许昌市MedAccred _AC8121电子电缆和线束组件的审核标准 （58）

30.3.3 P- When a conductive adhesive is required in the assembly process, does a procedure exist for testing that resulting conductive path is acceptable?YES/NO/NA

30.3.4 P- Is there a procedure to define and control the adhesive bonding of sleeves and boots to connector bodies, to include:

Audit Note: Some such assemblies contain boots with embedded or pre- applied adhesives. Question NA applies when sleeves and boots do not have adhesives.

30.3.4.1 P- Cleanliness requirements of parts to be adhered?YES/NO/NA

30.3.4.2 P- Shelf-life of materials to be used?YES/NO/NA

30.3.4.3 P- Mix ratios and method (including tools and wait times after mixing prior to use)?YES/NO/NA

30.3.4.4 P- Methods of adhesive application and removal?YES/NO/NA

30.3.4.5 P- Application and removal of temporary masking material?YES/NO/NA

30.3.4.6 P- Set up, configuration, and cleaning of tools, jigs, fixtures, nozzles, racks, etc.?YES/NO/NA

30.3.4.7 P- Calibration of gauges, scales, etc.?YES/NO/NA

30.3.4.8 P- Environmental control (humidity, temperature, Foreign Object Debris (FOD), ventilation, etc.) in room?YES/NO/NA

30.3.4.9 P- Set up, use, preventative maintenance, and calibration of curing ovens?YES/NO/NA

30.3.4.10 P- Cure times and temperatures?YES/NO/NA

30.3.4.11 P- Work time after mixing / pot life? YES/NO/NA

30.3.5 P- Is there a procedure for the acceptance criteria of cured adhesives used in the installation of sleeving and boots, including:

Audit Note: Question NA applies when sleeves and boots do not have adhesives.