【Mybatis-Plus】【异常】Inferred type ‘E‘ for type parameter ‘E‘ is not within its bound;

报错如图

加粗样式
【Mybatis-Plus】【异常】Inferred type ‘E‘ for type parameter ‘E‘ is not within its bound;

Inferred type ‘E‘ for type parameter ‘E‘ is not within its bound
类型参数“E”的推断类型“E”不在其绑定内

前言

一、原因?

条件对象类型参数有误

二、解决如图

改实体为scy_oper_log,条件对象类型参数有误,改为正确的即可

修改如下不报错
在这里插入图片描述

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英文第四版 附 源码 内容预览: [Previous] [Next] PUBLISHED BY Microsoft Press A Division of Microsoft Corporation One Microsoft Way Redmond, Washington 98052-6399 Copyright © 1999 by Jeffrey Richter All rights reserved. No part of the contents of this book may be reproduced or transmitted in any form or by any means without the written permission of the publisher. Library of Congress Cataloging-in-Publication Data Richter, Jeffrey. Programming Applications for Microsoft Windows / Jeffrey Richter. p. cm. ISBN 1-57231-996-8 1. Application software--Development. 2. Microsoft Windows (Computer file) I. Title. QA76.76.A65R54 1999 005.26'8--dc21 99-40456 CIP Printed and bound in the United States of America. 1 2 3 4 5 6 7 8 9 WCWC 4 3 2 1 0 9 Distributed in Canada by Penguin Books Canada Limited. A CIP catalogue record for this book is available from the British Library. Microsoft Press books are available through booksellers and distributors worldwide. For further information about international editions, contact your local Microsoft Corporation office or contact Microsoft Press International directly at fax (425) 936-7329. Visit our Web site at mspress.microsoft.com. Intel is a registered trademark of Intel Corporation. Developer Studio, Microsoft, Microsoft Press, MS-DOS, Visual Basic, Visual C++, Visual Studio, Windows, and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Other product and company names mentioned herein may be the trademarks of their respective owners. The example companies, organizations, products, people, and events depicted herein are fictitious. No association with any real company, organization, product, person, or event is intended or should be inferred. Acquisitions Editor: Ben Ryan Pr
EOS/ESD Q. What is the EOS ? A. By definition, electrical overstress (EOS) is "the exposure of an item (an electronic component, for example) to a current or voltage beyond its maximum rating. This exposure may or may not result in a catastrophic failure of the item." Typically, it can be inferred that an overstress has occurred when an item fails to meet its electrical characteristics. Determining whether the failure was caused by an ESD event or some other type of overstress is often more difficult. In addition, overstress may result in latent damage to an item. This damage is not immediately detected in its electrical properties, but could result in a failure of the item later. EOS due to : Ø Electromagnetic pulses (EMP) Ø Electrostatic discharge (ESD) Ø System transients Ø Lightning ESD/EOS Differences Typically generated by: q Power supplies q Test equipment q Event usually lasts from millisecond to seconds Typically > 50us pulse Indications : q Blown metal Lines q Molten Damage q Usually Thermal q High power Subset of EOS q Limited Energy q Usually caused by static q Event lasts from nano to microseconds Not easily visible q Gate oxide breakdown q Junction spiking q Latch up Not always restricted to I/O q May cause functional fails EOS ESD EOS Causes and Effects q Inadequate Work Procedures v Hot switching Insertion / removal of components with power on / not fully powered down. v Inadequate Training. q Poor board design v Transmission of pulses from other equipment e.g... noise form switch mode power supplies. q Poor test development v Test applies signals before powering up chip. v Maximum operating conditions exceeded. q Work Procedures v Documented test/assembly flows. v Correct insertion of devices - use pictorial reminders. v Beware of powered insertions and removals. v Check connections. q Maintenance / Line Monitoring v Equipment not grounded. v Loose connections causing intermittence events. v Poor wire management. v No AC line monitoring. q Board / C

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