直插元件封装焊盘各层面尺寸的选取:
1. BEGINLAYER
Regular Pad :根据器件的数据手册提供的焊盘大小或者自测得的器件引脚尺寸来定。Thermal
Relief :通常比Regular Pad 大20mil 。Anti Pad :与Thermal Relief 设置一样。
2. ENDLAYER
与BEGINLAYER 设置一样。
3. DEFAULT INTERNAL
该层各个参数设置如下:
DRILL_SIZE >= 实际管脚尺寸+ 10MIL
50mil=1.27mm
40mil=1mm
(DRILL_SIZE<50) Regular Pad ≥ DRILL_SIZE + 16MIL(0.4mm)=实际管脚尺寸+26MIL=实际管脚尺寸+0.66mm
(DRILL_SIZE≥50) Regular Pad ≥DRILL_SIZE + 30MIL(0.76mm)=实际管脚尺寸+40MIL=实际管脚尺寸+1mm
(钻孔为矩形或椭圆形时) Regular Pad ≥ DRILL_SIZE + 40MIL(1mm)=实际管脚尺寸+50MIL=实际管脚尺寸+1.25mm
Thermal Pad = TRaXbXc-d 其中TRaXbXc-d 为Flash 的名称(后面有介绍)
见 https://blog.csdn.net/u014333269/article/details/80559224
Anti Pad = DRILL_SIZE + 30MIL=实际管脚尺寸+1mm
SOLDERMASK = Regular_Pad + 6MIL=实际管脚尺寸+0.4mm
总结:
管脚直径<1mm:Regular Pad≥实际管脚尺寸+0.66mm
管脚直径≥1mm:Regular Pad≥实际管脚尺寸+1mm
Anti Pad =实际管脚尺寸+1mm
SOLDERMASK = 实际管脚尺寸+0.4mm