Subsystem Bus, PCI Mezzanine Cards (PMC’s) and VME320. However, advances in technologies, appearing particularly in interconnects, have demonstrated the need for an advance in system development. This advance needs to accommodate high speed interconnect, particularly serial interconnects, and higher power delivery in concert with better heat removal. This draft standard addresses these needs in the context of IEEE 1101 form factor modules. Other specifications may address alternate outlines, such as VITA-48 (Draft). Because electronics miniaturization is driving the plug-in module I/O count, most system interconnects will need:  Multi-gigabit differential technology  Core computing cluster switched fabrics  Serial RapidIO, PCI Express, Advanced Switching Interconnect  Sufficient ports to enable distributed switching or centralized switching The plethora of high-speed interfaces available for tomorrow’s plug-in modules:  Network interfaces (Fibre Channel, 10 GbE XAUI, Infiniband…,)  Digital video (TMDS, PanelLink, OpenLDI…)  Mass storage interface (Fibre Channel, Serial ATA…,)  FPGA-based inter-board connections (e.g. Xilinx RocketIO)  Custom sensor interfaces VITA 46 provides an evolutionary roadmap for VME users:  To leverage the broad spectrum of high-speed interconnect technologies  Backward compatibility with VME bus electrical, software and selected mechanicals  Enables heterogeneous architectures which preserve existing investments in COTS-based systems  Addresses both 3U and 6U form factors with commonality  Harsh environment fit ‘designed-in’ up front in the standard  Rugged air or conduction-cooled form factors  High value placed on rear-panel I/O  High-speed connector survivability/compliance

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