ti共享内存技术_显卡Ti代表什么 显卡带Ti和不带Ti区别介绍【详解】

显卡中的"Ti"通常代表性能加强版,如GTX1050Ti是GTX1050的升级版,拥有更大显存和更高性能。带Ti的显卡价格更高,性能更强。例如,GTX1050Ti有4GB显存,而GTX1050只有2GB。在高端显卡中,如GTX1070Ti和GTX1080Ti,都是对应型号的加强版。
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  在显卡型号中,有很多显卡名字后都带有Ti,那么 显卡Ti是什么意思?显卡带Ti和不带Ti有哪些区别? 这里为大家介绍下。

  显卡Ti是什么意思?

  在显卡型号中,“Ti”一般指性能加强版的显卡,常见于NVIDIA中端显卡和顶级旗舰显卡中。同通俗来说,带TI的一般就是不带TI的加强版,价格上也要贵一些,性能也会随之增强。

  显卡带Ti和不带Ti有哪些区别?

  以目前NVIDIA主流新中端显卡为例,如GTX1050Ti就是GTX1050的加强版,两者的主要区别主要在于显存容量、频率不同。如GTX1050Ti显存容量为4GB,而GTX1050只有2GB,面对一些比较复杂的游戏,2GB显存显然有着小,而4GB显存可以带来更好的游戏体验。

  此外,在高端显卡中,GTX1070Ti为GTX1070的加强版、GTX1080Ti同样属于GTX1080加强版,性能上会有更强一些的表现,详见:GTX1080Ti和GTX1080对比评测。

  在英伟达历代显卡中,Ti系列一直存在,除了上面介绍的一些比较新的显卡,老一些的还是GTX750Ti、GTX950Ti等等,大家只要知道,Ti版属于加强版,性能上往往会高一个档次,价格当然也更贵一些,大家可以通过 显卡天梯图 秒懂。

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As the world leader in logic, Texas Instruments (TI) offers a full spectrum of logic functions and technologies ranging from the mature bipolar and BiCMOS families to the latest advanced CMOS families. TI offers process technologies with the logic performance and features needed in today’s elec- tronic markets while maintaining support for the traditional logic products. TI’s product offerings include the following process technolo- gies or device families: •AC, ACT, AHC, AHCT, ALVC, AUC, AUP, AVC, FCT, HC, HCT, LV-A, LV-AT, LVC, TVC •ABT, ABTE, ALB, ALVT, BCT, HSTL, LVT •BTA, CB3Q, CB3T, CBT, CBT-C, CBTLV, FB, FIFOs, GTL, GTLP, JTAG, I2C, VME •ALS, AS, F, LS, S, TTL Some Logic families have been in the marketplace for years, the oldest well into their fourth decade. The “Logic Migration Overview” section gives logic users a visual guide to migra- tion from the older to the newer technologies. Today’s applications are evolving with greater functionality and smaller size. TI’s goal is to help designers easily find the ideal logic technology or function they need. By offering logic families at every price/performance node along with bench- mark delivery, reliability and worldwide support, TI maintains a firm commitment to remain in the market with both leading- edge and mature logic lines. The “Product Index” section pro- vides a snapshot of TI’s extensive portfolio by function versus technology. The “Functional Cross-Reference” section shows the portfolio by device (type number) versus technology. Logic suppliers have historically focused on speed and low power as the priorities for product family improvement. As shown in Figure 1, fast performance is offered by many new TI product technologies such as AUC (1.8 V), ALVC (3.3 V) and 0 5 10 15 20 25 0 1 2 3 4 5 6 7 CMOS Voltage, VCC (V) Typical Propagation Delay, tpd (ns) HC AHC AC LVA LVC ALVC AVC AUC Figure 1. CMOS Voltage vs. Speed LV-A (5 V), depending on operating voltage requirements. Other technologies such as AUP focus on delivering “best-in- class” low-power performance. The “Packaging and Marking Information” section shows the wide variety of packaging options offered by TI. Included are advanced surface-mount packages like the fine-pitch, small- outline ball-grid-array (BGA) packages, quad flat no-lead (QFN) packages for gates and octals; and WCSP (NanoStar™/ NanoFree™) packages for single-, dual- and triple-gate functions. The new NanoStar/NanoFree WCSP packages are the world’s smallest logic packages, offering a 70% savings in space over industry-standard SC-70 packages. The “Resources” section provides additional information about TI logic families, including a list of technical literature and an overview of alternate sources for most logic families. Data sheets can be downloaded from the TI web site at www.ti.comor ordered through your local sales office or TI authorized distributor. (See back cover.)
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