电子科技大学硕士研究生毕业论文
电子科技大学硕士研究生毕业论文计算机主板的模态分析
Abstraot
Computer is one of the most widely used electronic equipment．Motherboard is the core hardware of computer,and its dynamic behaviors have significant effect on the behavior and reliability ofthe device．In order to ensure and enhance the quailty of computer,it is necessary to conduct dynamic analysis on motherboard．
To this end，modal analysis on motherboard is performed in the paper,and some issues，including analysis method，test scheme，modeling，means to increase accuracy, optimization，and etc．，are addressed．The research work conducted in the paper is outlined as following．
1．Test modal analysis of motherboard．The modal test is carried out by SIMO (Single Input Mul邱le Output)method，and modal parameters of the motherboard are extracted by multiple reference point modal parameter extraction method in frequency
domain．The indeterminable of this test derives from how to determine the excitation signal and place．
2．Material parameter test，Preparing for modeling the motherboard，the material
parameters of some main parts are measured in this test．Electrical—resistance strain—measurement method is used to determine the elastic modulus and Poison’s ration．The problem of stiffening effect of strain gage in measurement is solved by
software．
3．Finite element modeling。According to finite element(FE)modeling theory,I creates the motherboard’s finite element model basing on the work of material test． During the modeling both computing precision and model size are considering，and geometry shape of some parts are handled at convenience of modeling．Some methods and laws for FE modeling are summed in the phaSe．
4．Numerical modal analysis．Lanczos algorithm is used to solve the FE model of motherboard because of its high solver precision and low time·consuming．The dynamic behavior of motherboard is analysis according test and numerical modal parameters synthetically．
5．Optimization of FE model．According to the comparison of test and num
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