设计模式解析习题解答,已经做好目录标签
Design Patterns Explained - Review Questions and Answers
Table of Contents
• Chapter 1: The Object-Oriented Paradigm
• Chapter 2: The UML - The Unified Modeling Language
• Chapter 3: A Problem That Cries Out for Flexible Code
• Chapter 4: A Standard Object-Oriented Solution
• Chapter 5: An Introduction to Design Patterns
• Chapter 6: The Façade Pattern
• Chapter 7: The Adapter Pattern
• Chapter 8: Expanding Our Horizons
• Chapter 9: The Strategy Pattern
• Chapter 10: The Bridge Pattern
• Chapter 11: The Abstract Factory Pattern
• Chapter 12: How Do Experts Design?
• Chapter 13: Solving The CAD/CAM Problem with Patterns
• Chapter 14: The Principles and Strategies of Design Patterns
• Chapter 15: Commonality and Variability Analysis (CVA)
• Chapter 16: The Analysis Matrix
• Chapter 17: The Decorator Pattern
• Chapter 18: The Observer Pattern
• Chapter 19: The Template Method Pattern
• Chapter 20: Lessons from Design Patterns: Factories
• Chapter 21: The Singleton Pattern and the Double-Checked Locking Pattern
• Chapter 22: The Object Pool Pattern
• Chapter 23: The Factory Method Pattern
• Chapter 24: Summary of Factories (no review questions)
• Chapter 25: Design Patterns Reviewed: A Summation and a Beginning
MFC 2019 微软官方文档 共计6780页 带标签
MFC 2019 微软官方文档 共计6780页 带标签, 相当于把MFC相关的MSDN整合到一个PDF文件里。
DataTables
vector中存放300000个指向类DataItem(3个字段和一个构造函数)的指针,回收所有DataItem的内存和清除vector后,为什么整个进程还占6M呢,是vector导致内存泄露,还是啥原因,大神一定要给我说清楚啊,我应经想了好几天了@简悦云风 @左耳朵耗子 @GeniusVczh
MFC.chm 中文版
MFC 中文版文档, CHM格式,放在一起查询方便
windows进程知识库.chm
windows进程知识库 process thread CreateEvent Mutex EnterCriticalSection you know
Production Testing of RF and System-on-a-Chip Devices for Wireless Communications((Artech.House.Publishers.Apr.2004)
Production Testing of RF and
System-on-a-Chip Devices for
Wireless Communications
Keith B. Schaub
Joe Kelly
==========================
It came to our attention that there were not any books available that enlightened the
engineer on the concepts of production testing of radio frequency (RF) and systemon-
a-chip (SOC) devices. There is a number of great books and application notes on
the subject of RF measurement techniques. There is also a number of great mixedsignal
analysis and measurements how-to books. However, there are no books that
bring the two worlds of RF and mixed-signal testing into one volume. It is our intention
to bridge this gap.
Under the topic of electronics there are two major categories of devices, digital
and analog. Digital refers to those devices that manipulate data between two states
(i.e., 1 or 0). Analog refers to the manipulation of continuous waveforms. Analog
electronics is a very general topic, and for the most part, the subject falls under the
category of mixed signal. Analog measurements are also covered in this category.
However, when discussing RF electronics (also analog), special attention must be
paid to the rules introduced under the category of mixed-signal testing. It is these
rules that often make people approach RF with trepidation. But, they are simply
that, rules. If they are followed, RF is very straightforward. An RF engineer could
reference back to old college books as these topics and test concepts are derived
from the fundamental theories of physics. However, our goal is to present these
measurements within this book in a straightforward manner, with explanations
covering the gotchas that all of us have run into over time.
Indeed, many of the descriptions will be based on microwave theory and the
theory of microwave devices. But this is a necessary foundation, so that topics may
be taken two steps further:
1. Describing the test;
2. Explaining how to implement production-testing solutions.
Testing and measuring RF and SOC devices is routinely performed on bench
tops in laboratories, but production testing adds the constraints of performing these
tests significantly more efficiently, while maintaining the same level of quality. The
term efficiently commonly means “more quickly,” but it can also mean introducing
creative means such as multisite testing or parallel testing. Topics such as these will
be covered throughout the chapters in this book.
