计算机组成与设计硬件软件接口--课后习题答案
Part II: Solutions Guide
52 Instructors Manual for Computer Organization and Design
1 Solutions
1.1 q
1.2 u
1.3 f
1.4 a
1.5 c
1.6 d
1.7 i
1.8 k
1.9 j
1.10 o
1.11 w
1.12 p
1.13 n
1.14 r
1.15 y
1.16 s
1.17 l
1.18 g
1.19 x
1.20 z
1.21 t
1.22 b
1.23 h
1.24 m
1.25 e
1.26 v
1.27 j
1.28 b
1.29 f
1.30 j
1.31 i
1.32 e
Part II: Solutions Guide 53
1.33 d
1.34 g
1.35 c
1.36 g
1.37 d
1.38 c
1.39 j
1.40 b
1.41 f
1.42 h
1.43 a
1.44 a
1 1 1 minutes sec onds
1.45 Time for revolution = rev ¥ ¥ 60 = 5.56 ms
2 2 5400 rev minute
1 1 1 minutes sec onds
Time for revolution = rev ¥ ¥ 60 = 4.17 ms
2 2 7200 rev minute
1.46 As discussed in section 1.4, die costs rise very fast with increasing die area. Con-
sider a wafer with a large number of defects. It is quite likely that if the die area is very
small