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RSS订阅原创 How to make QFN solder climb height of 50% or more?
In order to make QFN soldering climb tin height of more than 50%, it is necessary to optimise the stencil design, solder paste selection, soldering environment control, pretreatment process in four aspects.The following are specific programmes and validati
2025-06-13 14:38:00
903
原创 Application of Gold-Tin Solder on Power LED Devices
With the continuous development of LED technology, the luminous efficacy and brightness of LEDs have been improved, especially in the field of solid-state lighting, the market demand for high-power LEDs continues to grow.
2025-06-11 14:56:35
399
原创 Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect
In the surface assembly process of electronic products, especially in the high-volume reflow soldering process, the tombstone effect of passive chip components to the PCBA assembly soldering adds a lot of trouble. With the SMC / CMD micro/miniaturisation,
2025-06-05 14:08:17
492
原创 SZ Fitech Invites You to SEMICON Southeast Asia 2025
As the most prestigious annual event in the semiconductor industry across Southeast Asia, SEMICON SEA 2025 will take place at the Singapore Sands Convention and Exhibition Centre from May 20–22, 2025.
2025-05-15 14:31:53
347
原创 Detailed explanation of the solder paste process in the phenomenon of non-wetting
Non-wetting refers to the soldering process, the solder fails to adequately cover the surface of the substrate pads or device pins, resulting in the formation of a large contact angle between the solder and the base metal (usually > 90 °), and did not form
2025-05-07 14:26:37
491
原创 Difference between BGA flux paste and normal flux paste?
There are significant differences between BGA flux paste and ordinary flux paste, mainly in the following aspects:
2025-04-25 11:36:03
659
原创 Detailed explanation of Mini-LED direct display C0B package solder paste
Mini-LED direct display technology adopts COB (Chip on Board) package, which can achieve high density, high contrast and high brightness display effect.In the COB packaging process, solder paste, as a key connecting material, plays a crucial role in solder
2025-04-23 11:51:29
861
原创 Advantages and disadvantages of water-soluble solder paste?
As an electronic soldering material, water-soluble solder paste has a series of obvious advantages over traditional organic solvent solder paste, but there are also some disadvantages.The following is a detailed analysis of its advantages and disadvantages
2025-04-18 10:22:18
803
原创 Void Caused by the Inherent Characteristics of Solder Paste Flux
Void is the presence of air bubble in a solder joint, which affects the mechanical strength, thermal conductivity and electrical properties of the solder joint. Under the same PCB and device conditions, some soldering materials are prone to void formation,
2025-04-16 10:26:19
671
原创 Mechanism of Intermetallic Compound Formation
Intermetallic compounds are a class of substances formed by chemical bonding of metallic elements in specific atomic proportions.
2025-04-11 11:08:21
739
原创 Explain the composition and characteristics of solder paste?
Solder paste is a key material in electronic soldering, mainly composed of the following three parts:
2025-04-09 10:19:18
251
原创 Analysis of half-wetting phenomenon in the SMT process
The phenomenon of half-wetting, especially the similar behaviour of water on greasy surfaces observed during soldering, as shown in Figure 1-1, is indeed a complex and noteworthy problem.This phenomenon usually involves a number of aspects such as the sold
2025-04-01 13:59:30
628
原创 What is the difference between a solder pad and an overbore?
Pad and Via play different roles in electronics manufacturing and PCB (Printed Circuit Board) design, and the main differences between them are in definition, principle, function and design details.The following is a detailed comparison of the two:
2025-03-28 10:49:08
910
原创 How long after mixing will solder paste fail if it is not used?
Failure management after solder paste mixing is a key quality control aspect. The following is a detailed analysis and summary of failure management after solder paste mixing:
2025-03-26 10:07:23
728
原创 Characteristics of tin whisker growth and prevention and control strategies in room temperature envi
Tin whisker growth has been a major concern in electronics manufacturing.At room temperature, thin, sharp whiskers often appear on the surface of tin coatings, which not only affect the appearance of the product, but can also cause short circuits and lead
2025-03-21 13:59:15
798
原创 How to solve the problem of burrs and tarnish after soldering solder paste?
The problem of burrs and tarnish after solder paste soldering can be caused by a variety of factors, here are some specific solutions:
2025-03-19 10:11:20
748
原创 What are the China domestic solder paste brands?
In the domestic solder paste market, many brands bloom, each with its own speciality.The following is an introduction to some well-known solder paste brands:
2025-03-14 09:58:50
835
原创 Solder leakage problems and improvement strategies in electronics manufacturing
Solder leakage is an important part of electronic manufacturing, and its quality directly affects the subsequent soldering effect and product reliability.As a common problem in the solder paste printing process, solder leakage not only reduces the solderin
2025-03-12 10:49:05
836
原创 How to effectively reduce the cost of using solder paste?
To effectively reduce the cost of using solder paste, you can start from the following aspects:
2025-03-07 10:43:57
689
原创 How to improve the solder creep of solder paste during the soldering process?
