我最近想抄一个公板,关于2.4G频率的,资料给了PCB描述,如下 PCB DESCRIPTION:4 LAYER PCB 1.6 MM Copper 1 35 um Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) Copper 2 18 um Dielectric 2-3 1.14 mm (6x 7628M 43% Resin) Copper 3 18 um Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) Copper 4 35 um DE104iML or equivalent substrate (Resin contents around 45%, which gives [email=Er=4.42@2.4GHz]Er=4.42@2.4GHz[/email], TanD=0.016) Dimensions in mil (0.001 inch) DOUBLE SIDE SOLDER MASK, DOUBLE SIDE SILKSCREEN, 8 MIL MIN TRACE WIDTH AND 5 MIL MIN ISOLATION. 有以下问题:1、如“Copper 1 35 um”,是不是 第一层的铜 35um厚的意思? 2、“Dielectric 2-3 1.14 mm (6x 7628M 43% Resin)”为什么是6乘呢? 3、 DE104iML是什么材料? 4、“DOUBLE SIDE SOLDER MASK, DOUBLE SIDE SILKSCREEN,”是不是双面绝缘覆盖,双面丝网印刷又是什么意思? 谢谢! |
1.COPPER 35um是指铜厚1OZ ,35um; 2.使用6张7628PP 3,是ISOLAR的高频材料 4.是双面防焊及文字。 |
4 LAYER PCB 1.6 MM
Copper铜厚: 1 35 umDielectric第一,二层间介质板厚: 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin)
Copper铜厚: 2 18 um
Dielectric第二,三层间介质板厚 2-3 1.14 mm (6x 7628M 43% Resin)
Copper铜厚: 3 18 um
Dielectric第三,四层间介质板厚 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin)
Copper铜厚 4 35 um
板材: DE104iML(介电常数Er=4.42@2.4GHz, 损耗角TanD=0.016)