本文档详细介绍了BSENIEC61760-1:2020标准，涉及表面安装组件（SMD）的规格和测试方法。该标准旨在确保各种SMD组件能在组装过程中统一进行放置、焊接及后续处理，如清洁和检查。内容包括组件规格、过程条件和测试条件，为SMD组件制造商和用户提供了参考。部分要求也适用于有引脚的电路板组件。
新版完整标准 BS EN IEC 61760-1：2020 表面安装组件（SMD）规范的标准方法 - 最新完整英文版（50页）
新版完整标准BSENIEC61760-1：2020表面安装组件（SMD）规范的标准方法-最新完整英文版（50页）-行业报告文档类资源-CSDN下载新版完整标准BSENIEC61760-1：2020表面安装组件（SMD）规范的标准方法-更多下载资源、学习资料请访问CSDN下载频道.
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This part of IEC 61 760 defines requirements for component specifications of electronic
components that are intended for usage in surface mounting technology. To this end, it
specifies a reference set of process conditions and related test conditions to be considered
when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to
the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during
assembly. This document defines tests and requirements that need to be part of any SMD
component's general, sectional or detail specification. In addition, this document provides
component users and manufacturers with a reference set of typical process conditions used in
surface mounting technology.
Some of the requirements for component specifications in this document are also applicable
to components with leads intended for mounting on a circuit board. Cases for which this is
appropriate are indicated in the relevant subclauses.
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