softfox的专栏

Design Patterns Explained - Review Questions and Answers Table of Contents • Chapter 1: The Object-Oriented Paradigm • Chapter 2: The UML - The Unified Modeling Language • Chapter 3: A Problem That Cries Out for Flexible Code • Chapter 4: A Standard Object-Oriented Solution • Chapter 5: An Introduction to Design Patterns • Chapter 6: The Façade Pattern • Chapter 7: The Adapter Pattern • Chapter 8: Expanding Our Horizons • Chapter 9: The Strategy Pattern • Chapter 10: The Bridge Pattern • Chapter 11: The Abstract Factory Pattern • Chapter 12: How Do Experts Design? • Chapter 13: Solving The CAD/CAM Problem with Patterns • Chapter 14: The Principles and Strategies of Design Patterns • Chapter 15: Commonality and Variability Analysis (CVA) • Chapter 16: The Analysis Matrix • Chapter 17: The Decorator Pattern • Chapter 18: The Observer Pattern • Chapter 19: The Template Method Pattern • Chapter 20: Lessons from Design Patterns: Factories • Chapter 21: The Singleton Pattern and the Double-Checked Locking Pattern • Chapter 22: The Object Pool Pattern • Chapter 23: The Factory Method Pattern • Chapter 24: Summary of Factories (no review questions) • Chapter 25: Design Patterns Reviewed: A Summation and a Beginning

MFC 2019 微软官方文档 共计6780页 带标签, 相当于把MFC相关的MSDN整合到一个PDF文件里。

vector中存放300000个指向类DataItem(3个字段和一个构造函数)的指针，回收所有DataItem的内存和清除vector后，为什么整个进程还占6M呢，是vector导致内存泄露，还是啥原因，大神一定要给我说清楚啊，我应经想了好几天了@简悦云风 @左耳朵耗子 @GeniusVczh

名著，中文版,侯捷翻译的。永久收藏版。

MFC 中文版文档， CHM格式，放在一起查询方便

Process Monitor 中文版，绝对能用。

windows进程知识库 process thread CreateEvent Mutex EnterCriticalSection you know

windows程序设计 第二版 (王艳平版)原书代码

软件调试与优化典型应用 原书配套CD里的代码

Production Testing of RF and System-on-a-Chip Devices for Wireless Communications Keith B. Schaub Joe Kelly ========================== It came to our attention that there were not any books available that enlightened the engineer on the concepts of production testing of radio frequency (RF) and systemon- a-chip (SOC) devices. There is a number of great books and application notes on the subject of RF measurement techniques. There is also a number of great mixedsignal analysis and measurements how-to books. However, there are no books that bring the two worlds of RF and mixed-signal testing into one volume. It is our intention to bridge this gap. Under the topic of electronics there are two major categories of devices, digital and analog. Digital refers to those devices that manipulate data between two states (i.e., 1 or 0). Analog refers to the manipulation of continuous waveforms. Analog electronics is a very general topic, and for the most part, the subject falls under the category of mixed signal. Analog measurements are also covered in this category. However, when discussing RF electronics (also analog), special attention must be paid to the rules introduced under the category of mixed-signal testing. It is these rules that often make people approach RF with trepidation. But, they are simply that, rules. If they are followed, RF is very straightforward. An RF engineer could reference back to old college books as these topics and test concepts are derived from the fundamental theories of physics. However, our goal is to present these measurements within this book in a straightforward manner, with explanations covering the gotchas that all of us have run into over time. Indeed, many of the descriptions will be based on microwave theory and the theory of microwave devices. But this is a necessary foundation, so that topics may be taken two steps further: 1. Describing the test; 2. Explaining how to implement production-testing solutions. Testing and measuring RF and SOC devices is routinely performed on bench tops in laboratories, but production testing adds the constraints of performing these tests significantly more efficiently, while maintaining the same level of quality. The term efficiently commonly means “more quickly,” but it can also mean introducing creative means such as multisite testing or parallel testing. Topics such as these will be covered throughout the chapters in this book. This book is intended for a wide variety of audiences. They include SOC applications engineers, engineering managers, product engineers, and students, although other disciplines can benefit as well. The book is constructed in two parts. The first part consists of the first three chapters, readable like a novel, informing the reader of the details of production testing and presenting items to consider such as cost of test xiii (COT). The second half (Chapters 4 through 8) is written as a handbook, specifically for applications engineers. It is our intention to create a book that will be used as a reference, providing algorithms and good-practice techniques. Additionally, the appendixes that we have included contain items that would typically be needed by SOC engineers. The book is also aimed at managers of technical teams, that they may pick up this book, read the first few chapters, and feel comfortable in relatively detailed discussions involving applications and production-test solutions. A few years ago, an RF applications engineer would be very focused in this very unique (often termed complex) field performing tests on discrete RF devices such as mixers, power amplifiers, low noise amplifiers, and RF switches. Times have changed. Today, we face increasing levels of integration, such that many of these discrete device functions are contained within one chip or module. Furthermore, the integration levels are such that RF chips contain lower-frequency analog functionality, as well as digital functionality (earlier RF devices often contained three-wire serial communications for controlling things such as gain control, but current digital is becoming more complex). Indeed, it would be more accurate, when referring to this new breed of engineers, to coin the term SOC engineer when discussing today’s wireless applications. Chapter 1 provides an overview of the many facets of production testing, with particular focus on the testing of RF and SOC devices. Many of the topics also directly work for other types of electronic device production testing. Additionally, the various capital expense items are covered, such as handlers, wafer probers, load boards, contactors, and so forth. There are not many general information application notes available on these topics, and this chapter is intended to bring them together to one location. Chapter 2 introduces the devices, both RF and SOC, that this book focuses on. A review of how the radio has evolved in wireless communications is presented. The superheterodyne radio and direct conversion (zero-if) architectures are discussed, as are their changes over time and their impact on testing. Lastly, an overview of the types of tests that are performed on each type of device is presented. Cost of test is reviewed in Chapter 3. An in-depth analysis is presented in this chapter with the intention to be a guide for those making decisions on how to implement final tests of devices. Note that this chapter, while presented in a book on RF testing, can be applied equally to any other type of electronic device or wafer testing. The intention is for this chapter to be useful to managers, sales teams, and applications engineers who go beyond the role of sitting behind the tester. Also presented in this chapter is a discussion of the traditional models of production test. Topics considered include the advantages and disadvantages of using third-party-testing integrated design manufacturers (IDMs) versus subcontract manufacturers (SCMs). An analytical tool will be presented for calculating cost of test, including many necessary components that are often overlooked when deciding how to perform production testing. Algorithms for production tests performed on discrete RF devices, as well as the front end of more highly integrated devices are presented in Chapter 4, the beginning of the handbook-type portion of this book. Detailed descriptions of the tests, as well as algorithms in both tabular and block diagram formats, are provided. xiv Preface Following the format of Chapter 4, Chapter 5 provides algorithms on measurements used with more highly integrated SOC devices. The tests discussed in this section are typical of those found in wireless communications. Chapter 6 is an introduction to many facets of mixed-signal testing. Common tests that are finding their way into SOC device production testing are explained. Chapter 7 covers new methods for improving the efficiency of production testing, taking it beyond simply performing the measurements faster. Concepts such as parallel and concurrent testing are presented. Chapter 8 is dedicated to the measurement of noise. Both noise figure and phase noise measurements are discussed. The intention of this chapter is to educate the engineer in what goes on behind the scenes of today’s easy-to-use noise figure analyzers and automated test equipment (ATE). Gone are the days when the engineer had to manually extract noise measurements, but it is important to understand the algorithms, which even today, within analyzers, effectively remain unchanged. There is further explanation on how to perform noise measurements in a production-test environment. Phase noise is also be considered and examined. Appendixes 4A, A, and B are included to cover the common items that every engineer is often running hastily to find from their notes. We look forward to helping to merge the worlds of RF and mixed-signal production testing. Keith Schaub Joe Kelly March 2004

