目录 1.Tombstoning立碑 2.Solder bridge桥联 3.Component damaged 元件损坏 4.Misalignment偏位 5.Component lead lifted元件引脚翘高 6.Soder ball锡珠 7.Non-Wetting,Dewetting虚焊,半润湿 8.Cold soder冷焊 9.Solder hole锡洞 10.Disturbed Solder焊锡紊乱 11.Solder Projections锡尖 12.No Solder 无锡 13.Insufficient Solder少锡 14.Excess Solder多锡 15.Wrong Orientation反向,极性反 1.Tombstoning立碑 片式元件末端翘起。 2.Solder bridge桥联 3.Component damaged 元件损坏 4.Misalignment偏位 5.Component lead lifted元件引脚翘高 6.Soder ball锡珠 7.Non-Wetting,Dewetting虚焊,半润湿 8.Cold soder冷焊 9.Solder hole锡洞 10.Disturbed Solder焊锡紊乱 11.Solder Projections锡尖 12.No Solder 无锡 13.Insufficient Solder少锡 14.Excess Solder多锡 15.Wrong Orientation反向,极性反