1. PartNumber Structure
1.1 BoardAssembly and Module Numbers
All Board Assemblies and Modules, as well as some Mechanicalitems and documentation will consist of the part number elements shown in thefollowing example.
620 - 0001 - 00 1
Class Code Numeric Version Revision
(Section 5.3) Identifier (Section 5.5) (Section 5.6)
(Section 5.4)
1.2 Off-the-Shelfand other Fabricated Parts
Off-the-Shelf purchased parts and all Fabricated parts will notinclude a version and will consist only of the part number elements shown inthe following example.
100 - 0025 1
Class Code Numeric Revision
(Section 5.3) Identifier (Section 5.6)
(Section 5.4)
1.3 ClassCodes
The class code, which is represented as the first threedigits of the part number, shall be used to identify the part. All part numbers must be assigned a classcode in conformance with the following class code list. New classes will be created as needed. See Appendix A – Part Type List for the parttypes that fall under the component classes in Agile.
Passive Components
100 – Resistors
110 – Capacitors
120 – Inductors
130 – Transformers
140 – Passive RF
· Coupler
· Splitter/Combiner
· Bias-T
· Mixer
· Attn
· Terminations
· Z-matching
150 – Switches, Relays
160 – Filters
170 – Connectors
171 – Connector Sub-Assemblies
175 – Sockets
180 – Passive Optics
· Connector
· Mech. Splice
· Coupler/Splitter
· Filter
· Fiber
· Patch Cord
· Pigtail
· Switch
190 – Fuses
195 – Heatsinks
199 – Misc. Passive Components
ActiveComponents
200– Processors, ASSPs
201 – Memory (Generic Part)
202– Programmed Memory
210 – ProgrammableLogic (Generic Part)
212– Logic
213 – Programmed Parts
215 – ASICs
220 –Digital ICs
230 –Analog ICs
240 – RFICs
250 – Discretes(Diodes, Transistors)
260 – LEDs,Lamps, Displays
270 – DC/DCConverters
280 –Optoelectronics
281 –Optical Sub-Assemblies
290 –Oscillators
299 – Misc.Active Components
Hardware
300 – Fasteners
310 – Wire, Cable
315 – Wire, Cable Terminals
320 – Chemicals, Adhesives
330 – Light Pipes
399 – Misc. Hardware
Mechanical
400 – Mechanical Connectors
410 – Power Supply Assemblies
430 – Enclosures, Racks, Chassis
440 – Machined Parts
450 – Sheet Metal Parts
460 – Fabricated Plastic Parts
470 – Cable Assemblies
480 – Mechanical Sub-Assemblies
485 – Mechanical Assemblies
490 – Mechanical Kits
494 – CLEI Labels
495 – Labels
498 – Packaging
499 – Misc. Mechanical
Software &Database Releases
510 – Pre-Boot Software
515 – Bootloader Software
520 – Traverse Software
530 – TransNav Software (All)
531 – TransNav Software (PC)
532 – TransNav Software (UNIX)
597 – CVS Database
598 – ClearQuest Database
599 – ClearCase Database
PCB Assemblies
600 – PCB Assembly Drawings
610 – PCB Drill Drawings
615 – Mechanical Outline ControlDrawings
620 – Schematic Assemblies
630 – Mechanical PCB Assemblies
900 – PCB Assemblies
904 – Top Level Mechanical PCBAs
905 – Top Level PCBAs
Documentation/Specifications
700 – Procedural/ProcessDocumentation
701 – Forms
705 – Product/CompanyCertifications
System Level Documentation
710 – System Level Documentation
Hardware Documentation
720 – Hardware ProductDocumentation
721 – Hardware LogicDocumentation
722 – Hardware OpticDocumentation
723 – Hardware MechanicalDocumentation
724 – Hardware Verification Test(HVT) Documentation
729 – Hardware Application Notes
Software Documentation
730 – Embedded SoftwareDocumentation
731 – Transport SoftwareDocumentation
732 – Network Mgmt. SoftwareDocumentation
733 – Control Plane SoftwareDocumentation
734 – Software Verification Test(SVT) Documentation
735 – General SoftwareDocumentation
736 – System Integration Group(SIG) Documentation
737 – Ethernet SoftwareDocumentation
Operations Documentation
740 – OPS Documentation
Marketing/Product Planning Documentation
770 – Product RequirementsDocumentation
771 – Concept Papers
772 – Release Plans
773 – Feature Lists
774 – Program ManagementDocumentation
775 – Engineering Notes
External Publications Documentation
800– General Information Documentation (Individual Volumes)
805 –Release Notes
810 – CDs
820 –Binders
830 –TransAccess 100 CDs and Hardcopies
840 –Internal Technical Bulletins
841 –External Technical Bulletins
Marketing Communications
880– Brochures
881 – Datasheets
882 – WhitePapers
883 –CD-ROMs
884 –Frequently Asked Questions
885 –Selling Briefs
886 –Marketing Product Guide
887 –Customer Testimonials
Top Level/Sellable Items
905– Top Level PCBAs
910 – OEMEquipment
920 – Rack Equipment (i.e. PDAP,Power Supply, Air Ramp Assy, etc.)
930 – Shelf/Unit Assemblies
950 – Equipment Kits
951 – Rack Assemblies
990 – Embedded Software Releases
991 – TransNav Software Releases
Services
001– Warranties
007 – SiteSurveys
Licenses
050– Node Licenses
Alpha-Numeric Class Codes
ModelNumber – varies, number is set by PLM
1.4 NumericIdentifier
The numeric identifier is a four-digit number that followsthe class code and is separated from the class code by a dash. For Part records in Agile, these numbers containno intelligence and are assigned sequentially beginning with 0001 for eachclass code category. For TechnicalPublications, the Numeric Identifier is used to identify documentation volumereleases.