By Dirk Hill ================ Timing and Patterns • Timing Diagram • Timing • Formats • Timing II • Patterns • Bringing It All Together This is a short paper on the basics of test development. This one covers developing a set of formats, timing sets and a pattern from a timing diagram and timing table. The device used is a simple SRAM memory device with a multiplexed bus. It has 16 memory locations accessed by four parallel address/data lines. There are three control lines: Address Latch Enable (ALE), Write enable (WR), and Read enable (RD). To access a memory location the address must first be latched and then either a read or write cycle follows. (Once an address is latched multiple Writes and Reads can take place on the same location. We do not take advantage of this in this paper.) This paper does not take DC parametrics into consideration. The “tester” is a simplified one with a tester-per-pin architecture (that is all the pins are input and output pins). It is capable of timeset and format switching on the fly. It has 4 edgesets and 4 format sets per pin and 10 time sets. (We do not take advantage of format switching on the fly in this paper.)

MEMS-An_Introduction_to_Microelectromechanical_Systems_Engineering-2nd_edition-eBook_LiB-Artech_House_Publishers.pdf ==================== corresponding technology has enjoyed a fast pace of development and has rapidly spread to institutions and companies on all inhabited continents. A search of the keyword MEMS in all granted patents in the United States since 1998 returns nearly 4,000 patents and references. Many devices have left universities to go into commercial development, and several have reached the stage of becoming products. It is therefore appropriate to extensively revise the text to incorporate advances in the field, new products, as well as suggestions from the readers. As we revised the original text and added substantial new material, we strived to retain the style characteristic of an introductory book intended for a broad audience of scientists, engineers, students, and business executives. This revised edition continues to assume that the reader has no prior experience in MEMS technology but does possess an understanding of basic scientific concepts equivalent to first-year college physics and chemistry. The objective remained to introduce a select number of representative demonstrators that are now or are soon to be commercially available. We added many more illustrations and pictures to aid the reader in developing a familiarity with the technology. We also included throughout the text more practical tidbits that are useful to those who wish to apply this technology to their needs. In this revision, we have expanded on the fabrication processes, adding new methods and materials. The advantages and limitations of many micromachined structures are covered in more detail. We divided the chapter on commercial structures into four chapters, each focusing on a specific application, and then expanded each chapter with appropriate material covering new technical developments and products. Chapter 4 is now specific to automotive and industrial applicat

VHDL是由美国国防部为描述电子电路所开发的一种语言，其全称为(Very High Speed Integrated Circuit) Hardware Description Language。 与另外一门硬件描述语言Verilog HDL相比，VHDL更善于描述高层的一些设计，包括系统级（算法、数据通路、控制）和行为级（寄存器传输级），而且VHDL具有设计重用、大型设计能力、可读性强、易于编译等优点逐渐受到硬件设计者的青睐。但是，VHDL是一门语法相当严格的语言，易学性差，特别是对于刚开始接触VHDL的设计者而言，经常会因某些小细节处理不当导致综合无法通过。为此本文就其中一些比较典型的问题展开探讨，希望对初学者有所帮助，提高学习进度。

基于CPLD 的三相多波形函数发生器设计 文章作者：尹佳喜 尹 仕 文章出处：国外电子元器件 摘要：介绍了基于可编程逻辑器件CPLD 和直接数字频率合成技术（DDS）的三相多波形函数发生器的基本原理， 并在此基础上给出了基于CPLD 的各模块设计方法及其VHDL 源程序。 关键词：CPLD；直接数字频率合成；函数发生器；VHDL