s5pv210芯片wince6.0系统SD卡启动代码修改过程记录

硬件环境：我选择的OM启动方式是：OM3、OM2两个开关等于1，其他都等于0. 从SD/MMC0启动。我的SDMMC0卡座是TF卡，TF卡的型号是：SCUD HC 4GB的卡。

三星S5PV210启动选项是：

1. OneNAND boot:
- Xm0CSn4/NFCSn2/ONANDXL_CSn0 signal should be used for boot.
- iROM code check a checksum data.
(BL1 code must include a checksum data. If BL1 code is loaded into internal SRAM. iROM code will compare a
checksum data made by iROM with loaded one. Loading address is 0xD0020008.)
- OneNand clock is 33MHz using MPLL(667MHz) for boot
2. NAND boot:
- Using H/W 8bit ECC at boot page
- V210 supports 16bit ECC in case of 4KB, 5cycle Nand type.
- V210 supports 4bit ECC in case of 2KB, 5cycle 16-bit bus Nand type.
- iROM code check a checksum data.
- Xm0CSn2/NFCSn0 signal should be used for boot
3. SD/MMC and eMMC boot:
- First boot is using SDMMC CH0 as 4bit.
- Second boot is using SDMMC CH2 as 4bit.
- iROM code check a checksum data.
- SD/MMC clock is 20MHz using EPLL for boot
(BL1 code must include a checksum data. If BL1 code is loaded into internal SRAM. iROM code will compare a
checksum data made by iROM with loaded one. Loading address is 0xD0020008.)
4. eMMC boot
- SDMMC CH0 can be used for eMMC boot(4/8 bit). Bus width is controlled by OM setting
- iROM code check a checksum data.
(BL1 code must include a checksum data. If BL1 code is loaded into internal SRAM. iROM code will compare a
checksum data made by iROM with loaded one. Loading address is 0xD0020008.)
- SD/MMC clock is 20MHz using EPLL for boot

在SMDKV210.BAT里：

set BSP_NOSDMMC_BOOT=
if /i "%BSP_NOSDMMC_BOOT%"=="" set BSP_NONANDFS=1

编译通过了，烧写工具用6410的IROM_Fusing_Tool_SDHC.exe。烧写前都先格式化TF卡为FAT32格式的，烧写stepldr.nb0后把eboot.nb0，bootimage.nb0，nk.bin等文件都拷贝到TF卡上。烧写stepldr.nb0成功后的截图如下：（我只选择IMAGE文件和SD驱动号G，其他没选，这样是否正确呀？）

插上TF卡，开机，串口没有任何输出，测试XpwmTOUT0这个脚，输出脉宽比是：45：55， 说是“No BL1 data in boot device”这个错误。测量TF卡座的CLK脚是有时钟信号的。不知为何会找不到BL1文件。看代码stepldr目录下的makefile.inc文件中有：

!IF "$(BSP_NOSDMMC_BOOT)"!="1"
#   This cuts upper 4Kbytes, In Runnable ROM code, relocation(.rdata section) is not needed
 copy /y/b $(_PLATFORMROOT)\$(_TGTPLAT)\target\$(_TGTCPU)\$(WINCEDEBUG)\stepldr.nb1 + $(_PLATFORMROOT)\$(_TGTPLAT)\target\$(_TGTCPU)\$(WINCEDEBUG)\stepldr.nb2 $(_PLATFORMROOT)\$(_TGTPLAT)\target\$(_TGTCPU)\$(WINCEDEBUG)\stepldr.nb0
!ENDIF

说明已经把stepldr.nb1和nb2都打包进stepldr.nb0了呀！我烧stepldr.nb0进TF卡应该对的呀！！！

烧写eboot.nb0后的截图如下：

插上TF卡启动，输出报错信息同上。

烧写bootimage.nb0，也报同样的错误。因此怀疑是否是TF卡不行呀?大容量SD卡在eboot下不支持吗？