Solder paste creeping tin for printing quality and soldering effect is critical.To improve the solder paste in the soldering process to climb the tin, you can start from the following aspects:
2025-03-05 10:58:23
866
原创 Difference between solid crystal solder pasteand normal solder paste
There are significant differences between solid crystal solder paste and regular solder paste in several ways.The following is a detailed comparison of the two:1. Composition and particle sizeSolid crystal solder paste:Tin powder selection: solid crystal s
2025-02-28 11:50:46
567
原创 Improvement of Sn-Bi Low-Temperature Solder Paste by Adding Ag and In
Sn-Bi eutectic solder paste has low soldering temperature requirements and can be soldered at low temperatures. This solder paste is important in the solder market due to its advantages, such as low-temperature soldering and high tensile strength. However,
2025-02-26 13:16:12
628
原创 How to improve the mechanical reliability of SAC solder paste
SAC series solder paste is a common medium-temperature solder in semiconductor packaging. This type of solder paste can be used for soldering work at relatively high temperatures, and the strength after soldering is considerable. However, as the thermal st
2025-02-21 09:58:41
916
原创 Epoxy Flux on POP Laminated Packages
For mobile devices such as mobile phones, area array packages such as BGAs, CSPs or POPs are prone to drop failures and need to be reinforced when they are assembled onto printed circuit boards. While underfill is an alternative solution, it increases manu
2025-02-19 10:34:23
491
原创 Thermomigration of Solder Joints
One of the causes of thermomigration is the inconsistent internal temperature of the alloy. When heat treating a uniform binary alloy, due to the temperature difference between one end and the other end of the alloy, metal atoms will migrate, and the alloy
2025-02-15 11:32:37
864
原创 Common Solder Defects and Root Cause Analysis
it is well known that 60-70% of all solder defects can be traced back to the printing defects such as solder bridging, cold slump and Uneven Solder Paste Deposit while fine tuning the reflow profile do benefit and avoid some soldering defects
2025-02-12 10:13:11
475
原创 Solder Paste for MEMS Package: Atomic Layer Deposition Process Assists PowderMEMS
Solder Paste and Ultra-Fine Solder Manufacturer-Shenzhen Fitech is a comprehensive solder paste supplier integrating production, sales, research, and service of solder paste, epoxy solder paste, and solder powder. Fitech is the leading unit for the formula
2025-01-17 10:41:01
581
原创 How to improve solder paste printing yield?
To improve solder paste printing yield, you can start from the following aspects:
2025-01-15 10:40:53
795
原创 Explain the principle and advantages of laser solder paste
Laser solder paste technology, as an advanced means of soldering, has shown significant advantages in the field of electronics manufacturing.Its principle and advantages are detailed below:
2025-01-10 14:06:09
478
原创 How the price of solder paste is calculated
Thepriceofsolderpasteisindeedcalculatedinavarietyofways,basedonanumberoffactorssuchaspurchasevolume,usage,recyclingandspecialcustomisationneeds.Belowisadetailedsummaryofthesecalculations:
2025-01-08 10:31:05
679
原创 What is wafer microbumping packaging?
Wafer microbumping packaging, more commonly expressed as Wafer Microbumping or Wafer Bumping, is an advanced semiconductor packaging technology.The following is a detailed explanation of Wafer Bumping:
2025-01-03 10:26:52
912
原创 Principle and application method of conductive adhesive
Conductive adhesive, an adhesive that exhibits specific conductive properties after curing or drying, its unique conductive properties and a wide range of application scenarios make it an important and indispensable material in the electronics industry.I.
2024-12-31 10:16:30
713
原创 Analysis of QFN package bridging phenomenon and suggestions for improvement
Bridging in QFN packages is particularly common between the inner rows of solder joints in double-row QFNs, and relatively rare in single-row QFNs.Bridging occurs when solder is pressed against a non-wetted surface, which usually results in an electrical s
2024-12-27 10:29:17
604
原创 The method of preparing fine solder powder (ultra-micro solder powder)
There are various ways to prepare fine solder powder, and five commonly used methods are described below:
2024-12-25 11:06:32
816
原创 LGA device soldering failure analysisand countermeasures-Fitech Solder Paste
LGA (Land Grid Array) is the use of the device body pad as the solder side of the components, under the BTC device, and QFN similar. LGA has no pins and solder balls, and is susceptible to device and PCB deformation, as the body covers the solder, making i
2024-12-20 10:58:04
868
原创 What are the well-known brands of flux?
Fluxes do play a vital role in the manufacturing industry, especially in the electronics manufacturing industry.There are many of its well-known brands, each of which occupies a place in the market by virtue of its unique advantages and characteristics.Bel
2024-12-18 10:09:24
617
原创 What are the solder paste viscosity test methods?
There are various methods of solder paste viscosity testing, each with its own specific scope of application, advantages and disadvantages.Below is an overview of several common solder paste viscosity testing methods:
2024-12-13 11:42:05
794
原创 Does solder paste expire?
Solder pastes can expire. The shelf life of solder pastes generally ranges from 6 months to 1 year, with finer ultra-micro solder pastes or epoxy pastes having a somewhat broken shelf life of 3-6 months storage life. The specific shelf life can be affected
2024-12-11 15:36:12
509
原创 Microstructure and mechanical properties of solder joints
There is a strong link between the microstructure and the mechanical properties of the solder joints, such as the cooling rate, creep and fatigue properties, as well as the lead-free alloy properties have a large impact on the solder joint properties. The
2024-12-06 11:31:55
617
原创 The Impacts of Laser and Reflow Soldering on Solder Joints
With the advent of the "post-Moore era", heterogeneous integration based on small chips will become the mainstream of semiconductor packaging. Small chips tend to be packaged in 3D directions to achieve flexible modular integration and system-on-chip integ
2024-12-04 10:20:59
694
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