频谱混叠现象验证matlab,频谱混叠对光纤陀螺振动特性测试的影响

[1] Lefevre H C.The fiber-optic gyroscope[M].Norwood:Artech House, 1993:1-5

[2] Pavlath G A.Closed-loop fiber optic gyros[C]//Fiber Optic Gyros:20th Anniversary Conference.Washington:SPIE, 1996: 47-60

[3] Lefèvre H C.Fundamentals of interferometric fiber optic gyroscope[C]//Fiber Optic Gyros:20th Anniversary Conference.Washington:SPIE, 1996:2-27

[4] 张桂才.光纤陀螺原理与技术[M].北京:国防工业出版社, 2008:84-86 Zhang Guicai.The principles and technologies of fiber optic gyroscope[M].Beijing:National Defense Industry Press, 2008:84-86(in Chinese)

[5] 蔡明.光纤陀螺光纤环振动和温度对其精度影响及检测研究[D].成都:电子科技大学, 2012 Cai Ming.Study on the influence on accuracy and detection of fi-ber vibration and temperature of FOG[D].Chengdu:University of Electronic Science and Technology of China, 2012(in Chinese)

[6] 孟娟.光纤陀螺振动特性研究[D].哈尔滨:哈尔滨工程大学, 2009 Meng Juan.Study on the vibration performance of fiber optic gyroscope[D].Harbin:Harbin Engineering University, 2009(in Chinese)

[7] 宋凝芳, 张春熹, 李立京, 等.数字闭环光纤陀螺振动误差分析[J].北京航空航天大学学报, 2004, 30(8):702-704 Song Ningfang, Zhang Chunxi, Li Lijing, et al.Analysis of vibration error in digital closed-loop fiber optic gyroscope[J].Journal of Beijing University of Aeronautics and Astronautics, 2004, 30(8):702-704(in Chinese)

[8] 吴衍记, 刘淑荣.数字闭环光纤陀螺频率特性分析与测试[J].中国惯性技术学报, 2008, 16(6):730-734 Wu Yanji, Liu Shurong.Testing and analyzing for frequency characteristics of digital closed-loop FOG[J].Journal of Chinese Inertial Technology, 2008, 16(6):730-734(in Chinese)

[9] 舒建涛.高精度光纤陀螺光纤环振动特性研究[D].哈尔滨:哈尔滨工程大学, 2011 Shu Jiantao.Study on the performance of fiber optic gyroscope coil under vibration condition[D].Harbin:Harbin Engineering University, 2011(in Chinese)

[10] 舒建涛, 李绪友, 吴磊, 等.高精度光纤陀螺振动误差抑制技术[J].红外与激光工程, 2011, 40(11):2201-2206 Shu Jiantao, Li Xuyou, Wu Lei, et al.Vibration error restrain technology for high-precision fiber optic gyroscope[J].Infrared and Laser Engineering, 2011, 40(11):2201-2206(in Chinese)

[11] 孙学军.通信原理[M].北京:电子工业出版社, 2007:61-63 Sun Xuejun.Communication fundamentals[M].Beijing:Publishing House of Electronics Industry, 2007:61-63(in Chinese)