CPU air cooled heat sink

The working principle
The CPU heat sink base is in direct contact with the CPU. The CPU transfers heat to the heat sink base through silicon grease, and then the base transfers heat to the cooling fin through the heat conduction device, and the heat from the cooling fin is blown away by the fan.

Thermal conductive device

1. Pure copper, pure aluminum: this mode of heat conduction is the lowest efficiency, but the price is relatively cheap, low-end heat sink and some original heat sinks are using this method.
2. Heat pipe: heat pipe is the most commonly used method at present. The middle of the pipe is empty and filled with heat-conducting liquid, which absorbs heat and evaporates.
   3, Water: in fact, is water cooling, water cooling is frankly a kind of wind cooling, water cooling pipe longer, and the liquid inside the heat conduction ability is stronger, liquid does not evaporate, directly in the pipe flow, and then take away heat.

Type of heat sink

1. Passive cooling: this is a fanless cooling device that relies on the flow of air to take away heat without any noise. However, the cooling effect is very poor, so it only appears in some thin and light laptops with poor performance.
   2, Pressure cooling: fan blowing downward, can heat the CPU, motherboard, memory, but heat dissipation effect is not good, will disturb the air duct in the chassis, so it is suitable for the computer with little heat, and pressure radiator volume is small, so generally used in small chassis.
   3, Tower cooling: tower cooling is like tower, very large, one-way blowing, fins and fans are large, heat dissipation performance is the best, but only to the CPU heat dissipation, motherboard and memory cooling to the fan on the chassis.