1.5 VersionControl
Versions in Agile are used for different purposes fordifferent types of records.
1.5.1 PCBAssembly Versions
Versions begin at “01” and are incremented sequentially withevery CAD spin. Each CAD spin willrequire a version change on the following records: PCB Assy Drwg (600), PCB Drill Drwg (610),Schematic Assy (620), PCB Assy (900) and Top Level Assy (905).
1.5.2 MechanicalAssembly Versions
Versions will be assigned to some cable assemblies tosignify different lengths. The versionsare assigned sequentially and the version number does not reflect theactual length of the cable, as in the following example:
470-0046-01 CBLASSY, OPTIC, SM, MPX(F)-2SC, 3M
470-0046-02 CBLASSY, OPTIC, SM, MPX(F)-2SC, 10M
470-0046-03 CBLASSY, OPTIC, SM, MPX(F)-2SC, 20M
1.5.3 DocumentationVersions
Versions on documentation reflect different releases.
1.6 RevisionControl
1.6.1 AssembliesandDesigned Parts
Revision “1” is assigned to products at initial PrototypeRelease. This numeric revision isincremented sequentially for all changes within a given version (See section5.5).
Non-configuration affecting changes within a given versionare given an alpha revision in addition to the numeric revision, i.e. 1, 1A,1B, 2, etc.
When an item is ready to move to Pilot, its status can bechanged without assigning a new revision by using an MCO in Agile. This same procedure holds true for changingfrom Pilot to Production status.
1.6.2 Off-the-ShelfComponent Revisions
All off-the-shelf components will receive an initialrevision of “A” to signify Production Release.
2. Procedure
2.1 ComponentParts
Component Engineering assigns all component part numbers.
2.2 Assemblies
All new assembly requests must come to Doc Control directlyfrom PLM. Once the new assembly requestis received, Doc Control will assign the assembly numbers and create the recordsin Agile. Doc Control will send emailnotification containing the assembly numbers and descriptions, which are to beused on all related documentation for that assembly.
2.3 Documentation
Any employee who has Agile and the appropriate permissions may create a document record in Agile and assign a document number. All other employees must request a document number from Doc. Control.
3. PrintedCircuit Board Identification and Revision Guidelines
All Printed Circuit Boards (PCB’s) will have the following identification:
- All PCB’s will have the Logo, the Board number and Version number or letter (610-00XX-XX) and Made in USA, copper etched and flash gold plated.
- Revision level (Rev. X) will be in silkscreen on the board in the same area as the previous information.
· ECAD will also provide a silkscreenarea on the PCB to designate the area for a label that will be affixed atassembly to provide information such as: BOM revision, top assembly part number,assembly serial number, assembly date code, CM identification, etc.
Appendix A – PartType List
Class | Description | Types | Notes |
100 | Resistors |
|
|
110 | Capacitors |
|
|
120 | Inductors | Chip, Spring, Power, Chokes, Ferrite Beads, Variable, Torroid, Common Mode, Coupled |
|
130 | Transformers | Power, Telecom, RF |
|
140 | Passive RF | Coupler, Splitter/Combiner, Bias-T, Mixer, Attn, Terminations, Z-matching |
|
150 | Switches/Relays | Switch, Relay |
|
160 | Filters | RC, LC, Ceramic, SAW |
|
170 | Connectors | Backplane, Brd-to-Brd, Coaxial, Terminal Block | Includes Test Points. |
171 | Connector Sub-Assemblies |
| Connectors with hardware |
175 | Sockets |
|
|
180 | Passive Optics | Connector, Mech. Splice, Coupler/Splitter, Filter, Fiber, Patch Cord, Pigtail, Switch |
|
190 | Fuses | Fuse, Fuse Holder, Circuit Breaker |
|
195 | Heatsinks |
|
|
199 | Misc Passive |
|
|
200 | Processors/ASSP’s | Microprocessor, Network Processor, PHY, Telecom, PCI, Framer |
|
201 | Memory | SRAM, SSRAM, RDRAM, SDRAM, DRAM, FLASH, EEPROM |
|
202 | Programmed Memory |
| (e.g. Backplane EEPROM) Software file will be attached to the 202 record. |
210 | Programmable Logic | FPGA, CPLD, PLD |
|
212 | Programmed Logic | FPGA, CPLD, PLD | Can be used for factory programmed FPGAs, or to associate a schematic symbol with a generic device. Software file will be attached to the 212 record. |
215 | ASIC | ASIC |
|
220 | Digital IC’s | Logic, uP Support, Timing, SERDES |
|
230 | Analog IC’s | Op-Amp, Comparator, Voltage Ref, Controller, Regulator, A/D, D/A |
|
240 | RF IC’s | Amplifiers, Mixers, Mod/Demod, Switches |
|
250 | Discretes | Bipolar, FET, MOSFET, Diode |
|
260 | LED’s/Displays | LED, Lamp, Display |
|
270 | DC/DC Converters | Encapsulated, Full Brick, ¼ Brick, ½ Brick, Unencapsulated | Modules only. |
280 | Optoelectronics | Source, Detector, IC, Transmitter, Receiver, Transceiver | Includes TIA’s, post-amps, CDR, etc. Optical PHY’s fall under 200. |
281 | Optical Sub-Assemblies |
|
|
290 | Oscillators | XTAL, XO, TCXO, OCXO, Freq Converter |
|
299 | Misc Active |
|
|
300 | Fasteners | Screws, Nuts, Bolts, Washers, Rivets |
|