This book is intended for a wide variety of audiences. They include SOC applications
engineers, engineering managers, product engineers, and students, although
other disciplines can benefit as well. The book is constructed in two parts. The first
part consists of the first three chapters, readable like a novel, informing the reader of
the details of production testing and presenting items to consider such as cost of test
xiii
(COT). The second half (Chapters 4 through 8) is written as a handbook, specifically
for applications engineers. It is our intention to create a book that will be used
as a reference, providing algorithms and good-practice techniques. Additionally, the
appendixes that we have included contain items that would typically be needed by
SOC engineers. The book is also aimed at managers of technical teams, that they
may pick up this book, read the first few chapters, and feel comfortable in relatively
detailed discussions involving applications and production-test solutions.
A few years ago, an RF applications engineer would be very focused in this very
unique (often termed complex) field performing tests on discrete RF devices such as
mixers, power amplifiers, low noise amplifiers, and RF switches. Times have
changed. Today, we face increasing levels of integration, such that many of these discrete
device functions are contained within one chip or module. Furthermore, the
integration levels are such that RF chips contain lower-frequency analog functionality,
as well as digital functionality (earlier RF devices often contained three-wire
serial communications for controlling things such as gain control, but current digital
is becoming more complex). Indeed, it would be more accurate, when referring to
this new breed of engineers, to coin the term SOC engineer when discussing today’s
wireless applications.
Chapter 1 provides an overview of the many facets of production testing, with
particular focus on the testing of RF and SOC devices. Many of the topics also
directly work for other types of electronic device production testing. Additionally,
the various capital expense items are covered, such as handlers, wafer probers, load
boards, contactors, and so forth. There are not many general information application
notes available on these topics, and this chapter is intended to bring them
together to one location.
Chapter 2 introduces the devices, both RF and SOC, that this book focuses on.
A review of how the radio has evolved in wireless communications is presented. The
superheterodyne radio and direct conversion (zero-if) architectures are discussed, as
are their changes over time and their impact on testing. Lastly, an overview of the
types of tests that are performed on each type of device is presented.
Cost of test is reviewed in Chapter 3. An in-depth analysis is presented in this
chapter with the intention to be a guide for those making decisions on how to implement
final tests of devices. Note that this chapter, while presented in a book on RF
testing, can be applied equally to any other type of electronic device or wafer testing.
The intention is for this chapter to be useful to managers, sales teams, and applications
engineers who go beyond the role of sitting behind the tester. Also presented in
this chapter is a discussion of the traditional models of production test. Topics considered
include the advantages and disadvantages of using third-party-testing integrated
design manufacturers (IDMs) versus subcontract manufacturers (SCMs). An
analytical tool will be presented for calculating cost of test, including many necessary
components that are often overlooked when deciding how to perform production
testing.
Algorithms for production tests performed on discrete RF devices, as well as the
front end of more highly integrated devices are presented in Chapter 4, the beginning
of the handbook-type portion of this book. Detailed descriptions of the tests, as well
as algorithms in both tabular and block diagram formats, are provided.
xiv Preface
Following the format of Chapter 4, Chapter 5 provides algorithms on measurements
used with more highly integrated SOC devices. The tests discussed in this section
are typical of those found in wireless communications.
Chapter 6 is an introduction to many facets of mixed-signal testing. Common
tests that are finding their way into SOC device production testing are explained.
Chapter 7 covers new methods for improving the efficiency of production testing,
taking it beyond simply performing the measurements faster. Concepts such as
parallel and concurrent testing are presented.
Chapter 8 is dedicated to the measurement of noise. Both noise figure and phase
noise measurements are discussed. The intention of this chapter is to educate the
engineer in what goes on behind the scenes of today’s easy-to-use noise figure analyzers
and automated test equipment (ATE). Gone are the days when the engineer
had to manually extract noise measurements, but it is important to understand the
algorithms, which even today, within analyzers, effectively remain unchanged.
There is further explanation on how to perform noise measurements in a
production-test environment. Phase noise is also be considered and examined.
