景德镇市MedAccred _AC8121电子电缆和线束组件的审核标准 （46）

25.3 P- Is there a procedure for control of soldering tools / equipment including:

25.3.1 P- Selection and setup?YES/NO

25.3.2 P- Maintenance and periodic verification, including soldering iron tips for temperature?YES/NO

25.3.3 P- If required is the soldering system in calibration or verified?YES/NO/NA

Audit Note: Some soldering systems may require calibration.

25.4 P- Is there a procedure that defines the method of preventing cross contamination of solder alloys and fluxes?YES/NO

25.5 P- Is there a procedure to control solder pot contamination per the J- STD-001?YES/NO

25.6 P- Is there a procedure for cleanliness of soldered connections? YES/NO

25.7 P- If required, is there a procedure for shrink sleeving on soldered joints?YES/NO/NA

25.8 P- If no-clean flux is required, is there a procedure for its use and the subsequent inspection of joints soldered with it?YES/NO/NA

25.9 P- Is there a procedure that defines the cleaning method, chemical and maximum time permitted between hand soldering and cleaning for each flux chemistry and solder used?YES/NO/NA

Audit Note: NA refers to when Cleaning is not used.

25.10 P- Is there a process control in place to ensure solder cups have the wire(s) inserted to the full depth of the cup?YES/NO

Audit Note: It is a defect in IPC/WHMA-A-620 if the wire is not inserted to the full depth of the cup. However, this is not visually inspectable. It is determined through process control. For example, this may be controlled by using strip length.