The SPL06-001 is a miniaturized Digital Barometric Air Pressure Sensor with a high accuracy and a low current consumption. The SPL06-001 is both a pressure and a temperature sensor. The pressure sensor element is based on a capacitive sensing principle which guarantees a high precision during temperature changes. The small package makes the SPL06-001 ideal for mobile applications and wearable devices.
The SPL06-001‘s internal signal processor converts the output from the pressure and temperature sensor elements to 24-bit results. Each pressure sensor has been calibrated individually and contains calibration coefficients. The coefficients are used in the application to convert the measurement results to true pressure and temperature values.
The SPL06-001 has a FIFO that can store the latest 32 measurements. By using the FIFO, the host processor can remain in a sleep mode for a longer period of time between readouts. This can reduce the overall system power consumption.
Key features
Pressure range: 300 ... 1100hPa (+9000m ... -500m relating to sea level)
Temperature Range: -40…+85°C
Supply voltage: 1.7 ... 3.6V (VDD), 1.2 ... 3.6V (VDDIO)
Package: LGA package with metal lid
Small footprint: 2.5mm x 2.0mm; Super-flat: 0.95mm height
Relative accuracy: ±0.06hPa, equiv. to ±0.5 m
Absolute accuracy: typ. ±1hPa (300 … 1100hPa)
Temperature accuracy: ± 0.5°C.
Pressure temperature sensitivity: < 0.5Pa/K
Measurement time: Typical: 28 ms. Minimum: 3 ms.
Average current consumption: High precision: 60 µA, Low power: 3 µA, Standby: <1 µA.
I2C and SPI interface, Embedded 24-bit ADC
FIFO: Stores latest 32 pressure or temperature measurements.
Pb-free, halogen-free and RoHS compliant
MSL 1
Typical applications
Enhancement of GPS navigation (dead-reckoning, slope detection, etc.)
In- and out-door navigation
Leisure and sports
Weather forecast
Vertical velocity indication (rise/sink speed)
Specific notes
Particles can influence the performance of the pressure sensor, we strongly recommend you to introduce
special measures to avoid deposition of particles on the MEMS membrane or screen particles after
assembly as the assembly process is considered to be the main root cause for particle generation