Appendixes 4A, A, and B are included to cover the common items that every
engineer is often running hastily to find from their notes.
We look forward to helping to merge the worlds of RF and mixed-signal production
testing.
Keith Schaub
Joe Kelly
March 2004
Timing And Patterns
By Dirk Hill
================
Timing and Patterns
• Timing Diagram
• Timing
• Formats
• Timing II
• Patterns
• Bringing It All Together
This is a short paper on the basics of test development. This one covers
developing a set of formats, timing sets and a pattern from a timing diagram
and timing table.
The device used is a simple SRAM memory device with a multiplexed bus. It
has 16 memory locations accessed by four parallel address/data lines.
There are three control lines: Address Latch Enable (ALE), Write enable
(WR), and Read enable (RD).
To access a memory location the address must first be latched and then
either a read or write cycle follows. (Once an address is latched multiple
Writes and Reads can take place on the same location. We do not take
advantage of this in this paper.)
This paper does not take DC parametrics into consideration.
The “tester” is a simplified one with a tester-per-pin architecture (that is all
the pins are input and output pins). It is capable of timeset and format
switching on the fly. It has 4 edgesets and 4 format sets per pin and 10 time
sets. (We do not take advantage of format switching on the fly in this paper.)
MEMS An_Introduction_to_Microelectromechanical_Systems_Engineering
MEMS-An_Introduction_to_Microelectromechanical_Systems_Engineering-2nd_edition-eBook_LiB-Artech_House_Publishers.pdf
====================
corresponding technology has enjoyed a fast pace of
development and has rapidly spread to institutions and companies on all inhabited
continents. A search of the keyword MEMS in all granted patents in the United
States since 1998 returns nearly 4,000 patents and references. Many devices have
left universities to go into commercial development, and several have reached the
stage of becoming products. It is therefore appropriate to extensively revise the text
to incorporate advances in the field, new products, as well as suggestions from the
readers.
As we revised the original text and added substantial new material, we strived to
retain the style characteristic of an introductory book intended for a broad audience
of scientists, engineers, students, and business executives. This revised edition continues
to assume that the reader has no prior experience in MEMS technology but
does possess an understanding of basic scientific concepts equivalent to first-year
college physics and chemistry. The objective remained to introduce a select number
of representative demonstrators that are now or are soon to be commercially available.
We added many more illustrations and pictures to aid the reader in developing
a familiarity with the technology. We also included throughout the text more practical
tidbits that are useful to those who wish to apply this technology to their needs.
In this revision, we have expanded on the fabrication processes, adding new
methods and materials. The advantages and limitations of many micromachined
structures are covered in more detail. We divided the chapter on commercial structures
into four chapters, each focusing on a specific application, and then expanded
each chapter with appropriate material covering new technical developments and
products. Chapter 4 is now specific to automotive and industrial applicat
VHDL编程的一些心得体会
VHDL是由美国国防部为描述电子电路所开发的一种语言,其全称为(Very High Speed Integrated Circuit) Hardware Description Language。 与另外一门硬件描述语言Verilog HDL相比,VHDL更善于描述高层的一些设计,包括系统级(算法、数据通路、控制)和行为级(寄存器传输级),而且VHDL具有设计重用、大型设计能力、可读性强、易于编译等优点逐渐受到硬件设计者的青睐。但是,VHDL是一门语法相当严格的语言,易学性差,特别是对于刚开始接触VHDL的设计者而言,经常会因某些小细节处理不当导致综合无法通过。为此本文就其中一些比较典型的问题展开探讨,希望对初学者有所帮助,提高学习进度。
基于CPLD的三相多波形函数发生器设计
基于CPLD 的三相多波形函数发生器设计
文章作者:尹佳喜 尹 仕
文章出处:国外电子元器件
摘要:介绍了基于可编程逻辑器件CPLD 和直接数字频率合成技术(DDS)的三相多波形函数发生器的基本原理,
并在此基础上给出了基于CPLD 的各模块设计方法及其VHDL 源程序。
关键词:CPLD;直接数字频率合成;函数发生器;VHDL