TC358774XBG/TC358775XBG

TC358774XBG/TC358775XBG

Mobile Peripheral Devices

Overview

The TC358774XBG/TC358775XBG Functional Specification defines

operation of the DSI SM to LVDS low power chip (or more abbreviated,

TC358775XBG chip). TC358775XBG is the follow-up chip of

TC358764XBG/ TC358765XBG, which:

1. Is pin compatible to TC358764XBG/TC358765XBG

2. Exhibit LVDS Tx block operates at 1.8V @135 MHz to reduce

operation power

3. Update 4-lane DSI Rx max bit rate @ 1 Gbps/lane to support

1920×1200×24 @60fps

4. Add STBY pin with to enable turning on VDDIO power first before

other power supplies.

The primary function of this chip is DSI-to-LVDS Bridge, enabling

video streaming output over DSI link to drive LVDS-compatible

display panels. The chip supports up to 1600×1200 24-bits per pixel resolution for single-link LVDS and

up to WUXGA (1920×1200 24-bits pixels) resolution for dual-link LVDS. As a secondary