摘要:
With the rapid development of highly integrated computer chips, tremendous heat generation in the closet has become a major concern for thermal management. At present, conventional thermal management schemes such as aircooling and liquid cooling have reached their application limits. The proposition of a liquid metal chip cooling method opens new possibilities for solving the above tough issues. In this paper, a liquid metal cooling system isdesigned and integrated into a desktop. Its practical cooling capacity is evaluated. The results demonstrate that the liquid metal cooling system can effectively dissipate the heat generated by the desktop computer. The present work provides a basis for further developing the liquid metal cooling technology which can actually be used in reality. This is the first report for the application of the liquid metal cooling method in a practical computer.
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